JPS6059561U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6059561U
JPS6059561U JP15141983U JP15141983U JPS6059561U JP S6059561 U JPS6059561 U JP S6059561U JP 15141983 U JP15141983 U JP 15141983U JP 15141983 U JP15141983 U JP 15141983U JP S6059561 U JPS6059561 U JP S6059561U
Authority
JP
Japan
Prior art keywords
ceramic substrate
multilayer ceramic
leadless chip
semiconductor equipment
chip carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15141983U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129802Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
鍋田　照行
村竹　清
哲史 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15141983U priority Critical patent/JPS6059561U/ja
Publication of JPS6059561U publication Critical patent/JPS6059561U/ja
Application granted granted Critical
Publication of JPH0129802Y2 publication Critical patent/JPH0129802Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP15141983U 1983-09-29 1983-09-29 半導体装置 Granted JPS6059561U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15141983U JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15141983U JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS6059561U true JPS6059561U (ja) 1985-04-25
JPH0129802Y2 JPH0129802Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-09-11

Family

ID=30335548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15141983U Granted JPS6059561U (ja) 1983-09-29 1983-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS6059561U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252497A (ja) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd 多層セラミック基板
JP2007173669A (ja) * 2005-12-26 2007-07-05 Murata Mfg Co Ltd 多層回路基板及びｉｃパッケージ
JP2017126710A (ja) * 2016-01-15 2017-07-20 株式会社村田製作所 複合電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252497A (ja) * 1988-08-17 1990-02-22 Murata Mfg Co Ltd 多層セラミック基板
JP2007173669A (ja) * 2005-12-26 2007-07-05 Murata Mfg Co Ltd 多層回路基板及びｉｃパッケージ
JP2017126710A (ja) * 2016-01-15 2017-07-20 株式会社村田製作所 複合電子部品

Also Published As

Publication number Publication date
JPH0129802Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-09-11

Similar Documents

Publication Publication Date Title
JPS6059561U (ja) 半導体装置
JPS593549U (ja) 半導体装置
JPS58120662U (ja) チツプキヤリヤ−
JPS60141129U (ja) リ−ドレスチツプキヤリアの端子構造
JPS58122461U (ja) 実装基板
JPS5954938U (ja) リ−ドレスパッケ−ジの多段構造
JPS58499U (ja) 半導体装置のキャリア
JPS6025170U (ja) プリント基板の端子接続用パッドの配設構造
JPS5954952U (ja) 半導体装置
JPS6045447U (ja) 半導体装置
JPS6094861U (ja) 印刷回路装置
JPS58195445U (ja) 半導体集積回路パツケ−ジ
JPS59146953U (ja) 半導体用パツケ−ジ
JPS6042757U (ja) ハイブリッド回路モジュ−ル
JPS6025157U (ja) 半導体装置
JPS6138954U (ja) 半導体装置
JPS6045494U (ja) 混成集積回路装置
JPS60111064U (ja) ハイブリツドｉｃ用回路基板
JPS59171352U (ja) 半導体装置
JPS5942982U (ja) 半導体パツケ−ジ試験用基板
JPS6088564U (ja) 半導体装置
JPS6025108U (ja) 高密度集合抵抗体
JPS60194372U (ja) 混成集積回路
JPS5858358U (ja) 混成集積回路
JPS5920675U (ja) 印刷配線板の積層構造