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Priority to JP1985052747UpriorityCriticalpatent/JPS61171247U/ja
Publication of JPS61171247UpublicationCriticalpatent/JPS61171247U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
H01L2224/10175—Flow barriers
Landscapes
Wire Bonding
(AREA)
Containers, Films, And Cooling For Superconductive Devices
(AREA)