JPS60261159A - マイクロ波回路装置 - Google Patents

マイクロ波回路装置

Info

Publication number
JPS60261159A
JPS60261159A JP59117053A JP11705384A JPS60261159A JP S60261159 A JPS60261159 A JP S60261159A JP 59117053 A JP59117053 A JP 59117053A JP 11705384 A JP11705384 A JP 11705384A JP S60261159 A JPS60261159 A JP S60261159A
Authority
JP
Japan
Prior art keywords
transistor
holes
circuit device
view
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59117053A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354863B2 (enrdf_load_stackoverflow
Inventor
Takashi Machida
町田　高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59117053A priority Critical patent/JPS60261159A/ja
Publication of JPS60261159A publication Critical patent/JPS60261159A/ja
Publication of JPH0354863B2 publication Critical patent/JPH0354863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)
JP59117053A 1984-06-07 1984-06-07 マイクロ波回路装置 Granted JPS60261159A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59117053A JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59117053A JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Publications (2)

Publication Number Publication Date
JPS60261159A true JPS60261159A (ja) 1985-12-24
JPH0354863B2 JPH0354863B2 (enrdf_load_stackoverflow) 1991-08-21

Family

ID=14702254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59117053A Granted JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Country Status (1)

Country Link
JP (1) JPS60261159A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167818A (ja) * 1994-12-14 1996-06-25 Nec Corp 高周波装置
EP0876088A3 (en) * 1997-05-02 1999-10-27 NEC Corporation Semiconductor microwave amplifier
JP2020205372A (ja) * 2019-06-18 2020-12-24 矢崎総業株式会社 増幅回路基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013110A (ja) * 1996-06-25 1998-01-16 Murata Mfg Co Ltd 非可逆回路素子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167818A (ja) * 1994-12-14 1996-06-25 Nec Corp 高周波装置
EP0876088A3 (en) * 1997-05-02 1999-10-27 NEC Corporation Semiconductor microwave amplifier
JP2020205372A (ja) * 2019-06-18 2020-12-24 矢崎総業株式会社 増幅回路基板

Also Published As

Publication number Publication date
JPH0354863B2 (enrdf_load_stackoverflow) 1991-08-21

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