JPS6086295A - Preparation of dumet wire - Google Patents

Abstract

PURPOSE:To obtain a product excellent in air-tightness by perfecting the close adhesiveness of a plating layer, in the titled preparing method having a process for continuously plating an iron-Ni alloy wire subjected to wire drawing, by applying surface roughening processing to the surface of the aforementioned alloy wire prior to performing plating. CONSTITUTION:An alloy wire comprising 42wt% of Ni and the remainder of iron is continuously subjected to wire drawing process by a die using a solid lubricant. Glass beads are sprayed to the aforementioned alloy wire 4, continuously delivered from the wire drawing process to an A-direction, in B-E directions by nozzles 5-8 at four places to form a roughened satin surface with roughness of about 2-9mum to the surface of the wire 4. Succeedingly, the wire 4 completed in this treatment is molded and pretreated with an alkali solution and an acid solution while copper electroplating is applied to the treated wire in a predetermined thickness and the plated one is further subjected to wire drawing processing to obtain a Dumet wire of a desired diameter.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention is directed to continuously Z× drawn iron/nickel alloy wire.
The present invention relates to a method of manufacturing Dumet wire that includes a manufacturing process of plating.

[Technical background of the invention and its problems]

Dumet wire with an iron-nickel alloy core is widely used as lead-in wire for glass sealing in incandescent lamps, fluorescent lamps, diodes, etc. This Dumet wire is made of an alloy of approximately 42% by weight nickel and residual iron, for example. Hot-pressing copper onto the surface of the wire.

The above-mentioned alloy wire is immersed in a copper melting bath, the above-mentioned alloy wire is electroplated with copper, or the above-mentioned alloy wire is covered with brass foil and then heated to melt and bond the brass foil. After coating the surface of the alloy wire with copper, the wire is drawn to the desired outer diameter, cuprous oxide Cu2O is formed on the surface of the copper layer, and the surface is further coated with a borax layer. It has become.

Attached Figure 1 is a cross-sectional view of the Dumet wire, which is made of iron and
A copper coating layer (2) is formed on the surface of a nickel alloy core metal (1), and a solid solution layer (3) of cuprous oxide and borax is further formed on the surface. By using a Dumet wire having such a configuration as an introduction wire for sealing soft glass, for example, the Dumet wire has a thermal expansion characteristic similar to the thermal expansion curve of the glass, so that airtight sealing can be achieved. be able to.

However, conventional Dumet wires tend to have incomplete adhesion between the iron-nickel alloy core and the copper coating layer, and there is a problem in that the airtightness is broken at these points. The reason why this incomplete adhesion occurs is that, for example, the lubricant used during wire drawing of iron-nickel alloy wire remains stuck to the surface of the alloy wire and the wire is left for a long time. This is because the copper coating layer does not completely adhere to the surface of the alloy wire due to the formation of an oxide film on the alloy wire or the presence of minute drawing marks or scratches on the alloy wire. As a countermeasure to this problem, methods such as degreasing or pickling the iron-nickel alloy wire after drawing it have been tried, but these have not been able to solve the fatal problem of breaking the airtightness mentioned above.

[Purpose of the invention]

The present invention has been made to solve the above-mentioned problems, and the lubricant during wire drawing may stick and remain on the surface of the iron-nickel alloy wire, forming an oxide film or leaving scratches or scratches on the surface of the iron-nickel alloy wire. It is an object of the present invention to provide the industry with an improved method for manufacturing Dumet wire which inhibits the adhesion between the wire surface and the copper coating layer and has excellent airtightness.

[Summary of the invention]

The present invention involves drying the surface of the drawn iron/nickel alloy wire with glass beads prior to the continuous plating process in the production of Dumet wire, which involves the process of continuously plating the drawn iron/nickel alloy wire. This method of manufacturing Dumet wire is characterized by including a step of roughening the surface by a method such as honing.

[Embodiments of the invention]

The details of the present invention will be explained with reference to the attached FIG. 2.

The manufacturing method of the Dumet wire of the present invention is carried out using the conventional manufacturing process, that is, after continuously drawing an alloy wire of about 42% by weight of nickel and residual iron using a solid lubricant,・After performing a pre-treatment process using an acid solution, etc., and electroplating copper on the 2nd surface, the wire is further drawn to make a Dumet wire of the desired diameter.After the first continuous wire drawing process of the manufacturing process, an alkaline solution and acid are applied. Before pretreatment of liquids, etc.
For example, dry honing is performed by blowing glass beads.

Examples carried out by the present inventors will be described.

An iron-nickel alloy wire of 42% by weight of nickel and residual iron with a diameter of 6.0 mm is drawn to a diameter of 5.8 mm using a die using a solid lubricant.

Next, the alloy wire that comes out continuously from the wire drawing process is
Glass beads are sprayed using the method shown in the figure. In Fig. 2, four nozzles (5), (6) are attached to the above-mentioned blown nickel alloy wire (4) with a diameter of 5.8 mm, which is continuously fed out at a speed of 4 cm per second in the direction of arrow (A).
, (force, (8) respectively arrows (B), (C)
.

Glass pieces with a diameter of about 75 to 170 μ are sprayed in directions (D) and (E) at a spray pressure of 3 kg/cm2.

By the above-mentioned spraying, a rough surface with a satin texture of about 2 to 8 microns is formed on the surface of the alloy wire (4). Nozzle (5
), f61, f force, (white) are each provided at an angle of 90 degrees, so the glass beads sprayed from the above nozzle are sprayed uniformly onto the surface of the iron-nickel alloy wire, and are spaced apart. Since the nozzle is provided with a nozzle, the jet stream of glass beads injected from the nozzle does not obstruct the direction of each other.

After pretreatment with alkaline solution, acid solution, etc., copper electroplating is performed to a predetermined thickness, and this is further wire-drawn to complete a Dumet wire of a desired diameter.

The present inventors conducted a bending test at an angle of 90° and an annealing heating test at 650'C for 1 hour on a Dumet wire that had undergone a continuous copper electroplating process according to the manufacturing method of the present invention. As a result, there was no peeling between the iron-nickel alloy wire and the copper coating layer, and no bulging of the copper coating layer.

Furthermore, the present inventors analyzed Si in glass beads by spraying glass beads on the surface of an iron-nickel alloy wire.

No residual Si was observed. Therefore, it is clear that the surface of the iron-nickel alloy wire was only roughened by the glass beads and no glass beads were attached to it.

The present inventors made a slug lead for a diode by drawing the Duumet wire manufactured by the present manufacturing method to a diameter of about 0.8 mm, manufactured a diode using this, and poured it into hot water at 100°C. After boiling for an hour, I pulled it up and dried it, and checked the diode characteristics with a diode and curve tracer.

In 5 tests of 500 pieces each, there were no defects in diode characteristics such as reverse current.

After processing the surface of the above iron-nickel alloy wire into a rough surface,
A thin nickel plating may be applied and copper plating may be applied thereon, and this case also falls within the scope of the manufacturing method of the present invention.

Further, the roughening of the surface of the iron-nickel alloy wire is not limited to the dry honing treatment using glass beads, etc., but may also be performed by a brushing polishing method or the like.

〔Effect of the invention〕

In the production of Dumet wire, which involves the process of continuously plating drawn iron/nickel alloy wire, the present invention involves continuously roughening the surface of the drawn iron/nickel alloy wire prior to the continuous plating process. A method for producing Dumet wire characterized by a surface processing step, in which the surface of the iron-nickel alloy wire is roughened to completely remove the lubricant used during wire drawing. can.

The copper coating layer can be brought into close contact with the alloy wire by removing the oxide film, scratches, etc. on the surface of the alloy wire.

Since electroplating can be carried out immediately after surface roughening, the copper coating layer has good adhesion with a rusty texture, and has the excellent effect that a Dumet wire with excellent airtightness can be manufactured.

[Brief explanation of drawings]

FIG. 1 is an enlarged sectional view of a dumet wire, and FIG. 2 is a schematic diagram showing the positional relationship between a glass bead injection nozzle and an iron-nickel alloy wire in an embodiment of the method for producing a dumet wire of the present invention. 1.4... Core metal of Tekken nickel alloy 2... Copper coating layer 5.6.7.8... Glass bead injection nozzle agent Patent attorney Noriyuki Chika (and 1 other person)

Claims (1)

[Claims] In a Dumet wire manufacturing method that includes a step of continuously plating the drawn iron/nickel alloy wire, the surface of the drawn iron/nickel alloy wire is continuously roughened prior to the continuous plating step. 1. A method for producing a Dumet wire, comprising the step of: