JPS61183913A - Laminate capacitor - Google Patents

Laminate capacitor

Info

Publication number
JPS61183913A
JPS61183913A JP60024251A JP2425185A JPS61183913A JP S61183913 A JPS61183913 A JP S61183913A JP 60024251 A JP60024251 A JP 60024251A JP 2425185 A JP2425185 A JP 2425185A JP S61183913 A JPS61183913 A JP S61183913A
Authority
JP
Japan
Prior art keywords
laminate capacitor
laminate
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60024251A
Other languages
Japanese (ja)
Inventor
Yoshimasa Kugutsu
Tomoaki Ushiro
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Priority to JP60024251A priority Critical patent/JPS61183913A/en
Publication of JPS61183913A publication Critical patent/JPS61183913A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/145Organic dielectrics vapour deposited
JP60024251A 1985-02-08 1985-02-08 Laminate capacitor Pending JPS61183913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60024251A JPS61183913A (en) 1985-02-08 1985-02-08 Laminate capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60024251A JPS61183913A (en) 1985-02-08 1985-02-08 Laminate capacitor

Publications (1)

Publication Number Publication Date
JPS61183913A true JPS61183913A (en) 1986-08-16

Family

ID=12133025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60024251A Pending JPS61183913A (en) 1985-02-08 1985-02-08 Laminate capacitor

Country Status (1)

Country Link
JP (1) JPS61183913A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151030A (en) * 1992-11-07 1994-05-31 Kanegafuchi Chem Ind Co Ltd Earthing structure and earthing method for laminated heat insulating member
WO1998041999A1 (en) * 1997-03-17 1998-09-24 Matsushita Electric Industrial Co., Ltd. Electronic component
WO1999026260A1 (en) * 1997-11-18 1999-05-27 Matsushita Electric Industrial Co., Ltd. Laminate and capacitor
WO1999026259A1 (en) * 1997-11-18 1999-05-27 Matsushita Electric Industrial Co., Ltd. Laminate, capacitor, and method for producing laminate
JP2002033236A (en) * 2000-07-13 2002-01-31 Matsushita Electric Ind Co Ltd Chip-type electronic component
US7316755B2 (en) * 2003-09-29 2008-01-08 Murata Manufacturing Co., Ltd. Method of producing multi-terminal type laminated ceramic electronic component
US7319582B2 (en) 2004-06-03 2008-01-15 Murata Manufacturing Co., Ltd. Multilayer capacitor and method of manufacturing the same
US7394643B2 (en) 2005-01-31 2008-07-01 Tdk Corporation Laminated electronic component
JP2009188122A (en) * 2008-02-05 2009-08-20 Tdk Corp Multilayered capacitor
US20120229952A1 (en) * 2011-03-09 2012-09-13 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
JP2014103371A (en) * 2012-11-20 2014-06-05 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor, circuit board packaging structure of multilayer ceramic capacitor, and packaging body of multilayer ceramic capacitor
US20170084396A1 (en) * 2002-04-15 2017-03-23 Avx Corporation Plated terminations

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2689833B2 (en) * 1992-11-07 1997-12-10 鐘淵化学工業株式会社 Grounding method for laminated insulation
JPH06151030A (en) * 1992-11-07 1994-05-31 Kanegafuchi Chem Ind Co Ltd Earthing structure and earthing method for laminated heat insulating member
US6195249B1 (en) 1997-03-17 2001-02-27 Matsushita Electric Industrial Co., Ltd. Electronic component having gaps between conductive thin films
WO1998041999A1 (en) * 1997-03-17 1998-09-24 Matsushita Electric Industrial Co., Ltd. Electronic component
US6838153B2 (en) 1997-11-18 2005-01-04 Matsushita Electric Industrial Co., Ltd. Layered product, capacitor and a method for producing the layered product
EP1041590A1 (en) * 1997-11-18 2000-10-04 Matsushita Electric Industrial Co., Ltd. Laminate and capacitor
WO1999026259A1 (en) * 1997-11-18 1999-05-27 Matsushita Electric Industrial Co., Ltd. Laminate, capacitor, and method for producing laminate
WO1999026260A1 (en) * 1997-11-18 1999-05-27 Matsushita Electric Industrial Co., Ltd. Laminate and capacitor
US6388865B1 (en) 1997-11-18 2002-05-14 Matsushita Electric Industrial Co., Ltd. Laminate and capacitor
US6577493B2 (en) 1997-11-18 2003-06-10 Matsushita Electric Industrial Co., Ltd. Layered product and capacitor
US6576523B1 (en) 1997-11-18 2003-06-10 Matsushita Electric Industrial Co., Ltd. Layered product, capacitor and a method for producing the layered product
US6611420B2 (en) 1997-11-18 2003-08-26 Matsushita Electric Industrial Co., Ltd. Layered product and capacitor
US6704190B2 (en) 1997-11-18 2004-03-09 Matsushita Electric Industrial Co., Ltd. Layered product and capacitor
US6710997B2 (en) 1997-11-18 2004-03-23 Matsushita Electric Industrial Co., Ltd. Layered product and capacitor
EP1041590A4 (en) * 1997-11-18 2004-09-22 Matsushita Electric Ind Co Ltd Laminate and capacitor
US6879481B2 (en) 1997-11-18 2005-04-12 Matsushita Electric Industrial Co., Ltd. Layered product and capacitor
JP2002033236A (en) * 2000-07-13 2002-01-31 Matsushita Electric Ind Co Ltd Chip-type electronic component
JP4581194B2 (en) * 2000-07-13 2010-11-17 パナソニック株式会社 Chip-type electronic components
US20170084396A1 (en) * 2002-04-15 2017-03-23 Avx Corporation Plated terminations
US10366835B2 (en) 2002-04-15 2019-07-30 Avx Corporation Plated terminations
US9666366B2 (en) 2002-04-15 2017-05-30 Avx Corporation Method of making multi-layer electronic components with plated terminations
US10020116B2 (en) * 2002-04-15 2018-07-10 Avx Corporation Plated terminations
US7316755B2 (en) * 2003-09-29 2008-01-08 Murata Manufacturing Co., Ltd. Method of producing multi-terminal type laminated ceramic electronic component
US7319582B2 (en) 2004-06-03 2008-01-15 Murata Manufacturing Co., Ltd. Multilayer capacitor and method of manufacturing the same
US7394643B2 (en) 2005-01-31 2008-07-01 Tdk Corporation Laminated electronic component
JP2009188122A (en) * 2008-02-05 2009-08-20 Tdk Corp Multilayered capacitor
US10431379B2 (en) 2011-03-09 2019-10-01 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing a multilayer ceramic capacitor
US9196422B2 (en) * 2011-03-09 2015-11-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor having high capacity and method of manufacturing the same
US9779873B2 (en) 2011-03-09 2017-10-03 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing multilayer ceramic capacitor having groove portion on top and/or bottom surface
US20120229952A1 (en) * 2011-03-09 2012-09-13 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
JP2018085517A (en) * 2012-11-20 2018-05-31 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor
JP2014103371A (en) * 2012-11-20 2014-06-05 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor, circuit board packaging structure of multilayer ceramic capacitor, and packaging body of multilayer ceramic capacitor
US9099249B2 (en) 2012-11-20 2015-08-04 Samsung Electro-Mechanics Co., Ltd. Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor

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