JPS6062130A - Connecting method using shape memory alloy - Google Patents

Connecting method using shape memory alloy

Info

Publication number
JPS6062130A
JPS6062130A JP58169164A JP16916483A JPS6062130A JP S6062130 A JPS6062130 A JP S6062130A JP 58169164 A JP58169164 A JP 58169164A JP 16916483 A JP16916483 A JP 16916483A JP S6062130 A JPS6062130 A JP S6062130A
Authority
JP
Japan
Prior art keywords
small
gage
memory alloy
shape memory
gage wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58169164A
Inventor
Masakazu Ishino
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58169164A priority Critical patent/JPS6062130A/en
Publication of JPS6062130A publication Critical patent/JPS6062130A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

PURPOSE:To facilitate the electrical connection and exchange of a fine section by using a small-gage wire consisting of a shape memory alloy unified with a terminal for connection and returning the small-gage wire to an initial shape by heating. CONSTITUTION:Small-gage wires 3 consisting of a shape memory alloy are plastically deformed previously to the upper side so that a semiconductor chip 2 is easy to be incorporated to the predetermined position of a frame 1. When a temperature of a transformation point or higher is applied after an incorporation and the small-gage wires are returned to a shape before a plastic deformation and brought into contact with metallic pads 4 on the chip 2, the small-gage wires 3 press and fix the pads 4. When exchanging the chips, the small-gage wires 3 are plastically deformed again to the upper side, applied pressure is removed and the chips are exchanged, and the temperature of the transformation point or higher is applied again. Various transformation temperatures can be set according to the required characteristics of the small-gage wires 3 composed of the shape memory alloy, but 30-100 deg.C is proper.
JP58169164A 1983-09-16 1983-09-16 Connecting method using shape memory alloy Pending JPS6062130A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58169164A JPS6062130A (en) 1983-09-16 1983-09-16 Connecting method using shape memory alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58169164A JPS6062130A (en) 1983-09-16 1983-09-16 Connecting method using shape memory alloy

Publications (1)

Publication Number Publication Date
JPS6062130A true JPS6062130A (en) 1985-04-10

Family

ID=15881451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58169164A Pending JPS6062130A (en) 1983-09-16 1983-09-16 Connecting method using shape memory alloy

Country Status (1)

Country Link
JP (1) JPS6062130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102449750A (en) * 2010-09-25 2012-05-09 华为技术有限公司 Method for welding chip to electronic circuit
US9332639B2 (en) 2014-07-07 2016-05-03 International Business Machines Corporation Ball grid array rework

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102449750A (en) * 2010-09-25 2012-05-09 华为技术有限公司 Method for welding chip to electronic circuit
EP2499665A1 (en) * 2010-09-25 2012-09-19 Huawei Technologies Co., Ltd. Electric device and method of bonding chip to external electric circuit
EP2499665A4 (en) * 2010-09-25 2013-04-03 Huawei Tech Co Ltd Electric device and method of bonding chip to external electric circuit
US8822276B2 (en) 2010-09-25 2014-09-02 Huawei Technologies Co., Ltd. Magnetic integration double-ended converter
US9332639B2 (en) 2014-07-07 2016-05-03 International Business Machines Corporation Ball grid array rework
US9338885B2 (en) 2014-07-07 2016-05-10 International Business Machines Corporation Ball grid array rework
US9978706B2 (en) 2014-07-07 2018-05-22 International Business Machines Corporation Ball grid array rework

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