JPS61171010U - - Google Patents

Info

Publication number
JPS61171010U
JPS61171010U JP5523985U JP5523985U JPS61171010U JP S61171010 U JPS61171010 U JP S61171010U JP 5523985 U JP5523985 U JP 5523985U JP 5523985 U JP5523985 U JP 5523985U JP S61171010 U JPS61171010 U JP S61171010U
Authority
JP
Japan
Prior art keywords
hole
optical fibers
tapered
injection molding
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5523985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5523985U priority Critical patent/JPS61171010U/ja
Publication of JPS61171010U publication Critical patent/JPS61171010U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は実施例の斜視図、第2図はだ円―円型
テーパ状貫通孔を有する実施例の部分断面斜視図
、第3図は円錐型テーパ状貫通孔を有する実施例
の部分断面斜視図、第4図は括れ部を有するだ円
―円型テーパ状貫通孔を有する実施例の斜視図で
ある。 1:プラスチツク基板、2:テーパ状貫通孔。
Fig. 1 is a perspective view of an embodiment, Fig. 2 is a partial cross-sectional perspective view of an embodiment having an elliptical-circular tapered through hole, and Fig. 3 is a partial cross section of an embodiment having a conical tapered through hole. FIG. 4 is a perspective view of an embodiment having an oval-circular tapered through hole with a constricted portion. 1: Plastic substrate, 2: Tapered through hole.

Claims (1)

【実用新案登録請求の範囲】 1 内部に光フアイバ接続用のテーパ状貫通孔を
有するプラスチツク基板からなり、前記貫通孔の
大口径側が少なくとも2本の光フアイバを受入れ
うることを特徴とする光分岐・結合用基板。 2 射出成形方式で形成されてなる請求の範囲第
1項記載の基板。
[Claims for Utility Model Registration] 1. An optical branch comprising a plastic substrate having a tapered through hole therein for connecting optical fibers, the large diameter side of the through hole being capable of receiving at least two optical fibers.・Bonding board. 2. The substrate according to claim 1, which is formed by injection molding.
JP5523985U 1985-04-12 1985-04-12 Pending JPS61171010U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5523985U JPS61171010U (en) 1985-04-12 1985-04-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5523985U JPS61171010U (en) 1985-04-12 1985-04-12

Publications (1)

Publication Number Publication Date
JPS61171010U true JPS61171010U (en) 1986-10-23

Family

ID=30577725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5523985U Pending JPS61171010U (en) 1985-04-12 1985-04-12

Country Status (1)

Country Link
JP (1) JPS61171010U (en)

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