JPS6074496A - 浸漬沸騰冷却装置 - Google Patents

浸漬沸騰冷却装置

Info

Publication number
JPS6074496A
JPS6074496A JP58181893A JP18189383A JPS6074496A JP S6074496 A JPS6074496 A JP S6074496A JP 58181893 A JP58181893 A JP 58181893A JP 18189383 A JP18189383 A JP 18189383A JP S6074496 A JPS6074496 A JP S6074496A
Authority
JP
Japan
Prior art keywords
temperature
circuit board
printed circuit
cooling device
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58181893A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0358554B2 (cs
Inventor
河野　恭一郎
村瀬　曄生
坂村　利弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58181893A priority Critical patent/JPS6074496A/ja
Publication of JPS6074496A publication Critical patent/JPS6074496A/ja
Publication of JPH0358554B2 publication Critical patent/JPH0358554B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58181893A 1983-09-29 1983-09-29 浸漬沸騰冷却装置 Granted JPS6074496A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58181893A JPS6074496A (ja) 1983-09-29 1983-09-29 浸漬沸騰冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58181893A JPS6074496A (ja) 1983-09-29 1983-09-29 浸漬沸騰冷却装置

Publications (2)

Publication Number Publication Date
JPS6074496A true JPS6074496A (ja) 1985-04-26
JPH0358554B2 JPH0358554B2 (cs) 1991-09-05

Family

ID=16108724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58181893A Granted JPS6074496A (ja) 1983-09-29 1983-09-29 浸漬沸騰冷却装置

Country Status (1)

Country Link
JP (1) JPS6074496A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065245A1 (ja) * 2009-11-24 2011-06-03 ボッシュ株式会社 電子部品用冷却装置
DE102020104336A1 (de) 2020-02-19 2021-08-19 Schaeffler Technologies AG & Co. KG Leistungselektronische Einrichtung sowie leistungselektronisches Funktionssystem

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065245A1 (ja) * 2009-11-24 2011-06-03 ボッシュ株式会社 電子部品用冷却装置
DE102020104336A1 (de) 2020-02-19 2021-08-19 Schaeffler Technologies AG & Co. KG Leistungselektronische Einrichtung sowie leistungselektronisches Funktionssystem

Also Published As

Publication number Publication date
JPH0358554B2 (cs) 1991-09-05

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