JPS61126734A - Manufacture of camera tube - Google Patents

Abstract

PURPOSE:To improve the yield of a camera tube by suppressing formation of dark spots consisting of glass dust deriving from the side surface of the target base plate by smoothing the side surface of the target base plate after it is shaped into a final form. CONSTITUTION:After a thermosoftening adhesive 22 is used to stick a protective glass 21 to one surface of a base plate 2, lapping is performed on the end surface by mechanical polishing. Next, chemical etching is performed by the use of hydrofluoric acid to etch the side surface or the like of the base plate 2 by about 50-100mum thereby smoothing the base plate 2. Next, after a temporary glass base plate 13 and a protective glass 21 are removed, penetrating signal holes 18 are formed. Next, metallic electrodes 7 are inserted into the holes 18 and then the thus formed body is electrically connected to a transparent conductive film 5. At the same time, a photoconductive film 6 is vapordeposited on the transparent conductive film 5. Therefore, the side surface of the base plate 2 is smoothed during etching. As a result, even when the side surface of the base plate 2 touches jigs during assembly, there is no possibility that glass dust develops from the side surface of the base plate 2 and adheres to the photoconductive film 6 to form spots.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an image pickup tube.

[Conventional technology]

FIG. 4 is a diagram showing the vicinity of the target surface of a single-tube color image pickup tube.

In the figure, (1) is a glass pulp, and (2) is a TARDAT substrate made of a glass plate. Target board (2
), a color filter layer (3), a thin plate glass (4) of about 10 to 20 μm, a transparent conductive film (5) and a photoconductive film (6)
) are arranged sequentially. And (7) is a metal electrode for signal extraction, which is provided through the substrate (2) etc. and electrically connected to the transparent conductive film (5). Also, the board (2)
The space between the glass pulp (1) and the glass pulp (1) is cold-sealed by indium (9) arranged on the inner peripheral surface of the metal ring (8).

In addition, the structure is a mesh-like electrode that corrects the landing error of the electron beam, and is made of indium (9) K.
Mechanically and electrically connected mesh holder (1
It is supported by 11. A predetermined voltage is applied through this mesh-like electrode arn, the metal ring (8), the indium (9), and the mesh holder αυ.

The periphery of the substrate (2) of this image pickup tube has conventionally been manufactured, for example, by the steps shown below.

First, as shown in FIG. 5A, a transparent conductive film (
The thin glass plate (4) on which 5) is formed is adhered to the temporarily fixed glass substrate a3 using a thermosetting adhesive α2. In this case, the thin glass (4) has a thickness of about 100/Jm at the time of bonding, but is then polished to a final thickness of 10~2Jm.
The thickness is 0 μm.

Next, as shown in Figure B, the target substrate (2) on which the color filter layer (3) is formed is bonded to the thin glass plate (4) using the photocurable adhesive I.

In this case, the substrate (2) formed by the process shown in FIG. 6 is used. m, a cylindrical glass member f161 as shown in Figure B is cut out from a cylindrical glass material (151) as shown in Figure A. Then, this glass member αθ is Then, mechanical polishing is performed using a grindstone α7)K, and external finishing such as dimension matching is performed. Then, both surfaces of the glass member side that have been finished with this external shape are mirror-polished to form a substrate (2) as shown in FIG.

Next, as shown in FIG. 5CK, so-called end face lapping is performed, for example, by mechanical polishing using a grindstone. This end face lapping is performed, for example, in order to prevent chips from occurring in the thin glass (4).

Next, as shown in the same figure, after the temporarily fixed glass substrate a3 is removed, a through hole αg is formed through the substrate (2) etc. for passing the metal electrode c force for signal extraction. Ru. For example, a diamond drill is used for this formation.

Next, as shown in Figure E, the metal electrode (7) is inserted into the through hole (
181, one end of which is electrically connected to the transparent conductive film (5) by, for example, solder (19), and a photoconductive film (6) is deposited on the transparent conductive film (5).

In addition, in Fig. 7, the handles indicate assembly jigs and tools.
Fixed part (20A) K is a glass pulp (1), a metal ring (8) with indium (9) arranged on its inner circumferential surface, and a mesh-like electrode α supported by a mesh holder (111).
[ is arranged, and its movable part (20B) has the above-mentioned board (
2) The surroundings are arranged, the movable part (20B) is moved in the direction shown by arrow X, and finally the glass pulp (1) and the substrate (2
), the indium (9) is compressed and cold sealed.
It is assembled as shown in FIG. Furthermore, Figures 4 and 7
In the figure, for the sake of simplicity, the adhesive a4 in FIG. 5 is not shown.

[Problem that the invention seeks to solve]

According to the image pickup tube manufactured by K as described above, black scratches on the photoconductive film (6), which are the cause of defects, occur on the order of several inches, although this varies somewhat depending on the type and standard. This is a major hindrance to improving yield.

The applicant analyzed the cause of the black scratches on the photoconductive film (6) and found that 50 to 80% of the black scratches were due to scratches. The glass dust showed a distribution with a peak size of about 10 μm, and most of it corresponded to the material of the substrate (2). The applicant presumed the reason for this as follows. That is, as mentioned above, according to the conventional manufacturing method, the side surface of the substrate (2) remains finished by mechanical polishing, and the side surface has an uneven surface of about 10 μm (6th (see diagram). Therefore, when assembling the movable part (20B) with a jig (2) as shown in FIG. occurs. It is believed that this glass dust is scattered by air movement energy during assembly and adheres to the photoconductive film (6), resulting in black scratches.

In view of these points, the present invention aims to reduce the black scratches mentioned above, and particularly aims to improve the yield.

[Means for solving problems]

In order to solve the above-mentioned problems, the present invention aims to solve the above-mentioned problems.
After 2) is processed into the final shape, its side surfaces are smoothed. The smoothing treatment is carried out by chemical etching using, for example, heptonic acid.

[Effect]

As described above, by flattening and smoothing the side surface of the target substrate (2), almost no glass dust is generated from this side surface in the subsequent manufacturing process.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

This example is characterized by the manufacturing method for the periphery of the substrate (2), which is manufactured by the steps shown in FIG. In this Figure 1, the above-mentioned fifth
Portions corresponding to those in the figure are designated by the same reference numerals.

First, as shown in Figure 1A, a transparent conductive film (5
) formed on the thin glass (4) is a heat softening liquid, an adhesive α
2 to temporarily adhere to the glass substrate a3.

Next, as shown in Figure B, a color filter layer (
The target substrate (2) on which 3) was formed is bonded to a thin glass plate (4) using a photocurable liquid adhesive α4.

The above steps are similar to the conventional steps (see FIGS. 5A and 5B), and the substrate (2) formed in the steps shown in FIGS. 6A to 6D is also used as in the conventional case.

Next, in this example, as shown in FIG.
A protective glass (2υ) that protects the surface of the substrate (2) from the chemical etching treatment described below is attached using a heat-softening adhesive @.
).

Next, as shown in the figure, so-called end face lapping is performed by mechanical polishing using a grindstone, for example.

Next, a chemical etching process using hydrofluoric acid (HF) is performed, and, for example, the side surfaces of the substrate (2) are etched by about 50 to 100 μm and smoothed (as shown in FIG. E). After this etching process, the parts other than the glass that are not etched are removed with an organic solvent such as trichlorethylene, if necessary.

Next, as shown in FIG.
After the protective glass Qυ is removed, a through hole αa for passing the metal electrode (7) for signal extraction is formed in the substrate (2).
), etc.

Next, as shown in Figure G, the metal electrode (7) is inserted into the through hole α.
It is inserted into a mallet, one end of which is electrically connected to the transparent conductive film (5) by, for example, solder a1, and the transparent conductive film (5) is inserted into the mallet.
5) A photoconductive film (6) is deposited on top.

The periphery of the substrate (2) is manufactured in this way, and then assembled using an assembly jig (2) as shown in FIG. 7 in the same manner as in the prior art, and assembled as shown in FIG. 2. In FIG. 2, parts corresponding to those in FIG. 4 are designated by the same reference numerals. In FIG. 2, the adhesive (141) in FIG. 1 is not shown for the sake of simplicity.

As described above, according to the method of this example, as shown in FIG. 1G, the substrate (
The side surfaces of 2) are smoothed during the etching process. Therefore, according to the method of this example, when assembling with a jig (2) as shown in FIG. (
From the side surface of 2), there is almost no occurrence of glass smudges as in the conventional case, and there is also almost no chance of adhering to the photoconductive film (6) and causing black scratches.

As a result, according to the method of this example, black scratches are reduced and yield is improved. In addition, as a result of analyzing defective products due to black scratches using a scanning electron microscope, the proportion of glass dust contained was 64% out of 14 samples made by the conventional method, and 64% out of 10 samples made by the method of this example. It was 0%. From this result, it was found that the method of this example almost eliminates black scratches caused by dirt on the glass, proving that the method is very effective.

Further, according to the method of this example, as described above, the substrate (2)
As a result, there is almost no glass dust generated as in the conventional case, making it easier to handle, for example, in the assembly process, and improving manufacturing efficiency.

Furthermore, according to the method of this example, - the sealing performance against vacuum, that is, the vacuum property can be improved. This is thought to be because the effective sealing surface was increased by smoothing the side surfaces of the substrate (2).

In the above embodiment, the side surface of the substrate (2) was smoothed by chemical etching using hydrofluoric acid, but it may also be smoothed by mechanical polishing (mirror polishing).

Furthermore, in the above-described embodiment, it is also conceivable to use a tortoise shell with smoothed sides as the substrate (2) from the beginning.

However, in this case, the portion mechanically polished in the end face lapping process remains unsmoothed and is not perfect.

Furthermore, although the above-mentioned embodiment is an example in which the present invention is applied to the manufacture of a single-tube color image pickup tube, it can be similarly applied to the manufacture of a monochrome image pickup tube.

That is, the target substrate of the conventional monochrome image pickup tube is shown in FIG. 6A.
-D, but in the case where the present invention is applied, a glass member (Ie) with an outer finish as shown in FIG. The surface and side surfaces are smoothed as shown in Figure 3, and both surfaces are polished to a mirror finish to form the substrate (2) as shown in Figure B.The glass member with the external finish After mirror-polishing both surfaces of 16), these surfaces may be masked and etched with hydrofluoric acid to smooth the side surfaces.

It is clear that the same effects as in the case of the color image pickup tube described above can be obtained by forming the substrate (2) in this manner and manufacturing a monochrome image pickup tube.

〔Effect of the invention〕

According to the method of the present invention described above, since the side surfaces of the target substrate are smoothed before use, black scratches caused by glass dust can be significantly reduced, yield can be improved, and handling becomes easier. It is possible to improve manufacturing efficiency. Furthermore, it is possible to improve the vacuum property.

[Brief explanation of drawings]

FIG. 1 and FIG. 3 are process diagrams for explaining the present invention, respectively.
FIG. 2 is a block diagram of the area around the target surface of the image pickup tube according to the method of the present invention, FIG. 4 is a block diagram of the area around the target surface of the image pickup tube according to the conventional method, and FIGS. FIG. 7 is a diagram for explaining the assembly process. (2) is the target substrate, (3) is the color filter layer, (4
) is a thin plate glass, (5) is a transparent conductive film, (6) is a photoconductive film, (7) is a metal electrode, and α4 is a photocurable adhesive. Figure 6

Claims (1)

[Claims] 1. A method for manufacturing an image pickup tube, characterized in that after the target substrate of the image pickup tube is processed into a final shape, a side surface of the target substrate is smoothed.