JPS61106035U - - Google Patents

Info

Publication number
JPS61106035U
JPS61106035U JP1984192468U JP19246884U JPS61106035U JP S61106035 U JPS61106035 U JP S61106035U JP 1984192468 U JP1984192468 U JP 1984192468U JP 19246884 U JP19246884 U JP 19246884U JP S61106035 U JPS61106035 U JP S61106035U
Authority
JP
Japan
Prior art keywords
substrate
heat conduction
minute gap
conduction plate
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984192468U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984192468U priority Critical patent/JPS61106035U/ja
Publication of JPS61106035U publication Critical patent/JPS61106035U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1984192468U 1984-12-19 1984-12-19 Pending JPS61106035U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984192468U JPS61106035U (https=) 1984-12-19 1984-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984192468U JPS61106035U (https=) 1984-12-19 1984-12-19

Publications (1)

Publication Number Publication Date
JPS61106035U true JPS61106035U (https=) 1986-07-05

Family

ID=30749883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984192468U Pending JPS61106035U (https=) 1984-12-19 1984-12-19

Country Status (1)

Country Link
JP (1) JPS61106035U (https=)

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