JPS61171247U - - Google Patents
Info
- Publication number
- JPS61171247U JPS61171247U JP1985052747U JP5274785U JPS61171247U JP S61171247 U JPS61171247 U JP S61171247U JP 1985052747 U JP1985052747 U JP 1985052747U JP 5274785 U JP5274785 U JP 5274785U JP S61171247 U JPS61171247 U JP S61171247U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- substrate
- mounting
- thermal conductivity
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
Landscapes
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052747U JPS61171247U (US06724976-20040420-M00002.png) | 1985-04-11 | 1985-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052747U JPS61171247U (US06724976-20040420-M00002.png) | 1985-04-11 | 1985-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171247U true JPS61171247U (US06724976-20040420-M00002.png) | 1986-10-24 |
Family
ID=30572970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985052747U Pending JPS61171247U (US06724976-20040420-M00002.png) | 1985-04-11 | 1985-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171247U (US06724976-20040420-M00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270511A (ja) * | 2007-04-20 | 2008-11-06 | Denso Corp | 電子装置 |
-
1985
- 1985-04-11 JP JP1985052747U patent/JPS61171247U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270511A (ja) * | 2007-04-20 | 2008-11-06 | Denso Corp | 電子装置 |
