JPS61195179A - 異方導電性接着シ−ト - Google Patents

異方導電性接着シ−ト

Info

Publication number
JPS61195179A
JPS61195179A JP60035776A JP3577685A JPS61195179A JP S61195179 A JPS61195179 A JP S61195179A JP 60035776 A JP60035776 A JP 60035776A JP 3577685 A JP3577685 A JP 3577685A JP S61195179 A JPS61195179 A JP S61195179A
Authority
JP
Japan
Prior art keywords
synthetic resin
resin layer
adhesive sheet
conductive adhesive
anisotropically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60035776A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527668B2 (enrdf_load_stackoverflow
Inventor
Kazuyuki Shimada
和之 嶋田
Takafumi Kashiwagi
隆文 柏木
Yoshikazu Ishikawa
嘉一 石川
Koji Tanaka
孝司 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SURIIBONDO KK
ThreeBond Co Ltd
Panasonic Holdings Corp
Original Assignee
SURIIBONDO KK
ThreeBond Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SURIIBONDO KK, ThreeBond Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical SURIIBONDO KK
Priority to JP60035776A priority Critical patent/JPS61195179A/ja
Publication of JPS61195179A publication Critical patent/JPS61195179A/ja
Publication of JPH0527668B2 publication Critical patent/JPH0527668B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
JP60035776A 1985-02-25 1985-02-25 異方導電性接着シ−ト Granted JPS61195179A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60035776A JPS61195179A (ja) 1985-02-25 1985-02-25 異方導電性接着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60035776A JPS61195179A (ja) 1985-02-25 1985-02-25 異方導電性接着シ−ト

Publications (2)

Publication Number Publication Date
JPS61195179A true JPS61195179A (ja) 1986-08-29
JPH0527668B2 JPH0527668B2 (enrdf_load_stackoverflow) 1993-04-21

Family

ID=12451290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60035776A Granted JPS61195179A (ja) 1985-02-25 1985-02-25 異方導電性接着シ−ト

Country Status (1)

Country Link
JP (1) JPS61195179A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
EP0893484A3 (en) * 1997-07-24 1999-07-21 Sony Chemicals Corporation Multilayer anisotropic electroconductive adhesive and method for manufacturing same
US6835274B2 (en) * 1998-08-03 2004-12-28 Sony Corporation Electrical connecting device and electrical connecting method
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法
JP2007182062A (ja) * 2006-01-04 2007-07-19 Ls Cable Ltd 多層異方性導電フィルム
WO2007125993A1 (ja) * 2006-04-27 2007-11-08 Asahi Kasei Emd Corporation 導電粒子配置シート及び異方導電性フィルム
JP2008034232A (ja) * 2006-07-28 2008-02-14 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
JPWO2007123003A1 (ja) * 2006-04-12 2009-09-03 日立化成工業株式会社 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
WO2010010743A1 (ja) * 2008-07-22 2010-01-28 シャープ株式会社 電子回路装置、その製造方法及び表示装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
EP0893484A3 (en) * 1997-07-24 1999-07-21 Sony Chemicals Corporation Multilayer anisotropic electroconductive adhesive and method for manufacturing same
US6020059A (en) * 1997-07-24 2000-02-01 Sony Chemicals Corporation Multilayer anisotropic electroconductive adhesive and method for manufacturing same
US6835274B2 (en) * 1998-08-03 2004-12-28 Sony Corporation Electrical connecting device and electrical connecting method
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法
JP2007182062A (ja) * 2006-01-04 2007-07-19 Ls Cable Ltd 多層異方性導電フィルム
JPWO2007123003A1 (ja) * 2006-04-12 2009-09-03 日立化成工業株式会社 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
JP4775377B2 (ja) * 2006-04-12 2011-09-21 日立化成工業株式会社 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法
WO2007125993A1 (ja) * 2006-04-27 2007-11-08 Asahi Kasei Emd Corporation 導電粒子配置シート及び異方導電性フィルム
US8247701B2 (en) 2006-04-27 2012-08-21 Asahi Kasei Emd Corporation Electroconductive particle placement sheet and anisotropic electroconductive film
JP2008034232A (ja) * 2006-07-28 2008-02-14 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
WO2010010743A1 (ja) * 2008-07-22 2010-01-28 シャープ株式会社 電子回路装置、その製造方法及び表示装置

Also Published As

Publication number Publication date
JPH0527668B2 (enrdf_load_stackoverflow) 1993-04-21

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