JPS61142459U - - Google Patents

Info

Publication number
JPS61142459U
JPS61142459U JP2704185U JP2704185U JPS61142459U JP S61142459 U JPS61142459 U JP S61142459U JP 2704185 U JP2704185 U JP 2704185U JP 2704185 U JP2704185 U JP 2704185U JP S61142459 U JPS61142459 U JP S61142459U
Authority
JP
Japan
Prior art keywords
crimp
package
dip type
lead terminals
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2704185U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2704185U priority Critical patent/JPS61142459U/ja
Publication of JPS61142459U publication Critical patent/JPS61142459U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2704185U 1985-02-26 1985-02-26 Pending JPS61142459U (US06346242-20020212-C00066.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2704185U JPS61142459U (US06346242-20020212-C00066.png) 1985-02-26 1985-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2704185U JPS61142459U (US06346242-20020212-C00066.png) 1985-02-26 1985-02-26

Publications (1)

Publication Number Publication Date
JPS61142459U true JPS61142459U (US06346242-20020212-C00066.png) 1986-09-03

Family

ID=30523625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2704185U Pending JPS61142459U (US06346242-20020212-C00066.png) 1985-02-26 1985-02-26

Country Status (1)

Country Link
JP (1) JPS61142459U (US06346242-20020212-C00066.png)

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