JPS61105640U - - Google Patents
Info
- Publication number
- JPS61105640U JPS61105640U JP18891084U JP18891084U JPS61105640U JP S61105640 U JPS61105640 U JP S61105640U JP 18891084 U JP18891084 U JP 18891084U JP 18891084 U JP18891084 U JP 18891084U JP S61105640 U JPS61105640 U JP S61105640U
- Authority
- JP
- Japan
- Prior art keywords
- thermal bonding
- wall material
- side wall
- heat
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
Landscapes
- Bag Frames (AREA)
Description
第１図は従来の自立性包装袋の説明図、第２図
は第１図の底面図、第３図は本考案の自立性包装
袋の説明図、第４図は第３図の底面図である。
１，２……側壁材、３……底壁材、４……側縁
熱接着部、５……底部熱接着部、６……熱接着開
始部、７……熱接着接線、８……熱接着線。
Fig. 1 is an explanatory diagram of a conventional self-supporting packaging bag, Fig. 2 is a bottom view of Fig. 1, Fig. 3 is an explanatory diagram of the self-supporting packaging bag of the present invention, and Fig. 4 is a bottom view of Fig. 3. It is. 1, 2...Side wall material, 3...Bottom wall material, 4...Side edge heat bonded portion, 5...Bottom heat bonded portion, 6...Heat bond start portion, 7...Tangential line of heat bond, 8... Hot glue wire.
Claims (1)
材１，２と底壁材３からなり、該底壁材３は前記
側壁材１，２間における底部に二つ折り状の山形
に介在せしめ、前記側壁材３の側端部間に側縁熱
接着部４及び側壁材１，２の下端部と前記底壁材
３の端部を円弧上に底部熱接着部５を形成した自
立性包装袋であつて、底部熱接着部５の熱接着開
始部６における底部熱接着部５の上端縁の熱接着
接線７と側縁熱接着部４の内側縁の熱接着線８と
のなす角度が３０度以下である自立性包装袋。 It consists of two side wall materials 1 and 2 having a heat-adhesive synthetic resin layer on the inner surface and a bottom wall material 3, and the bottom wall material 3 is interposed in a bi-folded chevron shape at the bottom between the side wall materials 1 and 2. , a self-supporting package in which a side edge heat-bonded part 4 is formed between the side edges of the side wall material 3, and a bottom heat-bonded part 5 is formed on an arc between the lower ends of the side wall materials 1 and 2 and the end of the bottom wall material 3. In the bag, the angle formed by the thermal bonding tangent line 7 of the upper edge of the bottom thermal bonding section 5 at the thermal bonding start part 6 of the bottom thermal bonding section 5 and the thermal bonding line 8 of the inner edge of the side edge thermal bonding section 4 is A self-supporting packaging bag that has a temperature of 30 degrees or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891084U JPS61105640U (en) | 1984-12-14 | 1984-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18891084U JPS61105640U (en) | 1984-12-14 | 1984-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61105640U true JPS61105640U (en) | 1986-07-04 |
Family
ID=30746372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18891084U Pending JPS61105640U (en) | 1984-12-14 | 1984-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61105640U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008174288A (en) * | 2007-01-19 | 2008-07-31 | Dainippon Printing Co Ltd | Stand pouch |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577984A (en) * | 1980-06-18 | 1982-01-16 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor light emitting device |
-
1984
- 1984-12-14 JP JP18891084U patent/JPS61105640U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577984A (en) * | 1980-06-18 | 1982-01-16 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor light emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008174288A (en) * | 2007-01-19 | 2008-07-31 | Dainippon Printing Co Ltd | Stand pouch |
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