JPS6046040A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6046040A
JPS6046040A JP58154551A JP15455183A JPS6046040A JP S6046040 A JPS6046040 A JP S6046040A JP 58154551 A JP58154551 A JP 58154551A JP 15455183 A JP15455183 A JP 15455183A JP S6046040 A JPS6046040 A JP S6046040A
Authority
JP
Japan
Prior art keywords
electrode
pellet
lead
semiconductor
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58154551A
Other languages
Japanese (ja)
Inventor
Masamichi Murase
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP58154551A priority Critical patent/JPS6046040A/en
Publication of JPS6046040A publication Critical patent/JPS6046040A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Abstract

PURPOSE:To enable to reduce the connecting pad region of a semiconductor ele- ment having many pins in high density by connecting a plurality of electrode pads on the element for one electrode lead pin in case of connecting leads to the element. CONSTITUTION:An electrode pad 302 and 2-layer lead electrodes 303 provided on a semiconductor element (pellet) 301 are connected. The first conductor layer 305 of the lead electrode is connected to the electrode pad 302a of the end 309 side of the pellet, and the second conductor layer 308 of the lead electrode is connected to the electrode pad 302b at the center side of the element region of the pellet. Thus, one lead electrode 303 is connected to the two electrode pads 302a, 302b on the element, and a semiconductor device in which many pins of the element can be formed by highly integrating and increasing the density without increasing the size of the element (pellet) 301 can be obtained.
JP58154551A 1983-08-24 1983-08-24 Semiconductor device Pending JPS6046040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58154551A JPS6046040A (en) 1983-08-24 1983-08-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58154551A JPS6046040A (en) 1983-08-24 1983-08-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6046040A true JPS6046040A (en) 1985-03-12

Family

ID=15586719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58154551A Pending JPS6046040A (en) 1983-08-24 1983-08-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6046040A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226046U (en) * 1985-07-30 1987-02-17
JPS62226637A (en) * 1986-03-28 1987-10-05 Nec Corp Tape carrier for semiconductor device
JPS6377127A (en) * 1986-09-19 1988-04-07 Mitsubishi Electric Corp Semiconductor device
JPS6414934A (en) * 1987-07-09 1989-01-19 Toshiba Corp Semiconductor integrated circuit device and film carrier tape
JPH01241140A (en) * 1988-03-14 1989-09-26 Internatl Business Mach Corp <Ibm> Tape bonding package
JPH02235351A (en) * 1989-01-30 1990-09-18 Internatl Business Mach Corp <Ibm> Semiconductor chip assembly
JPH0397241A (en) * 1989-09-11 1991-04-23 Takehide Shirato Semiconductor device
JPH0397238A (en) * 1989-09-11 1991-04-23 Takehide Shirato Semiconductor device
WO1992000603A1 (en) * 1990-06-26 1992-01-09 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
JPH04277639A (en) * 1991-02-11 1992-10-02 Internatl Business Mach Corp <Ibm> Mount structure for electronic component
JPH0677294A (en) * 1992-07-13 1994-03-18 Samsung Electron Co Ltd Semiconductor package provided with stacked lead and its bonding method
JPH06120285A (en) * 1992-03-04 1994-04-28 Internatl Business Mach Corp <Ibm> Apparatus and method for reconstitution of input/output point of integrated circuit device and formation method of element for reconstitution of input/output point
JP2005079581A (en) * 2003-09-03 2005-03-24 Samsung Electronics Co Ltd Tape substrate, semiconductor chip package using tape substrate, and lcd device using semiconductor chip package

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226046U (en) * 1985-07-30 1987-02-17
JPS62226637A (en) * 1986-03-28 1987-10-05 Nec Corp Tape carrier for semiconductor device
JPH0588547B2 (en) * 1986-03-28 1993-12-22 Nippon Electric Co
JPH0533824B2 (en) * 1986-09-19 1993-05-20 Mitsubishi Electric Corp
JPS6377127A (en) * 1986-09-19 1988-04-07 Mitsubishi Electric Corp Semiconductor device
JPS6414934A (en) * 1987-07-09 1989-01-19 Toshiba Corp Semiconductor integrated circuit device and film carrier tape
JPH01241140A (en) * 1988-03-14 1989-09-26 Internatl Business Mach Corp <Ibm> Tape bonding package
JPH02235351A (en) * 1989-01-30 1990-09-18 Internatl Business Mach Corp <Ibm> Semiconductor chip assembly
JPH0397241A (en) * 1989-09-11 1991-04-23 Takehide Shirato Semiconductor device
JPH0397238A (en) * 1989-09-11 1991-04-23 Takehide Shirato Semiconductor device
WO1992000603A1 (en) * 1990-06-26 1992-01-09 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
US5313367A (en) * 1990-06-26 1994-05-17 Seiko Epson Corporation Semiconductor device having a multilayer interconnection structure
JPH04277639A (en) * 1991-02-11 1992-10-02 Internatl Business Mach Corp <Ibm> Mount structure for electronic component
JPH06120285A (en) * 1992-03-04 1994-04-28 Internatl Business Mach Corp <Ibm> Apparatus and method for reconstitution of input/output point of integrated circuit device and formation method of element for reconstitution of input/output point
JPH0677294A (en) * 1992-07-13 1994-03-18 Samsung Electron Co Ltd Semiconductor package provided with stacked lead and its bonding method
JP2005079581A (en) * 2003-09-03 2005-03-24 Samsung Electronics Co Ltd Tape substrate, semiconductor chip package using tape substrate, and lcd device using semiconductor chip package

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