JPS6114827A - Device for conveying and positioning printed circuit board - Google Patents

Abstract

PURPOSE:To enable printed circuit boards with various shapes to be automatically conveyed, by allowing the exchange of articles to be effected in a short period of time only with the exchange of a carrier, a nest, and a retainer. CONSTITUTION:The captioned device, upon being employed as a wire bonding device for a semiconductor printed circuit board 4, comprises a plurality of carriers 11,..., a magazine device 12 having said carriers housed therein, a magazine drive mechanism 13, a conveyor device 14, a nest device 15, a nest drive mechanism 16, and a pushing mechanism 17. In addition, the device 12 includes magazines 35, 36 elevatably mounted on both ends of the conveyor device 14. Then, upon exchanging articles, only the carrier 11 and the nest pushing body may be exchanged to enable the articles to be exchanged in a short period of time. With this arrangement, printed circuit boards with various shapes can be automatically conveyed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a circuit board transport and positioning apparatus suitable for assembly apparatuses such as wire bonding apparatuses and chip mounting apparatuses in the manufacturing process of semiconductor devices.

[Technical background of the invention and its problems]

Figure 11 shows an example of a circuit board for a semiconductor device.
Circuit board (4) with various parts (2) mounted on top of (1)
), a semiconductor component (5) is manufactured by wire bonding with thin metal wires (3), . . . , and leads (6), .
extends downward. Semiconductor assembly equipment such as wire bonding equipment and chip mounting equipment is generally used in these assembly processes. Figure 12 (a) - (
As shown in f), there are various types of circuit boards.

Recently, it has been desired to increase the speed of this type of assembly equipment, but as shown in Figure 1, the types of products are becoming more and more diverse, and there is a demand for assembly equipment suitable for high-mix, low-volume production. For some varieties, supply is provided by JP-A-57-2060.
No. 95 "Automatic dimension adjustment device".

Although automatic transport devices such as the "Sample Positioning Device" in Utility Model Application Publication No. 57-186033 have been put into practical use, most of them currently rely on human hands, unlike conventional circuit boards. Although the supply is good for changing over a wide variety of products, it is inefficient.

In addition, the above-mentioned automatic conveyance device that only handles products with a specific shape has the disadvantage that it cannot handle products with other shapes.However, there is a need for a highly efficient circuit board transport and positioning device that can easily change the product type. It was requested.

[Purpose of the invention]

An object of the present invention is to provide a circuit board transport and positioning device that can automatically transport circuit boards of various shapes by simply replacing parts.

[Summary of the invention]

In the present invention, the circuit board is carried on a carrier, and this carrier is replaced depending on the product, but the outer dimensions of the carrier itself are always set to the same, and the multi-circuit board is supported on the carrier. The stacked materials are stored in a magazine, transported to a working position 1, for example, a position for wire bonding, and lifted by a nest and elastically pressed by a presser body that is tilted upward to elastically position and hold the materials to perform the desired processing. With this circuit board transport and positioning device, the external dimensions of the carrier can be kept constant.The K-Yoshi transfer device, etc. is common, and it is possible to change types in a short time by simply replacing the carrier, nest, and retainer. It has been made possible.

[Embodiments of the invention]

The details of the present invention will be explained below with reference to an embodiment shown in FIGS. 1 to 10. This embodiment is applied to a wire bonding apparatus for a semiconductor circuit board (4) having the shape shown in FIG. Figures 1 and 2 show the overall configuration of this embodiment, which includes a plurality of carriers αυ,..., a magazine device α that accommodates them, and a magazine drive mechanism U.
The conveying device α is composed of a nesting device (19), a nest driving mechanism ae, and a holding mechanism aη. Note that (11 is a working position, a preheating position eyelid, and a wire bonding position).

01), but the wire bonding head is not shown.

Next, each part will be explained. As shown in FIG. 7, the carrier αη has a rectangular plate member (c) with two square through holes (c) slightly larger than the circuit board (4).

Support portions (5), . . . are formed at each of the four corners to protrude inward from the peripheral edge of the through hole. These support parts (5
) is constructed by attaching a support plate (2) with a recess cut out at a corner to a support plate (2) formed by extending inward at the four corners of a through hole (C). ing. The circuit board (4) is supported at its four corners by support plates (to), and is restrained from front to back and left and right by recesses, that is, it can be detached upwardly and is approximately positioned relative to the rectangular plate-like member (c). It is supported in a state where The carrier (11J) has its through hole (c) and support portion (5) different depending on the size and shape of the circuit board (4), but its external dimensions a and b are all set to be the same.

The magazine device Q is composed of one magazine (to) and the other magazine (to), which are attached to both ends of a conveyance device (1) so as to be able to move up and down.

These are both side walls (to) of the frame body Gη formed in an inverted U shape.
, ＠, opposing support grooves ■ are provided at a certain pitch.

A plurality of the carriers (11) described above are stacked and housed at a distance, and the left side (right side) of these carriers αυ
stop bin (41) to prevent unwanted movement to
.

(6) are installed through the top and bottom. One magazine (G) is on the supply side for the carrier αυ supporting the circuit board (4), and the other magazine (To) is on the storage side for the processed carrier (+1).

The magazine drive mechanism consists of one lifting mechanism 09 and the other lifting mechanism (09) provided corresponding to each magazine (to) and (to).
It consists of an arm (4') that protrudes from it.
l), hs allows one magazine (up to), CIQij to be lowered or raised. Both lifting mechanisms (a,
Although details are not shown in (46), a nut that prevents one rotation and is movable up and down is fitted to the feed screw shaft that is rotated by the motor, and the arms h7) and hs
is attached, and as the motor rotates by a predetermined amount, the magazines are lowered or raised one pitch at a time. Rotation by a predetermined amount is performed by detecting the amount of movement of the arm using a photoelectric sensor.

The conveyance device (14) attaches the supply side mormel to the bracket 61) fixed to the base plate IGK, and thereby,
Supply conveyor (to) that pulls out the carrier (Iυ) from V-gazine (to) and 1 working position (a), carrier 6 sequentially to 6D
1g1 storage conveyor (to) and the second storage conveyor 6.
It is supposed to drive the car. Furthermore, guide plates 6η, 12 are attached to both sides of the conveyor (b), and the nest drive mechanism aυ [J electromagnet and this A first stopper Is and a second stopper consisting of a retractable stop bin are attached. And the magazine (
The carrier (11) placed on the supply conveyor Q is sent in the direction of the arrow by the descent of the carrier (11), and is then carried on the conveyor and sent to the preheated positron by the first stopper. Stop at (a). Further, the carrier (l) located at the preheating position (4) is stopped at the position of the wire bonding position Qυ by the second stopper body. Also, the carrier aυ located at the wire bonding body υ is the first receiving conveyor (c).

It is sent into the magazine by the second storage conveyor (5), supported by the support groove (2), and stopped at a predetermined position along the stop bin (6) K.

Next, the nest device (151) will be explained. As shown in FIGS. 3, 5, and 6, this device consists of a nest σD and a heating element 0 floor which has a heating element σ2 built therein.

As shown in FIG. 8, the nest συ is formed with an uneven portion corresponding to the shape of the carrier 602 circuit board (4).

A mounting surface (2) with a flat upper surface, U! 9 is a carrier (protrudingly provided so as to be insertable into the through hole (1) of Iυ).

Grooves σQ and σE9 provided on the mounting surfaces σX and σ9. (77),
e/η is for receiving a reel 5) extending protruding from the bottom surface of the circuit board (4). In addition, the mounting surfaces ff4), ff5)K are provided with 12 positioning bottles (7 barrels, . . . ) is positioned.A heating element a3 is closely attached to the lower surface of this nest σD, and the nest συ is heated5, thereby also heating the circuit board (4).

In this embodiment, the nests συ are provided at two locations: the preheating position wire and the wire bonding position (CHI), and both have similar shapes and dimensions.

Only the heating temperature is different.

Next, the nest drive mechanism αQ will be explained. FIG. 1 shows the overall configuration, and FIGS. 3 to 6 show cross sections of important parts. υ of the guide bracket standing upright on the base plate 60
is provided with guide grooves (A) on both the front and back sides.
@3 is formed. In the guide groove, a support member @a having a cross-sectional shape is guided and supported so as to be movable up and down, and a support plate is attached to the upper surface of the support member @a, which extends over the entire working position 0. There is. And on top of this is a pillar (
The nesting device (1!19 force) is attached to the top of the nest device (1!19 force) through the support (goods).

is provided with a lifting bracket (c), on which the lifting screw (to) is rotatably supported upright, and the lifting body (c) is fitted into this bracket (c). In addition, two guide rods I9υ with flanges are planted and fixed downward on the support body K, and the above-mentioned elevating body (A) is slidably fitted into these, and A compression spring body 02 is interposed between the support body (b) and the elevating body, so that the support body is always biased upward with respect to the elevating body (4).

Furthermore, a lifting motor is provided on the side of the lifting bracket (goods), and the rotation of this motor is transmitted to the lifting screw via a belt and a pulley, and this rotation drives the lifting body up and down. The vertical movement raises and lowers the support via the compression spring body.

The upper limit of this is regulated by a stopper plate attached to the upper part of the guide bracket @υ.

Next, the holding mechanism will be explained. This is the circuit board (4
), a plate-shaped holding body (101) facing above, a vertical movement block (102), a holding spring body (103), and a strike plate.

It is composed of a par support (104). Suppressing body (1
01), as shown in Fig. 9 (reduced), a rectangular plate-like member (106) has through holes (107) and (108) slightly larger than the circuit board (4). ,
These are preheating position wire and wire bonding position W7G! Each faces υ. These through holes (107)
.

Eight retaining claws (108) protrude inward on the periphery of (108).
9).

... is installed. These holding claws (109),
. . . is a tapered portion (110
) and a spring piece (112) held on the lower surface of the claw piece (111).
2) to suppress the peripheral edge of the circuit board (4).

The vertically movable block (102) supports the restraining plate (101) on its upper surface and is supported by the guide bracket @D so as to be vertically movable. It is pulled downward by a restraining spring body (103), and its lowest position is regulated by a height-adjustable cast collar support (104). Otori will now explain the operation of this embodiment configured as described above. In the state shown in Fig. 1, one magazine (c) has a reed at the top, all support grooves Kl, ... have circuit boards (4),
A carrier (11) carrying... is inserted. Also, stop all transport equipment α4Fi.

Nest device Sumi 9 has been heated to an appropriate temperature and has stopped descending.
The other magazine (to) is at the lowest position.

When starting in this condition, the first thing that happens is the lifting mechanism (to)
is activated, and when the lowest carrier (II) is placed on the supply compare wheel, it is stopped by Senna detection.

Next, the supply side motor and the storage side Moomero 7) are started.

The entire transport device I is driven. The carrier circle that was on the supply conveyor (to) moves in the direction of the arrow -, moves to the transport conveyor (b), comes into contact with the stop bin of the first stopper can, and is placed in the position of the preheating body opening. The sensor detects this and stops, and then the supply motor stops and the supply conveyor stops.

The transport conveyor 6 stops running. Next, the nest drive mechanism (I [9) starts operating. In other words, the rotation of the lifting motor rotates the lifting screw, and as the lifting body figure rises, the support (goods) rises, and the nest συ, σD rises. In the preheating position, the nest ff1) lifts one circuit board (4) while rising, and presses the stopper plate.
It will stop at a predetermined height determined by . a certain amount of time.

During the wire bonding position I2η, the nest συ,
(71) descends and stops. Next, the magazine (c) descends again and places the carrier I on the supply conveyor (to), repeats the above operation, the carrier U advances to the wire bonding position C11), and the next carrier position is placed in the preheating position. Sent to position (a). Furthermore, this crowd 1
The stopper body and the second stopper body are operated by electromagnets to lower the stop bin 1, and after the carrier I has passed, rise again to position the carrier αυ to stop. Next, the nest συ rises again, but the wire bonding position C! At υ, nest συ rises and enters carrier I.

Lift up the circuit board (4). At this time, the bin 6B of the nest C11).

The restraining body (101) rises while restraining and positioning the outside of the circuit board (4) by...
The circuit board (4) is in contact with the spring piece (112) of FIG.

As shown in FIG. 6, its outer edge is elastically pressed by the action of both the spring piece (112) and the restraining spring body (103), and is clamped and fixed by the restraining body (101) and the nest 171). Here, wire bonding work is performed while being heated. When the process is completed, the nest συ descends in the same manner as described above, leaving the circuit board (4) on the carrier αυ. There, the circuit board (4) that has undergone the wire bonding process is transferred to the transport conveyor (Ro) along with the carrier Uυ.
The magazine 0I9VC is transferred to the first storage conveyor, and is stored in the other magazine 0I9VC by the second storage conveyor 6 values.
This is detected by the sensor, and the first and second storage conveyors (
), Sl stops. Next, the magazine (to) is raised one pitch by the lifting mechanism (a) and then stopped. By repeating the above-mentioned operation, the circuit board (4) in the magazine (to) is housed in the magazine (to) through the preheating body (4), the wire bonding body (c), and the carrier αυ in sequence.

〔Effect of the invention〕

As detailed above, the circuit board conveying apparatus of the present invention is as follows:
A carrier that supports the circuit board from below.

A magazine that accommodates the circuit board, a conveyance device that transports the circuit board together with the carrier to the working position, and a nest that is movable up and down to be thrown into the working position, lift the circuit board from the carrier and position it, and is attached to be replaceable. Since the configuration includes a holding body that is replaceably attached to one work position and presses the circuit board elastically, the carrier can be replaced depending on the product type, but the external dimensions can be set constant, so the carrier Since magazines etc. can be used in common, when changing types, only the carrier and nest suppressor need to be replaced, and the type can be changed in a short time, which helps improve productivity in high-mix, low-volume production. It is extremely large. Needless to say, this embodiment may be applied to general bonding such as a mong applied to wire bonding processing.

[Brief explanation of drawings]

Figure 1 is a front view of one embodiment of the present invention.
2 is a plan view, and FIG. 3 is a sectional view taken along line I--I in FIG. 1. 4 is a right side view of FIG. 3, FIG. 5 is a cross-sectional view taken along the line ■-■ in FIG. 1, and FIG. 6 is a cross-sectional view taken along the line ■-■ in FIG. FIG. 7 is a perspective view of a carrier in an embodiment of the present invention;
FIG. 8 is a perspective view of the nest, FIG. 9 is a perspective view of a circuit board, and FIG. 12 is an explanatory perspective view of another circuit board. (4) - circuit board, αυ: carrier. (I2: Magazine device, Makoto: Magazine drive mechanism. (IJ: Conveyance device, αe: Nest drive mechanism. Q■: Working position C1: Through hole. @: Support part, (To), (To): Magazine. ( 71): Nest, Q8: Positioning body. (101): Suppressing body. Agent Patent attorney Noriyuki Chika (1 person) Figure 7, 18, 10

Claims (3)

[Claims] (1) A carrier having a through hole and a supporting part provided at the peripheral edge of the through hole and supporting a circuit board so as to be removable upward by the supporting part, and a plurality of the carriers stacked at a distance and stored. a magazine device having a magazine; a magazine drive mechanism for raising or lowering the magazine; a transport device for taking out the carrier from the magazine and transporting the carrier through a working position where the circuit board is subjected to a predetermined process; a nest that is provided at a working position and has a positioning body that can be freely inserted into the carrier through the through hole and that positions the circuit board supported by the carrier, and that can be converted according to the shape and size of the circuit board; a nest drive mechanism that removably holds the nest and moves it up and down to lift the circuit board, which has been transferred to the working position as the nest rises, from the carrier and position it at a predetermined position; and a presser body that is provided in the circuit board and has a through hole facing the upper surface of the lifted circuit board, elastically presses the peripheral edge of the circuit board downward, and is replaceable according to the shape and size of the circuit board. A circuit board transport and positioning device characterized by: (2) The conveying device comprises a conveyor device, and one end of the conveyor device is provided with a magazine for supplying circuit boards, and the other end is provided with a magazine for accommodating circuit boards. The circuit board transport and positioning device according to scope 1. (3) The circuit board transport and positioning device according to claim 1 or 2, wherein the working positions are a bonding position and a preheating position for preheating the circuit board prior to the bonding position.