JPS608188B2 - Double-sided finishing device for discs - Google Patents

Double-sided finishing device for discs

Info

Publication number
JPS608188B2
JPS608188B2 JP55013693A JP1369380A JPS608188B2 JP S608188 B2 JPS608188 B2 JP S608188B2 JP 55013693 A JP55013693 A JP 55013693A JP 1369380 A JP1369380 A JP 1369380A JP S608188 B2 JPS608188 B2 JP S608188B2
Authority
JP
Japan
Prior art keywords
workpiece
polishing
polishing pad
double
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55013693A
Other languages
Japanese (ja)
Other versions
JPS56114663A (en
Inventor
紀義 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55013693A priority Critical patent/JPS608188B2/en
Publication of JPS56114663A publication Critical patent/JPS56114663A/en
Publication of JPS608188B2 publication Critical patent/JPS608188B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は円板の両面仕上装置に係り、特に、シリコンウ
ェハ、磁気ディスク用基板等の薄肉円板の両面仕上装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a double-sided finishing apparatus for discs, and more particularly to a double-sided finishing apparatus for thin discs such as silicon wafers and magnetic disk substrates.

シリコンゥェハ、磁気ディスク等薄板円板の両面仕上に
関し、従来から両面ラッピング、両面ポリシング等の加
工法を採用している。
Conventionally, processing methods such as double-sided lapping and double-sided polishing have been used to finish both sides of thin disks such as silicon wafers and magnetic disks.

これは被加工物の数1M音の面積をもつ回転円板を上下
に配置し、その間隙に被加工物を数枚から1項欧枚程度
挟持し、ラップ剤等を供給しながら回転円板を所定時間
回転せしめて被加工物を上下より同時に加工するもので
ある。かかる方法によれば仕上加工する数枚ないし1項
段枚の板厚の不揃いにより仕上時間が板厚の最も厚い被
加工物に左右され一定せず、また仕上精度も劣化する欠
点がある。また被加工物の数1ぴ音の面積をもつ装置に
は塵の混入がさげられず、仕上面に引つかき傷等の損傷
を与えることが多く歩留低下をきたす欠点も有していた
。本発明の目的は、上託した従来技術の欠点を解消し、
円板の表面積度や加工能率を向上するとともに高歩留り
を可能とする円板の両面仕上装置を提供することにある
In this method, rotating disks with an area of 1M are placed above and below the workpieces, and several to 100cm of workpieces are held between them, and the rotating disks are held in place while supplying a lapping agent, etc. The workpiece is machined from above and below at the same time by rotating over time. This method has the disadvantage that the finishing time varies depending on the thickest workpiece due to unevenness in the thickness of the several sheets or sheets to be finished, and that the finishing accuracy also deteriorates. In addition, a device having an area of several peas for the workpiece has the drawback that dust cannot be mixed in, and it tends to stick to the finished surface and cause damage such as scratches, resulting in a decrease in yield. The purpose of the present invention is to overcome the drawbacks of the prior art and
It is an object of the present invention to provide a double-sided finishing device for a disk, which improves the surface area and processing efficiency of the disk and enables a high yield.

本発明は、この目的を達成するために、密閉した装置内
に被加工物と被加工物より小径の研磨パッドとを交互に
サンドイッチ状に積重し、両者を圧接した状態で前記研
磨パッドを回転するように構成する円板の両面仕上装置
を特徴とするものである。以下、本発明の一実施例を図
に基づいて説明する。
In order to achieve this object, the present invention alternately stacks a workpiece and a polishing pad smaller in diameter than the workpiece in a sandwich-like manner in a sealed device, and then stacks the polishing pad while the two are in pressure contact with each other. The present invention is characterized by a disk double-sided finishing device configured to rotate. Hereinafter, one embodiment of the present invention will be described based on the drawings.

第1図及び第2図において、被加工物1は上枠である上
ブタ6及び下枠であるベース7の同一円周上に刻設する
溝に挿設されるローラガィド‘こより回転自在に支持さ
れ、複数個の研磨パッド2により挟持されている。
In FIGS. 1 and 2, a workpiece 1 is rotatably supported by a roller guide inserted into a groove carved on the same circumference of an upper cover 6 as an upper frame and a base 7 as a lower frame. and is held between a plurality of polishing pads 2.

研磨パッド2の外周はベース7に設置された伝動軸3及
びガイド4の先端部に取付けられたガイドローラ5と当
接している。また被加工物1の側面には当て板15、ボ
ール11、加圧板12、があり、加工バネ141こより
適度の荷重で被加工物1と研磨パッド2とを庄接する構
成となっている。つぎに本装置における薄板円板の仕上
法について説明する。
The outer periphery of the polishing pad 2 is in contact with a transmission shaft 3 installed on a base 7 and a guide roller 5 attached to the tip of a guide 4. Further, there are a backing plate 15, a ball 11, and a pressure plate 12 on the side surface of the workpiece 1, and the workpiece 1 and the polishing pad 2 are brought into contact with each other with an appropriate load from a processing spring 141. Next, a method of finishing a thin disk using this apparatus will be explained.

まず上ブタ6を開放して研磨パッド2の間隙に被加工物
1を装てんする。しかるのち一方の加圧バネ14によっ
て所定の荷重を付与し、被加工物1と研磨パッド2を密
着状態にせしめる。つぎに被加工物1のローラガィド8
を保持した上ブタ6とベース7を密着させ密閉室となし
、ラップ剤等の研磨液を供給口9より連続して供給する
。しかるのち伝動軸3を所定の回転速度で回転させると
、これと接触している研磨パッド2が回転する。研磨パ
ッド2と接触している被加工物1の間には摩擦力が作用
するが「被加工物1の外周側に作用する摩擦トルクが大
きいので被加工物1は研磨パッド2と同じ方向に回転し
て被加工物1の全面は研磨パッド2に接触し仕上加工が
進行する。研磨加工では研磨圧が一定であれば加工量は
一定となるので、所定加工時間を加工したのち機械は停
止する。さらに密閉室内には供給口9より化学液あるい
は洗浄液を供給して被加工物1を充分洗浄し加工は完了
し、高精度で清浄な被加工物1を取り出す。本実施例に
おいて、同時に研磨加工した被加工物の板厚を均一とす
るためには、研磨前の板厚が一定のものを選別する必要
があるが、板厚寸法公差はゆるいが両面の平行精度の高
い円板の研磨仕上げに対してはきわめて効果的であるこ
とが言える。
First, the upper lid 6 is opened and the workpiece 1 is loaded into the gap between the polishing pads 2. Thereafter, a predetermined load is applied by one of the pressure springs 14 to bring the workpiece 1 and polishing pad 2 into close contact. Next, the roller guide 8 of the workpiece 1
The upper lid 6 holding the polishing agent 6 and the base 7 are brought into close contact with each other to form a sealed chamber, and a polishing liquid such as a lapping agent is continuously supplied from the supply port 9. When the transmission shaft 3 is then rotated at a predetermined rotational speed, the polishing pad 2 in contact with the transmission shaft 3 rotates. Frictional force acts between the polishing pad 2 and the workpiece 1 that is in contact with the polishing pad 2, but since the frictional torque acting on the outer circumferential side of the workpiece 1 is large, the workpiece 1 moves in the same direction as the polishing pad 2. As it rotates, the entire surface of the workpiece 1 comes into contact with the polishing pad 2, and finishing machining progresses.In polishing, if the polishing pressure is constant, the amount of machining is constant, so the machine stops after processing for a predetermined machining time. Further, a chemical liquid or a cleaning liquid is supplied into the sealed chamber from the supply port 9 to thoroughly wash the workpiece 1, and the processing is completed, and a clean workpiece 1 with high precision is taken out.In this embodiment, at the same time, In order to make the thickness of the polished workpiece uniform, it is necessary to select a plate with a constant thickness before polishing. It can be said that it is extremely effective for polishing finishes.

本実施例において、被加工物1と研磨パッド2とを圧接
する手段としてバネ14を使用したが、油空圧及びその
他の手段を用いてもよく、また、研磨パッド2と伝動軸
3とは、適当な押圧手段により圧接し、研磨能力を向上
させる構造を用いても構わない。
In this embodiment, the spring 14 is used as a means for press-contacting the workpiece 1 and the polishing pad 2, but hydraulic or pneumatic or other means may also be used. Alternatively, a structure may be used in which the polishing ability is improved by press contact using an appropriate pressing means.

以上のごとき装置構成を、被加工物として直接100の
/舵のシリコンウェハに適用した実例を述べる。
An example will be described in which the above-described apparatus configuration is directly applied to a silicon wafer of 100/rudders as a workpiece.

この場合、研磨パッドとしてテフロン樹脂を用い、研磨
液として直径0.1山肌のシリカ粉を混合した化学液を
使用した。両面ラップの結果、加工面の損傷は発生せず
加工精度、加工能率、歩蟹向上についてすぐれた効果が
確認された。以上の説明にても明らかのごとく、本発明
によれば、密閉室内における研磨のため塵挨の混入がな
く、また被加工物に見合った小径の研磨パッドを使用す
ることにより研磨パッドの偏摩耗が生じないため、研磨
精度のきわめて高い両面研磨が可能になると共に、塵挨
等による加工面の損傷かないため歩蟹を10%ないし2
0%向上することができ、更に、従来加工法の3〜5倍
の加工能率が得られることが確認された。
In this case, Teflon resin was used as the polishing pad, and a chemical solution mixed with silica powder having a diameter of 0.1 mound was used as the polishing liquid. As a result of double-sided lapping, no damage occurred to the machined surface, and excellent effects were confirmed in terms of improving machining accuracy, machining efficiency, and walking speed. As is clear from the above description, according to the present invention, since polishing is performed in a closed chamber, there is no contamination of dust, and by using a polishing pad with a small diameter suitable for the workpiece, uneven wear of the polishing pad is achieved. Since this does not occur, it is possible to perform double-sided polishing with extremely high polishing accuracy, and since there is no damage to the machined surface due to dust, etc.
It was confirmed that the machining efficiency could be improved by 0%, and that the machining efficiency was 3 to 5 times that of the conventional machining method.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例を示す側面図、第2図は、
第1図の2点鎖線1一1における断面図である。 1・・・・・・被加工物、2・・…・研磨パッド、3…
・・・伝動軸、4・・・・・・ガイド、5・・・・・・
ガイドローラ、6..・…上ブタ、7……ベース、8…
…ローラガイド、9,10・・・・・・研磨液供給口、
11・・・・・・ボール、12・・・・・・加圧板、1
4・・・・・・加圧バネ、15・・・・・・当て板。 オ/賊 オ2図
FIG. 1 is a side view showing one embodiment of the present invention, and FIG. 2 is a side view showing an embodiment of the present invention.
FIG. 2 is a sectional view taken along the two-dot chain line 1-1 in FIG. 1; 1... Workpiece, 2... Polishing pad, 3...
...Transmission shaft, 4...Guide, 5...
Guide roller, 6. ..・...Top pig, 7...Base, 8...
...roller guide, 9,10...polishing liquid supply port,
11... Ball, 12... Pressure plate, 1
4... Pressure spring, 15... Backing plate. O/Thief O 2 figure

Claims (1)

【特許請求の範囲】[Claims] 1 上枠と下枠とを密接し、枠の内部に円筒状の空間を
形成する密閉室と、該密閉室の円筒室間内に円筒軸心と
同心に回転自在に配設される円板状の被加工物と交互に
積重される前記加工物より小径の円筒形状の加工具であ
って、前記被加工物に偏心する位置に配置された複数の
研磨パツドと、該研磨パツドの外周に当接し、研磨パツ
ドを回転させる回転手段と、交互に積重する被加工物と
研磨パツドを相互に圧接する向きに付勢する押圧手段と
を備えることを特徴とする円板の両面仕上装置。
1. A sealed chamber in which an upper frame and a lower frame are brought into close contact with each other to form a cylindrical space inside the frame, and a disk rotatably disposed concentrically with the cylinder axis between the cylindrical chambers of the sealed chamber. A cylindrical processing tool having a smaller diameter than the workpiece and stacked alternately with a shaped workpiece, comprising a plurality of polishing pads arranged at positions eccentric to the workpiece, and an outer periphery of the polishing pad. A double-sided finishing device for a disk, characterized in that it is equipped with a rotating means for rotating a polishing pad in contact with the polishing pad, and a pressing means for biasing workpieces and polishing pads stacked alternately in a direction in which they are brought into pressure contact with each other. .
JP55013693A 1980-02-08 1980-02-08 Double-sided finishing device for discs Expired JPS608188B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55013693A JPS608188B2 (en) 1980-02-08 1980-02-08 Double-sided finishing device for discs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55013693A JPS608188B2 (en) 1980-02-08 1980-02-08 Double-sided finishing device for discs

Publications (2)

Publication Number Publication Date
JPS56114663A JPS56114663A (en) 1981-09-09
JPS608188B2 true JPS608188B2 (en) 1985-03-01

Family

ID=11840263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55013693A Expired JPS608188B2 (en) 1980-02-08 1980-02-08 Double-sided finishing device for discs

Country Status (1)

Country Link
JP (1) JPS608188B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2513426B2 (en) * 1993-09-20 1996-07-03 日本電気株式会社 Wafer polishing machine
JP2009044979A (en) * 2007-08-17 2009-03-05 Shizuoka Prefecture Device for rearing aquatic organism

Also Published As

Publication number Publication date
JPS56114663A (en) 1981-09-09

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