JPS6026692A - 電気めつき方法 - Google Patents
電気めつき方法Info
- Publication number
- JPS6026692A JPS6026692A JP13447083A JP13447083A JPS6026692A JP S6026692 A JPS6026692 A JP S6026692A JP 13447083 A JP13447083 A JP 13447083A JP 13447083 A JP13447083 A JP 13447083A JP S6026692 A JPS6026692 A JP S6026692A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- anode
- electroplating
- holes
- electrolytic cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 abstract description 15
- 239000010802 sludge Substances 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13447083A JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13447083A JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6026692A true JPS6026692A (ja) | 1985-02-09 |
| JPS648077B2 JPS648077B2 (enrdf_load_stackoverflow) | 1989-02-13 |
Family
ID=15129070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13447083A Granted JPS6026692A (ja) | 1983-07-25 | 1983-07-25 | 電気めつき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6026692A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63213698A (ja) * | 1986-12-19 | 1988-09-06 | ペルメレック・ソチエタ・ペル・アツィオーニ | 高電流密度亜鉛めっきプロセスのための永久陽極 |
| EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5731917B2 (ja) | 2011-06-30 | 2015-06-10 | 上村工業株式会社 | 表面処理装置およびめっき槽 |
-
1983
- 1983-07-25 JP JP13447083A patent/JPS6026692A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63213698A (ja) * | 1986-12-19 | 1988-09-06 | ペルメレック・ソチエタ・ペル・アツィオーニ | 高電流密度亜鉛めっきプロセスのための永久陽極 |
| EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
| WO2008101740A1 (en) * | 2007-02-22 | 2008-08-28 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS648077B2 (enrdf_load_stackoverflow) | 1989-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3215412B2 (ja) | 基板上に微細な回路パターンを形成する装置 | |
| US4534832A (en) | Arrangement and method for current density control in electroplating | |
| JP3379755B2 (ja) | 金属めっき装置 | |
| GB1422466A (en) | Method of plating holes | |
| JP2002054000A (ja) | 基板の電解めっき方法 | |
| TW490510B (en) | Method and apparatus for producing electrolytic copper foil | |
| US3769179A (en) | Copper plating process for printed circuits | |
| KR20020042730A (ko) | 상호 절연된 판 및 막 재료 피스의 도전성 표면을 전해처리하는 방법 및 장치와 그 방법의 이용 | |
| JPS6026692A (ja) | 電気めつき方法 | |
| JPS63149390A (ja) | 電解金属箔の製造方法とそれに用いる装置 | |
| CN114959820A (zh) | 具有精细线路的柔性线路板的制作方法及柔性线路板 | |
| JPS62133097A (ja) | 半導体ウエハのめつき装置 | |
| Yung et al. | The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture | |
| CN108914178A (zh) | 一种解决电镀法制备吸液芯厚度不均的方法 | |
| CN107761158A (zh) | 一种电镀设备及电镀方法 | |
| JPS6147918B2 (enrdf_load_stackoverflow) | ||
| KR200358909Y1 (ko) | 양면 균일 도금층을 갖게 하는 전기도금장치 | |
| CN222908130U (zh) | 电镀均匀的印制线路板电镀设备及垂直电镀生产线 | |
| JPH0853796A (ja) | 印刷回路用銅箔の製造方法 | |
| CN202688475U (zh) | 阴极挡板及其掩模板电铸装置 | |
| CN210736927U (zh) | 一种高性能pcb板电镀装置 | |
| JP2567537B2 (ja) | 金属箔電解製造装置 | |
| JP2629018B2 (ja) | 粗化めっき方法 | |
| JPS63282288A (ja) | 電解金属箔の製造方法とそれに用いる装置 | |
| CN119877072A (zh) | 一种可实现内外膜厚精准控制的电镀方法 |