JPS61207038U - - Google Patents
Info
- Publication number
- JPS61207038U JPS61207038U JP1985090600U JP9060085U JPS61207038U JP S61207038 U JPS61207038 U JP S61207038U JP 1985090600 U JP1985090600 U JP 1985090600U JP 9060085 U JP9060085 U JP 9060085U JP S61207038 U JPS61207038 U JP S61207038U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting structure
- soldered
- metal plate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 238000005553 drilling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090600U JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090600U JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61207038U true JPS61207038U (US07655688-20100202-C00010.png) | 1986-12-27 |
| JPH0739233Y2 JPH0739233Y2 (ja) | 1995-09-06 |
Family
ID=30645738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985090600U Expired - Lifetime JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739233Y2 (US07655688-20100202-C00010.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328087A (ja) * | 1999-03-24 | 2005-11-24 | Mitsubishi Materials Corp | パワーモジュール用基板 |
| JP2008277654A (ja) * | 2007-05-02 | 2008-11-13 | Mitsubishi Materials Corp | ヒートシンク付パワーモジュール用基板及びパワーモジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168135U (ja) * | 1982-05-06 | 1983-11-09 | 富士電機株式会社 | 半導体装置 |
| JPS59175131A (ja) * | 1983-03-24 | 1984-10-03 | Fuji Electric Co Ltd | 混成集積回路 |
-
1985
- 1985-06-14 JP JP1985090600U patent/JPH0739233Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168135U (ja) * | 1982-05-06 | 1983-11-09 | 富士電機株式会社 | 半導体装置 |
| JPS59175131A (ja) * | 1983-03-24 | 1984-10-03 | Fuji Electric Co Ltd | 混成集積回路 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328087A (ja) * | 1999-03-24 | 2005-11-24 | Mitsubishi Materials Corp | パワーモジュール用基板 |
| JP2008277654A (ja) * | 2007-05-02 | 2008-11-13 | Mitsubishi Materials Corp | ヒートシンク付パワーモジュール用基板及びパワーモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739233Y2 (ja) | 1995-09-06 |
