JPS61234092A - ハンダ付け装置 - Google Patents
ハンダ付け装置Info
- Publication number
- JPS61234092A JPS61234092A JP25850784A JP25850784A JPS61234092A JP S61234092 A JPS61234092 A JP S61234092A JP 25850784 A JP25850784 A JP 25850784A JP 25850784 A JP25850784 A JP 25850784A JP S61234092 A JPS61234092 A JP S61234092A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- soldering iron
- pins
- liquid tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25850784A JPS61234092A (ja) | 1984-12-07 | 1984-12-07 | ハンダ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25850784A JPS61234092A (ja) | 1984-12-07 | 1984-12-07 | ハンダ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61234092A true JPS61234092A (ja) | 1986-10-18 |
| JPH021596B2 JPH021596B2 (enrdf_load_stackoverflow) | 1990-01-12 |
Family
ID=17321166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25850784A Granted JPS61234092A (ja) | 1984-12-07 | 1984-12-07 | ハンダ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61234092A (enrdf_load_stackoverflow) |
-
1984
- 1984-12-07 JP JP25850784A patent/JPS61234092A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021596B2 (enrdf_load_stackoverflow) | 1990-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3945961B2 (ja) | 回路基板 | |
| US5526974A (en) | Fine pitch electronic component placement method and apparatus | |
| SG106292G (en) | Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces | |
| JPS61234092A (ja) | ハンダ付け装置 | |
| JP2700259B2 (ja) | プリント配線板における凹所を有する半田層の形成方法 | |
| JPS6045094A (ja) | フラットパッケ−ジ型icの実装方法 | |
| JPH01194390A (ja) | フラットパッケージic実装装置 | |
| JPS62152153A (ja) | 回路基板におけるリ−ドピンの固着方法 | |
| JPS60163496A (ja) | 印刷回路基板 | |
| JPS6272473A (ja) | はんだ付装置 | |
| JPH01113172A (ja) | 半田付け装置 | |
| JPS57141934A (en) | Semiconductor device | |
| JPH0529364A (ja) | 半導体素子のボンデイング方法及び装置 | |
| JPS58111394A (ja) | 電子回路基板 | |
| JPS62224997A (ja) | フレキシブル基板用半田付け装置 | |
| JPH08204325A (ja) | 電子部品の高精度搭載方法 | |
| JPS6328096A (ja) | 混成集積回路のはんだ付組立方法 | |
| JPH0523871B2 (enrdf_load_stackoverflow) | ||
| JPS5874272A (ja) | 高密度配線のはんだ付方法 | |
| JP3214009B2 (ja) | 半導体素子の実装基板および方法 | |
| JPH071815Y2 (ja) | 回路配線板の冷却装置 | |
| JPS61253891A (ja) | 余分な残留はんだの除去方法 | |
| JPH0256989B2 (enrdf_load_stackoverflow) | ||
| JPH11214112A (ja) | 電子部品のはんだ付け装置およびその方法 | |
| JPH05136554A (ja) | プリント配線板のはんだ付け方法 |