JPS61126187A - 銅張積層板用接着剤 - Google Patents
銅張積層板用接着剤Info
- Publication number
- JPS61126187A JPS61126187A JP24737784A JP24737784A JPS61126187A JP S61126187 A JPS61126187 A JP S61126187A JP 24737784 A JP24737784 A JP 24737784A JP 24737784 A JP24737784 A JP 24737784A JP S61126187 A JPS61126187 A JP S61126187A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copper
- resistance
- heat resistance
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 6
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 5
- 239000005011 phenolic resin Substances 0.000 claims abstract description 3
- 239000002904 solvent Substances 0.000 claims abstract description 3
- 239000011368 organic material Substances 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 2
- 229910001679 gibbsite Inorganic materials 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 206010000369 Accident Diseases 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- NFDFQCUYFHCNBW-SCGPFSFSSA-N dienestrol Chemical compound C=1C=C(O)C=CC=1\C(=C/C)\C(=C\C)\C1=CC=C(O)C=C1 NFDFQCUYFHCNBW-SCGPFSFSSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24737784A JPS61126187A (ja) | 1984-11-22 | 1984-11-22 | 銅張積層板用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24737784A JPS61126187A (ja) | 1984-11-22 | 1984-11-22 | 銅張積層板用接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61126187A true JPS61126187A (ja) | 1986-06-13 |
| JPH0437870B2 JPH0437870B2 (enrdf_load_stackoverflow) | 1992-06-22 |
Family
ID=17162518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24737784A Granted JPS61126187A (ja) | 1984-11-22 | 1984-11-22 | 銅張積層板用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61126187A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02255886A (ja) * | 1988-12-05 | 1990-10-16 | Hitachi Chem Co Ltd | 金属張積層板用接着剤組成物 |
| JPH0548265A (ja) * | 1991-08-09 | 1993-02-26 | Hitachi Chem Co Ltd | 銅張積層板用接着剤 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
| JPS5534250A (en) * | 1978-08-31 | 1980-03-10 | Matsushita Electric Works Ltd | Adhesive composition |
| JPS6079080A (ja) * | 1983-10-07 | 1985-05-04 | Nippon Mektron Ltd | 接着剤組成物 |
-
1984
- 1984-11-22 JP JP24737784A patent/JPS61126187A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
| JPS5534250A (en) * | 1978-08-31 | 1980-03-10 | Matsushita Electric Works Ltd | Adhesive composition |
| JPS6079080A (ja) * | 1983-10-07 | 1985-05-04 | Nippon Mektron Ltd | 接着剤組成物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02255886A (ja) * | 1988-12-05 | 1990-10-16 | Hitachi Chem Co Ltd | 金属張積層板用接着剤組成物 |
| JPH0548265A (ja) * | 1991-08-09 | 1993-02-26 | Hitachi Chem Co Ltd | 銅張積層板用接着剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437870B2 (enrdf_load_stackoverflow) | 1992-06-22 |
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