JPS61100170U - - Google Patents
Info
- Publication number
- JPS61100170U JPS61100170U JP18664084U JP18664084U JPS61100170U JP S61100170 U JPS61100170 U JP S61100170U JP 18664084 U JP18664084 U JP 18664084U JP 18664084 U JP18664084 U JP 18664084U JP S61100170 U JPS61100170 U JP S61100170U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- copper
- alloy
- tungsten
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984186640U JPH0343726Y2 (cs) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984186640U JPH0343726Y2 (cs) | 1984-12-07 | 1984-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61100170U true JPS61100170U (cs) | 1986-06-26 |
| JPH0343726Y2 JPH0343726Y2 (cs) | 1991-09-12 |
Family
ID=30744101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984186640U Expired JPH0343726Y2 (cs) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343726Y2 (cs) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331940A (ja) * | 1986-07-28 | 1988-02-10 | Nippon Telegr & Teleph Corp <Ntt> | 磁気浮上移送装置 |
-
1984
- 1984-12-07 JP JP1984186640U patent/JPH0343726Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331940A (ja) * | 1986-07-28 | 1988-02-10 | Nippon Telegr & Teleph Corp <Ntt> | 磁気浮上移送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343726Y2 (cs) | 1991-09-12 |
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