JPS61197692U - - Google Patents

Info

Publication number

JPS61197692U

JPS61197692U JP8264885U JP8264885U JPS61197692U JP S61197692 U JPS61197692 U JP S61197692U JP 8264885 U JP8264885 U JP 8264885U JP 8264885 U JP8264885 U JP 8264885U JP S61197692 U JPS61197692 U JP S61197692U

Authority

JP

Japan

Prior art keywords

lead wire

electronic component

heat

connection portion

shrinkable tube

Prior art date

1985-05-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• 239000000853 adhesive Substances 0.000 claims 1
• 230000001070 adhesive effect Effects 0.000 claims 1
• 239000003795 chemical substances by application Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 3
• 239000012790 adhesive layer Substances 0.000 description 2
• 238000000034 method Methods 0.000 description 1

Cited By (1)