JPS611892U - Heat sink structure - Google Patents
Heat sink structureInfo
- Publication number
- JPS611892U JPS611892U JP8625584U JP8625584U JPS611892U JP S611892 U JPS611892 U JP S611892U JP 8625584 U JP8625584 U JP 8625584U JP 8625584 U JP8625584 U JP 8625584U JP S611892 U JPS611892 U JP S611892U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- sink structure
- conductor
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の発熱部品取付放熱板の使用例を示す斜視
図、第2図a, b, cは従来の放熱板の構造を示す
平面図、正面図、側面図、第3図は本考案による放熱板
の一実施例の使用例を示す斜視図、第4図a, b,
cは本考案による放熱板の一実施例の構造を示す平面図
、正面図、側面図である。
1・・・・・・印刷配線板、2・・・・・・板状の放熱
板、3・・・・・・T型形状の放熱板、4・・・・・・
発熱電子部品、5・・・・・・筒状の放熱板。Figure 1 is a perspective view showing an example of the use of a conventional heat sink with heat-generating components attached; Figures 2 a, b, and c are plan views, front views, and side views showing the structure of a conventional heat sink; Figure 3 is an illustration of a book. A perspective view showing an example of the use of an embodiment of the invented heat sink, FIGS. 4a and 4b,
3C is a plan view, a front view, and a side view showing the structure of an embodiment of a heat sink according to the present invention. 1... Printed wiring board, 2... Plate-shaped heat sink, 3... T-shaped heat sink, 4...
Heat-generating electronic components, 5... Cylindrical heat sink.
Claims (1)
発熱電子部品が固定される板状の熱伝導体と、該熱伝導
体の熱を伝えるべく前記熱伝導体と一体化された筒状の
放熱板とによって形成されることを特徴とした放熱板の
構造。A heat sink structure for attaching heat generating electronic components includes a plate-shaped heat conductor to which a plurality of heat generating electronic components are fixed, and a cylindrical heat radiator integrated with the heat conductor to transfer heat from the heat conductor. A structure of a heat sink characterized by being formed by a plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8625584U JPS611892U (en) | 1984-06-11 | 1984-06-11 | Heat sink structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8625584U JPS611892U (en) | 1984-06-11 | 1984-06-11 | Heat sink structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS611892U true JPS611892U (en) | 1986-01-08 |
Family
ID=30637391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8625584U Pending JPS611892U (en) | 1984-06-11 | 1984-06-11 | Heat sink structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS611892U (en) |
-
1984
- 1984-06-11 JP JP8625584U patent/JPS611892U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS611892U (en) | Heat sink structure | |
JPS6022841U (en) | radiator | |
JPS5995690U (en) | Automotive control circuit unit | |
JPS6018550U (en) | Heat dissipation structure | |
JPS587396U (en) | Circuit board for heat generating parts | |
JPS5993170U (en) | Mounting structure of flat package IC | |
JPS6039295U (en) | printed wiring board | |
JPS59181753U (en) | thermal printer head | |
JPS58168146U (en) | Mounting structure of heat sink | |
JPS5950444U (en) | Power IC mounting structure | |
JPS5929095U (en) | electronic equipment | |
JPS58155897U (en) | printed wiring device | |
JPS601087U (en) | Speaker box back panel heatsink | |
JPS5834744U (en) | Power diode mounting structure | |
JPS58127780U (en) | speaker holder | |
JPS59138259U (en) | Manufacturing method of printed circuit board with heatsink | |
JPS60172365U (en) | Printed circuit board wiring structure | |
JPS60118247U (en) | Heat dissipation device for electronic equipment | |
JPS60176017U (en) | floor heating panel | |
JPS58135950U (en) | Fixed structure of IC heatsink | |
JPS60167395U (en) | printed wiring board equipment | |
JPS58114047U (en) | Semiconductor device mounting structure | |
JPS58147295U (en) | Heatsink for printed board mounting | |
JPS5944051U (en) | semiconductor equipment | |
JPS59128742U (en) | Heating element mounting device |