JPS6099529U - 半導体ウエ−ハの保護膜の打抜き具 - Google Patents

半導体ウエ−ハの保護膜の打抜き具

Info

Publication number
JPS6099529U
JPS6099529U JP19072283U JP19072283U JPS6099529U JP S6099529 U JPS6099529 U JP S6099529U JP 19072283 U JP19072283 U JP 19072283U JP 19072283 U JP19072283 U JP 19072283U JP S6099529 U JPS6099529 U JP S6099529U
Authority
JP
Japan
Prior art keywords
protective film
blade
tool
punching
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19072283U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6328604Y2 (enrdf_load_html_response
Inventor
若林　良治
Original Assignee
城西精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 城西精機株式会社 filed Critical 城西精機株式会社
Priority to JP19072283U priority Critical patent/JPS6099529U/ja
Publication of JPS6099529U publication Critical patent/JPS6099529U/ja
Application granted granted Critical
Publication of JPS6328604Y2 publication Critical patent/JPS6328604Y2/ja
Granted legal-status Critical Current

Links

JP19072283U 1983-12-10 1983-12-10 半導体ウエ−ハの保護膜の打抜き具 Granted JPS6099529U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19072283U JPS6099529U (ja) 1983-12-10 1983-12-10 半導体ウエ−ハの保護膜の打抜き具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19072283U JPS6099529U (ja) 1983-12-10 1983-12-10 半導体ウエ−ハの保護膜の打抜き具

Publications (2)

Publication Number Publication Date
JPS6099529U true JPS6099529U (ja) 1985-07-06
JPS6328604Y2 JPS6328604Y2 (enrdf_load_html_response) 1988-08-02

Family

ID=30410873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19072283U Granted JPS6099529U (ja) 1983-12-10 1983-12-10 半導体ウエ−ハの保護膜の打抜き具

Country Status (1)

Country Link
JP (1) JPS6099529U (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS6328604Y2 (enrdf_load_html_response) 1988-08-02

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