JPS61164070U - - Google Patents

Info

Publication number

JPS61164070U

JPS61164070U JP4794285U JP4794285U JPS61164070U JP S61164070 U JPS61164070 U JP S61164070U JP 4794285 U JP4794285 U JP 4794285U JP 4794285 U JP4794285 U JP 4794285U JP S61164070 U JPS61164070 U JP S61164070U

Authority

JP

Japan

Prior art keywords

conductive material

circuit board

mounting hole

base member

flexible circuit

Prior art date

1985-03-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims 3
• 230000003014 reinforcing effect Effects 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000002787 reinforcement Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000002345 surface coating layer Substances 0.000 description 1