JPS61205138U - - Google Patents
Info
- Publication number
- JPS61205138U JPS61205138U JP1985089770U JP8977085U JPS61205138U JP S61205138 U JPS61205138 U JP S61205138U JP 1985089770 U JP1985089770 U JP 1985089770U JP 8977085 U JP8977085 U JP 8977085U JP S61205138 U JPS61205138 U JP S61205138U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor chip
- pedestal
- eaves
- overhanging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985089770U JPS61205138U (US06272168-20010807-M00014.png) | 1985-06-14 | 1985-06-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985089770U JPS61205138U (US06272168-20010807-M00014.png) | 1985-06-14 | 1985-06-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61205138U true JPS61205138U (US06272168-20010807-M00014.png) | 1986-12-24 |
Family
ID=30644162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985089770U Pending JPS61205138U (US06272168-20010807-M00014.png) | 1985-06-14 | 1985-06-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61205138U (US06272168-20010807-M00014.png) |
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1985
- 1985-06-14 JP JP1985089770U patent/JPS61205138U/ja active Pending