JPS61168067U - - Google Patents
Info
- Publication number
- JPS61168067U JPS61168067U JP5193385U JP5193385U JPS61168067U JP S61168067 U JPS61168067 U JP S61168067U JP 5193385 U JP5193385 U JP 5193385U JP 5193385 U JP5193385 U JP 5193385U JP S61168067 U JPS61168067 U JP S61168067U
- Authority
- JP
- Japan
- Prior art keywords
- flange
- bonding wire
- main body
- spool
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001593 boehmite Inorganic materials 0.000 claims description 2
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5193385U JPS61168067U (US06650917-20031118-M00005.png) | 1985-04-08 | 1985-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5193385U JPS61168067U (US06650917-20031118-M00005.png) | 1985-04-08 | 1985-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168067U true JPS61168067U (US06650917-20031118-M00005.png) | 1986-10-18 |
Family
ID=30571425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5193385U Pending JPS61168067U (US06650917-20031118-M00005.png) | 1985-04-08 | 1985-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168067U (US06650917-20031118-M00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513494A (ja) * | 1991-07-03 | 1993-01-22 | Kaijo Corp | ワイヤボンデイング装置のカセツト式ワイヤ供給装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50105522A (US06650917-20031118-M00005.png) * | 1974-01-30 | 1975-08-20 | ||
| JPS5184746A (ja) * | 1975-01-22 | 1976-07-24 | Toa Paint Co Ltd | Aruminiumumatahaaruminiumugokinnotososhitajishorihoho |
| JPS51106647A (en) * | 1975-03-17 | 1976-09-21 | Nippon Paint Co Ltd | Aruminiumuzaino tosohoho |
-
1985
- 1985-04-08 JP JP5193385U patent/JPS61168067U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50105522A (US06650917-20031118-M00005.png) * | 1974-01-30 | 1975-08-20 | ||
| JPS5184746A (ja) * | 1975-01-22 | 1976-07-24 | Toa Paint Co Ltd | Aruminiumumatahaaruminiumugokinnotososhitajishorihoho |
| JPS51106647A (en) * | 1975-03-17 | 1976-09-21 | Nippon Paint Co Ltd | Aruminiumuzaino tosohoho |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513494A (ja) * | 1991-07-03 | 1993-01-22 | Kaijo Corp | ワイヤボンデイング装置のカセツト式ワイヤ供給装置 |
