JPS61210636A - Manufacture of ultra-fine pipe - Google Patents

Abstract

PURPOSE:To uniformize the cross-sectional shape of the fine hole in the longitudinal direction by forming a plating layer so as to cover the fine filament portion from above the conductive film which is exposed from a trench-shaped resist pattern, and removing the trench-shaped resist pattern. CONSTITUTION:By selectively exposing and developing the positive-type resist film 33 which is applied on the conductive film 32 formed on the surface of a substrate 31, a trench-shaped resist pattern film 34 is formed which contains a fine filament portion 34a in which the film thickness of the layer 33 is thin, and thereafter a metal layer 35 is plated and formed by means of the plating method so as to cover the filament portion 34a from above the conductive film 32 which is exposed from the film 34. Then, the film 34 including the filament portion 34a is removed, thereby obtaining an ultra-fine pipe 37 having a fine hole 36 formed in the portion from which the filament portion 34a was removed. This allows the cross-sectional shape of the fine hole 36 to be uniform in the longitudinal direction, and also allows various hole shapes.

Description

[Detailed Description of the Invention] [Summary] The present invention is a method for manufacturing ultrafine tubes applied to micro nozzles, etc., in which a resist film formed on a substrate together with a conductive film under plating is selectively exposed to light. Developed to form a groove-like resist pattern with fine linear portions inside,
A plating layer is formed on the conductive film exposed by the groove-like resist pattern to cover the fine line portion, and then the groove-like resist pattern including the fine line portion is removed, thereby forming a cross-sectional shape of the fine hole. can be modified in various ways, can be made constant in the length direction, and can be easily manufactured into bent or curved ultrafine tubes.

[Industrial application field]

The present invention relates to a method for manufacturing an ultra-fine tube that can be used in the fields of semiconductor integrated circuit elements, ultra-small analytical instruments, and micro nozzle tubes for injecting various gases, liquid particles, etc. The present invention relates to a method in which the cross-sectional shape of the tube can be made constant, and furthermore, it is possible to easily manufacture a bent or curved ultrafine tube.

In recent years, with the rapid progress of microfabrication technology in the manufacture of semiconductor integrated circuit elements, it has become possible to process patterns in the submicron range from 1 μm to even finer areas in patterning resist films and various other thin films. An ultrafine tube and its manufacturing method that can be used in fields such as semiconductor integrated circuits, small liquid chromatographs, gas chromatographs, or micro nozzles for ejecting various liquid particles by making full use of such processing technology has been disclosed in Japanese Patent Publication. Showa 59-5
6729 has already been proposed.

In such a method of manufacturing an ultrafine tube, it is difficult to make the cross-sectional shape of the microhole constant, or to bend or curve the ultrafine tube as necessary. There is a need for a manufacturing method in which the cross-sectional shape of the microholes is constant, and in which ultrafine tubes having the above-mentioned deformed shapes can be easily obtained.

[Conventional technology]

As shown in FIG. 4 (al), for example, a positive type first resist layer 2 is provided on the substrate 1, and the first resist A second resist layer 3 having lower exposure sensitivity than layer 2 is provided.

Next, the first. By exposing and developing the second resist layers 2 and 3 so as to leave two parallel lines, the first resist layer 2 with high exposure sensitivity is formed as shown in Figure 4 (bl). Two parallel resist members 4.5 are obtained in which a thin leg portion 6 and a thick head portion 7 formed in the second resist layer 3 with low exposure sensitivity are integrated on top of the thin leg portion 6.

As shown in FIG. 4fcl, both of these resist members 4.5 are bent inward and their mutual heads 7 are bonded to each other. A microtube 9 is obtained.

Further, as shown in FIG. 5 fal, a thin film layer 11 such as a metal layer or a dielectric layer is deposited on the ultrafine tube 9 made of the resist member described in FIG. 4 fil, and as shown in FIG. 5 fbl. As shown, a method is known in which an ultrafine tube 9 made of a resist member is dissolved and removed using an organic solvent or the like to form an ultrafine tube 1o made of a metal layer, a dielectric layer, or the like.

[Problem that the invention seeks to solve]

By the way, in the conventional manufacturing method of ultrafine tubes as described above,
When two parallel resist members 4 and 5 are bent inward and their respective heads 7 are bonded to each other as shown in FIG. 4(C), a tunnel-shaped fine hole 8 is formed. It is not easy to make the cross-sectional shape constant in the length direction, and not only does it require skill, but it also poses the problem that, for example, it is difficult to form an ultrafine tube with bent or curved micropores. be.

The present invention was made in view of the above problems.
The purpose is to make the cross-sectional shape of the microholes constant in the length direction, and to easily form ultrafine tubes with bent or curved microholes. An object of the present invention is to provide a manufacturing method.

[Means for solving problems]

The present invention utilizes a so-called mask plating method in which a plating layer is sewn onto a portion of a conductive film 22 formed on a substrate 21 exposed by a resist mask pattern film 23 as shown in FIG. 1 (C1). , the sewing growth of the plating layer is approximately isotropic, and as shown in FIG. 1 (dl), the plating layer 2
4 is sewn to be thicker than the resist mask pattern film 23, it grows not only in the layer thickness direction but also in the direction along the mask pattern film 23. (As shown in al., a positive resist film 33 is applied on the conductive film 32 formed on the surface of the substrate 31, and the resist film 33 is selectively exposed and developed to form a film of the resist layer 33 inside. After forming the groove-like resist pattern film 34 having the thin fine line portions 34a, the conductive film 32 exposed from the groove-like resist pattern film 34 is coated by plating to cover the fine line portions 34a. metal layer 3
5 is sewn and formed.

Thereafter, by removing the groove-like resist pattern film 34 including the fine line portions 34a, a superstructure with fine holes 36 formed in the removed portions of the fine line portions 34a is formed, as shown in FIG. It becomes possible to obtain fine tubes 37.

[For production]

In this way, the method of the present invention forms the portion where the microholes 36 are to be formed using a positive resist film, and by using the mask plating method, the cross-sectional shape of the microscopic holes 36 is constant in the length direction. In addition, various hole shapes can be formed, and ultrafine tubes having bent or curved fine holes can be easily formed.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a process diagram showing the first embodiment of the method for manufacturing an ultrafine tube according to the present invention in order of steps, and in the figure, fal to fdl are sectional views of essential parts, and tel is a perspective view.

First, as shown in FIG. 2, a base conductive film 32 for plating is deposited on a substrate 31 made of glass or ceramics by sputtering or the like, and a positive resist is further deposited on the base conductive film 32. After coating the film 33, the resist film 33 is applied to the first resist film 33 for forming both side walls of the ultrafine tube.
Primary exposure is performed using a photomask 38.

Next, as shown in FIG.
is partially exposed using a second photomask 39 for forming a soil wall of the same microtube, which is exposed with a higher exposure light amount, to a thickness of about z of the resist film 33; Further development is performed to form a groove-shaped resist pattern film 34 having inside the resist layer 33 fine linear portions 34a which are about 2 times thinner, as shown in FIG. 2 (C1).

Next, as shown in FIG. 2 (dl), electrolytic plating or electroless plating is applied to cover the base conductive film 32 exposed from the groove-like resist pattern film 34 and the fine linear portion 34a from above the base conductive film 32. A plating layer 35 made of copper (Cu), iron (Fe), nickel (Ni), or the like is formed by plating using a plating method or the like.

Thereafter, the groove-like resist pattern film 34 including the fine line portions 34a is selectively removed using a resist solution or the like, so that the cross-sectional shape of the thin fine line portions 34a is changed as shown in FIG. An ultra-fine tube 3 defined by and having a constant fine size 36 in its length direction
7 is obtained.

Note that the fine filament portions 34a can be effectively dissolved and removed by using an ultrasonic cleaning method in combination. Also, the base conductive film 32 for plating around the ultra-fine tube 37
If it is unnecessary, it can be easily removed by using an ion milling method, a spack etching method, or the like.

FIG. 3 is a process diagram showing the second embodiment of the method for manufacturing an ultrafine tube according to the present invention in the order of steps, and in the figure, fa) to (C1 are sectional views of main parts, and (dl is a perspective view).

In this embodiment, first, as shown in FIG. 3, a substrate 3L made of glass or ceramics, on which a base conductive film 32 for plating is formed by sputtering or the like, is coated.
After coating the positive resist I/film 33, it is possible to expose the resist film 33 by partially changing the amount of exposure light (transmitted light amount), for example, 50%, 70%, and 30%. The resist film 33 is exposed using a predetermined F1-mask 41.

Next, the resist film 33 is developed, and as shown in FIG. Grooved resist pattern film 42 having fine linear portions 42c
form.

Next, as shown in FIG. 3, electrolytic plating is applied to cover the base conductive film 32 exposed from the groove-like resist L-pattern film 42 and the fine linear portions 42a to 42c from above the base conductive film 32. A plating layer 43 made of copper (Cu), iron (Fe), nickel (Ni), or the like is formed by fracture bonding using a method such as a method or an electroless plating method.

Thereafter, by selectively removing the groove-like resist pattern film 42 including each of the fine linear portions 42a to 42c using a resist solution or the like, each of the fine linear portions 42a is removed as shown in FIG. 3 (dl). An ultra-fine tube 47 is obtained in which micro-holes 44, 45, and 46 are defined by the cross-sectional shapes of .

In this example, the resist lI? The exposure process is simplified by using a photomask 41 in which the amount of transmitted light for exposure is partially changed as a photomask that can be used to selectively expose i33.

〔Effect of the invention〕

As is clear from the above explanation, according to the method for manufacturing an ultrafine tube according to the present invention, the cross-sectional shape of the microhole can be varied in various ways, and the ultrafine tube can be easily manufactured with the cross-sectional shape of the microhole constant in the length direction. It becomes possible to form Furthermore, there is an excellent advantage that ultrafine tubes having bent or curved microholes or ultrafine tubes having microholes with a plurality of different hole shapes can be easily obtained.

Therefore, it can be applied to the manufacture of ultra-fine tubes used in various fields such as semiconductor integrated circuits, ultra-small sensors, highly integrated small-sized liquid chromatographs, gas chromatographs, and micro nozzles that spray various gases, liquid particles, etc. This is extremely advantageous.

[Brief explanation of drawings]

FIG. 1 is a diagram explaining the principle of the method for manufacturing an ultrafine tube according to the present invention, and FIG. 2 is a process diagram showing the first embodiment of the method for manufacturing an ultrafine tube according to the present invention in the order of steps. ,(a)~fd)
is a cross-sectional view of the main part, te+ is a perspective view, and FIG. , fd) is a perspective view, FIG. 4 is a process diagram illustrating one example of a conventional method for manufacturing ultrafine tubes, and FIG. 5 is a process diagram illustrating another example of a conventional method for manufacturing ultrafine tubes. be. 1 to 3, 31 is a substrate, 32 is a base conductive film for plating, 33 is a positive resist film, 34.42 is a grooved resist pattern film, 3
4a is a fine linear portion, 35, 43 is a plating layer, 36 is a fine hole, 37.47 is an ultrafine tube, 38 is a first photomask, 39 is a second photomask, 41 is a photomask, 42
A to 42c represent first to third fine linear portions, and 44 to 46 represent fine holes with different hole shapes, respectively. , + ha
＾OD 0 ℃ Φ” −〇
uC,. CD

Claims (1)

[Claims] A process of forming a conductive film (32) on a substrate (31), coating a positive resist film (33) on the conductive film (32), and selectively exposing and exposing the resist film (33). It is developed to form a groove-shaped resist pattern (34) which has fine linear portions (34a) thinner than the thickness of the resist film (33) inside.
) and the step of forming the grooved resist pattern (34).
forming a metal plating layer (35) on the exposed conductive film (32) so as to cover the fine line portion (34a); and a groove-shaped resist including the fine line portion (34a). A method for manufacturing an ultrafine tube, characterized in that an ultrafine tube is formed between the substrate (31) and the metal plating layer (35) by performing a step of removing the pattern (34).