JPS61131834U - - Google Patents

Info

Publication number
JPS61131834U
JPS61131834U JP1468985U JP1468985U JPS61131834U JP S61131834 U JPS61131834 U JP S61131834U JP 1468985 U JP1468985 U JP 1468985U JP 1468985 U JP1468985 U JP 1468985U JP S61131834 U JPS61131834 U JP S61131834U
Authority
JP
Japan
Prior art keywords
cooling
prober
wafer stage
wafer
mechanism according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1468985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1468985U priority Critical patent/JPS61131834U/ja
Publication of JPS61131834U publication Critical patent/JPS61131834U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のウエハプローバの１実施例の
垂直断面図、第２図は第１図の―断面図であ
る。 １……ウエハステージ、２……ステージ移動用
台、３……筐体の頂面板、４……空気室、５……
ノズル、６……高圧エアホース、７……管路、８
，８′……ホース。 FIG. 1 is a vertical cross-sectional view of one embodiment of the wafer prober of the present invention, and FIG. 2 is a cross-sectional view taken from FIG. 1... Wafer stage, 2... Stage movement table, 3... Top plate of the housing, 4... Air chamber, 5...
Nozzle, 6...High pressure air hose, 7...Pipe line, 8
,8'...Hose.

Claims (1)

【実用新案登録請求の範囲】 １ ウエハプローバにおいて、ウエハステージの
上方にエアノズルを設けてウエハステージの上面
に冷却用空気を吹きつけ得るように構成し、かつ
、ウエハステージ内に該ウエハステージを常温以
下に冷却する手段を設置したことを特徴とする、
冷却機構付きウエハプローバ。 ２ 前記の冷却手段は、ボンベに入つた液化気体
を流通せしめる手段を備えた管路であることを特
徴とする実用新案登録請求の範囲第１項に記載の
冷却機構付きプローバ。 ３ 前記の冷却手段は、圧縮機によつて液化させ
て空冷した冷却媒体を流通せしめるように構成し
た管路であることを特徴とする実用新案登録請求
の範囲第１項に記載の冷却機構付きプローバ。 ４ 前記の冷却手段は、通電によつて冷却機能を
生じるサーモモジユールであることを特徴とする
実用新案登録請求の範囲第１項に記載の冷却機構
付きプローバ。[Scope of Claim for Utility Model Registration] 1. A wafer prober, which is configured such that an air nozzle is provided above the wafer stage to blow cooling air onto the upper surface of the wafer stage, and the wafer stage is placed inside the wafer stage at room temperature. It is characterized by having a means for cooling:
Wafer prober with cooling mechanism. 2. The prober with a cooling mechanism according to claim 1, wherein the cooling means is a conduit provided with means for circulating the liquefied gas contained in the cylinder. 3. The cooling mechanism according to claim 1 of the utility model registration claim, wherein the cooling means is a pipe configured to flow a cooling medium that has been liquefied by a compressor and cooled by air. Prober. 4. The prober with a cooling mechanism according to claim 1, wherein the cooling means is a thermomodule that generates a cooling function when energized.
JP1468985U 1985-02-06 1985-02-06 Pending JPS61131834U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1468985U JPS61131834U (en) 1985-02-06 1985-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1468985U JPS61131834U (en) 1985-02-06 1985-02-06

Publications (1)

Publication Number Publication Date
JPS61131834U true JPS61131834U (en) 1986-08-18

Family

ID=30499840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1468985U Pending JPS61131834U (en) 1985-02-06 1985-02-06

Country Status (1)

Country Link
JP (1) JPS61131834U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104321A (en) * 1991-03-26 1994-04-15 Erich Reitinger Testing apparatus of semiconductor wafer, etc.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53144682A (en) * 1977-05-23 1978-12-16 Fujitsu Ltd Testing method of semiconductor devices
JPS546382U (en) * 1977-06-16 1979-01-17
JPS57160141A (en) * 1981-03-27 1982-10-02 Nec Kyushu Ltd Device for inspecting semiconductor substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53144682A (en) * 1977-05-23 1978-12-16 Fujitsu Ltd Testing method of semiconductor devices
JPS546382U (en) * 1977-06-16 1979-01-17
JPS57160141A (en) * 1981-03-27 1982-10-02 Nec Kyushu Ltd Device for inspecting semiconductor substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104321A (en) * 1991-03-26 1994-04-15 Erich Reitinger Testing apparatus of semiconductor wafer, etc.

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