JPS61121773U - - Google Patents

Info

Publication number

JPS61121773U

JPS61121773U JP464385U JP464385U JPS61121773U JP S61121773 U JPS61121773 U JP S61121773U JP 464385 U JP464385 U JP 464385U JP 464385 U JP464385 U JP 464385U JP S61121773 U JPS61121773 U JP S61121773U

Authority

JP

Japan

Prior art keywords

circuit patterns

solder resist

substrate

circuit

copper foil

Prior art date

1985-01-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 4
• 239000000758 substrate Substances 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 239000011889 copper foil Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2

Cited By (4)