JPS60227487A - Heater chip - Google Patents
Heater chipInfo
- Publication number
- JPS60227487A JPS60227487A JP59084421A JP8442184A JPS60227487A JP S60227487 A JPS60227487 A JP S60227487A JP 59084421 A JP59084421 A JP 59084421A JP 8442184 A JP8442184 A JP 8442184A JP S60227487 A JPS60227487 A JP S60227487A
- Authority
- JP
- Japan
- Prior art keywords
- heater chip
- thermocouple
- temperature
- heater
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002844 melting Methods 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 11
- 239000000470 constituent Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910001006 Constantan Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910000809 Alumel Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000982634 Tragelaphus eurycerus Species 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910001179 chromel Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Resistance Heating (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は温度制御の精密度の向上を計ったヒーターチッ
プに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a heater chip that improves the accuracy of temperature control.
従来から半導体装置組立用に用いられている常時加熱熱
圧着用のヒーターチップとしては、公知文献である「Ｄ
ＩＡＭＯＮＤ−ＴＩＰＰＥＤ ＡＮＤ ０ＴＨＥＲＮＥ
ＷＴＨＥＲＭＯＤＥＳ ＦＯＲＤＥＶＩＣＥ ＢＯＮＤ
ＩＮＧＪ ＣＨ１４５’７−１／り９／ １０００−０
１８７１９７９ 、 Ｉ ＥＥＥ、 Ｒ，Ｃ，ＫＥＲ８
ＨＮＥＲ著に記載のヒーターチップがある。これにはヒ
ーターチップの温度計測又は制御用としてヒーターチッ
プ本体又は近傍の支持体に熱電対保持用の小孔を設け、
該小孔に熱電対を入れて測定する構成が示しである。更
に詳しい熱電対の保持については、「半導体素子用ヒー
トシンク］。カタログ隔、８２１９８１．１０．７銖す
ヨサン発行の第９頁に記載されているように、小隙に熱
電対を挾み、ネジで押え込む方法が示されている。しか
しながら、このような方法によって可動部であるし一タ
ーチップにネジ止めすることは極めて困難であるととも
に、容易に熱電対が断線してしまうため、一般には、前
記ヒーターチップの小孔中に熱電対を単に差し込むだけ
か、或いは無機質セメントによシ小孔中に埋め込む方法
がとられていた。As a heater chip for constant heating and thermocompression that has been conventionally used for semiconductor device assembly, there is a well-known document "D
IAMOND-TIPPED AND 0THERNE
WTHERMODES FORDEVICE BOND
INGJ CH145'7-1/ri9/1000-0
1871979, IEEE, R, C, KER8
There is a heater chip described by HNER. In order to measure or control the temperature of the heater chip, a small hole for holding a thermocouple is provided in the heater chip body or a nearby support.
A configuration in which a thermocouple is inserted into the small hole for measurement is shown. For more detailed information on holding thermocouples, see "Heat Sink for Semiconductor Devices." As described on page 9 of the catalog, 821981.10.7, published by Kinsuyosan, put the thermocouple in a small gap and tighten the screws. However, since it is a moving part, it is extremely difficult to screw the thermocouple onto the tip using this method, and the thermocouple easily breaks, so generally, The thermocouple has been simply inserted into the small hole of the heater chip, or it has been embedded in the small hole with inorganic cement.
又、パルス電流加熱方式のヒーターチップについては、
文献「ＥＬＥＣＴＲＯＮＩＣ５Ｊ ＭＡＹ、 １６．１
９７４や［電子材料Ｊ１９７６年４月号、４４頁に記載
のように、温度制御は、ヒーターチップ温度の計測をし
ないで行われていた。あるいは前記のようにヒーターチ
ップに小孔をあけ、熱電対を差し込むか、無機質セメン
トにより小孔中に埋め込む方法がとられていた。これら
の方法では、可動部であるヒーターチップ又は支持部の
小孔中に取りつけられているので、容易に脱落したり、
あるいは接触不良を起し、正しい温度コントロールが出
来ずにヒーターチップの温度が過度に上昇したり、過大
パルス電流が流れてヒーターチップを破壊したりする欠
点があった。このようにヒーターチップの温度暴走が起
ると、熱に弱い半導体装置が破壊されたり、特性不良を
起し生産歩留が低下してしまうことになっていた。In addition, regarding the pulse current heating type heater chip,
Literature “ELECTRONIC5J MAY, 16.1
As described in 974 and [Electronic Materials J, April 1976 issue, p. 44, temperature control was performed without measuring the heater chip temperature. Alternatively, as described above, a method has been used in which a small hole is made in the heater chip and a thermocouple is inserted, or the thermocouple is embedded in the small hole with inorganic cement. In these methods, since the heater chip is a movable part or is attached to a small hole in the support part, it can easily fall off or
Otherwise, poor contact may occur, and proper temperature control may not be possible, causing the temperature of the heater chip to rise excessively, or an excessive pulse current may flow, causing damage to the heater chip. If temperature runaway of the heater chip occurs in this manner, the semiconductor device, which is sensitive to heat, may be destroyed, or characteristic defects may occur, resulting in a decrease in production yield.
本発明は従来のこれらの欠点を除去し、正確な温度制御
の可能なヒーターチップを提供するものである。The present invention eliminates these conventional drawbacks and provides a heater chip that allows accurate temperature control.
〔発明の構成〕
本発明は、ヒーターチップ構成材と熱電対の対を構成し
ている先端材とのいずれか又は両方の構成材の一部を溶
融せしめて熱電対を取りつけ、該溶融部を冷却固化して
前記熱電対をヒーターチップの温度計測部に支持したこ
とを特徴とするヒーターチップである。[Structure of the Invention] The present invention involves melting a part of either or both of the constituent materials of the heater chip and the tip material constituting the thermocouple pair, attaching the thermocouple, and removing the melted portion. This heater chip is characterized in that the thermocouple is supported by a temperature measuring part of the heater chip after being cooled and solidified.
具体的にはヒーターチップの作用端近辺に温度計測用の
熱電対端が構成されたまま該対端を溶融し、あるいは熱
電対を構成すべき異種金属材を１対用意し、該１対の金
属材を溶融接着すると同時に、前記ヒーターチップに接
着させたもの及びヒーターチップの作用端近辺を部分的
に溶融せしめ該溶融部に熱電対端を埋設したもの、及び
ヒーターチップの作用端近辺に熱電対端、又は１対の異
種金属を接触させ、それらの金属材を部分的に溶融せし
めあるいは、対を構成させながら溶融せしめたヒーター
チップである。このような熱電対付きヒーターチップは
、ＣＯｌやＹＡＧ 、ルビー等のレーザー光線や電子ビ
ームによる溶接法やスポットウェルドによる溶接法によ
って得られる。Specifically, a thermocouple end for temperature measurement is formed near the active end of the heater chip, and the opposite end is melted, or a pair of dissimilar metal materials to be used as a thermocouple is prepared, and the pair of dissimilar metals is prepared. At the same time as the metal material is melted and bonded, there are those that are bonded to the heater chip, those that partially melt the area near the working end of the heater chip and a thermocouple end embedded in the melted part, and those that bond the thermoelectric material near the active end of the heater chip. It is a heater chip in which opposite ends or a pair of dissimilar metals are brought into contact and the metal materials are partially melted or melted while forming a pair. Such a heater chip with a thermocouple can be obtained by a welding method using a COI, YAG, or ruby laser beam or an electron beam, or a welding method using spot welding.
以下に、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
（実施例１）
第１図のようなモリブデン材で構成されたパルス電流加
熱方式のヒーターチップ１を準備し、第２図に示すよう
に該ヒーターチップ１の加熱作用端３の中央付近に０．
５１１径のＣｕ線２′とコンスタンタン線２″との先端
を合わせて支持し、ＣＯＺレーザー装置により該熱電対
線２のＣｕ線２′とコンスタンクン線２″の交点を０．
２秒レーザー線照射して熱電対先端４を形成すると同時
に作用端３に該対先端４を溶接して、所望の熱電対付き
のヒーターチップを完成する。(Example 1) A pulse current heating type heater chip 1 made of molybdenum material as shown in FIG. 1 is prepared, and as shown in FIG. ．．
The ends of a Cu wire 2' and a Constantan wire 2'' with a diameter of 511 mm are supported together, and the intersection of the Cu wire 2' and the Constantan wire 2'' of the thermocouple wire 2 is set to 0.5 mm using a COZ laser device.
A laser beam is irradiated for 2 seconds to form a thermocouple tip 4, and at the same time, the paired tip 4 is welded to the working end 3 to complete a heater chip with a desired thermocouple.
（実施例２）
第３図にはヒーターチップ材質をタングステンにした場
合で電子ビーム溶接を行った例を示しである。本例の場
合はあらかじめアルメル、クロメ５を押しつぶして扁平
とし、電子ビーム溶接して熱電対２をヒーターチップ１
に取シ付ける。電子ビーム線は熱電対先端５の周辺に数
回照射することによりこれを部分的に溶融し、点状固着
部６を形成して溶接する。(Example 2) FIG. 3 shows an example in which electron beam welding was performed using tungsten as the heater chip material. In this example, the alumel and chrome 5 are crushed and flattened in advance, and the thermocouple 2 is attached to the heater chip 1 by electron beam welding.
Attach to. The electron beam is irradiated around the thermocouple tip 5 several times to partially melt it, forming a point-like fixed portion 6 and welding it.
実施例１．２のヒーターチップと、従来の開化内に熱電
対を挿入したヒーターチップとを、その温度制御性を比
較したところ、第４図に示すように大きな差が出だ。第
４図中、実線は本発明によるヒーターチップの特性、破
線は従来のヒーターチップの特性を示す。When comparing the temperature controllability of the heater chip of Example 1.2 and a conventional heater chip in which a thermocouple was inserted into the opening, a large difference was found as shown in FIG. In FIG. 4, the solid line shows the characteristics of the heater chip according to the present invention, and the broken line shows the characteristics of the conventional heater chip.
第４図は同一形態のヒーターチップを準備し、一定時間
（３秒）のパルス電流を負荷したヒーターチップの熱電
対の指示温度を記録したものである。実施例１．２のも
のでは、パルス電圧負荷後、０．５秒でほぼ規定の温度
を示し、１秒〜３秒の間は完全にヒーターチップ温度を
一定になるように制御している。一方、従来例では、パ
ルス電圧を印加した場合に応答遅延があるばかりでなく
、パルス電圧負荷停止後も応答遅延があり、温度制御が
ほとんど出来ていないことを示している。In FIG. 4, a heater chip of the same type was prepared, and the temperature indicated by the thermocouple of the heater chip was recorded while a pulse current was applied for a certain period of time (3 seconds). In Example 1.2, the temperature of the heater chip is controlled to be almost the specified temperature in 0.5 seconds after the pulse voltage is applied, and the temperature of the heater chip is completely constant for 1 second to 3 seconds. On the other hand, in the conventional example, there is not only a response delay when a pulse voltage is applied, but also a response delay even after the pulse voltage load is stopped, indicating that temperature control is hardly possible.
これは、本発明では熱電対とヒーターチップ接合部との
間の熱抵抗が小さく、温度変化応答性の良い状態が保た
れているからである。This is because, in the present invention, the thermal resistance between the thermocouple and the heater chip junction is small, and a state of good temperature change responsiveness is maintained.
このように熱電対とヒーターチップ接合部との間の熱抵
抗を小さくするような熱電対の取りつけ方をヒーターチ
ップ材料、熱電対の種類を変えて検討し、良い結果を得
た例を第５図〜第８図に断面図でもって示しである。ヒ
ーターチップ材料としては、ステンレス材、ニッケル材
、タングステン合金材、モリブデン合金材等が良いこと
が判った。又、熱電対としてはクロメル・コンスタンタ
ン、白金・白金ロジウム等も適用可能であることが判っ
た。これらはいずれもレーザー溶接又は電子ビーム溶接
あるいはスポットウェルド可能な金属、合金類であれば
良い。In this way, we examined how to attach a thermocouple to reduce the thermal resistance between the thermocouple and the heater chip junction by changing the heater chip material and the type of thermocouple, and we will show an example in which good results were obtained. This is shown in cross-sectional views in FIGS. It has been found that stainless steel, nickel, tungsten alloy, molybdenum alloy, etc. are good materials for the heater chip. It has also been found that chromel/constantan, platinum/platinum rhodium, etc. can be used as thermocouples. All of these may be metals or alloys that can be laser welded, electron beam welded, or spot welded.
第５図〜第８図において、ｌはヒーターチップ、２は熱
電対、５は熱電対先端、７は溶融接続部、８はろう材を
示している。5 to 8, 1 is a heater chip, 2 is a thermocouple, 5 is a tip of the thermocouple, 7 is a molten joint, and 8 is a brazing material.
第５図では溶融接続部７はヒーター千ツブｌ材の一部と
なっており、第６図では溶融接続部７は平型テープ熱電
対２の対構成材の一部となっている。また第７図では溶
融接続部７はヒーターチップ１材の一部と熱電対先端５
の一部とになっており、第８図では溶融接続部７はニッ
ケルや銀ろう等のろう材８の全部又は一部となっている
。In FIG. 5, the fusion connection 7 is a part of the heater tube material, and in FIG. 6, the fusion connection 7 is a part of the pair component of the flat tape thermocouple 2. In addition, in FIG.
In FIG. 8, the fused joint 7 is all or part of a brazing material 8 such as nickel or silver solder.
以上の構成から明らかなように、熱電対の起電力発生対
部は計測すべきヒーターチップの発熱部又は半導体装置
の組立作用端近傍に設置され、しかも熱電対端はヒータ
ーチップ本体に直接接合するので、その接合部での熱抵
抗は極めて小さくなる。As is clear from the above configuration, the electromotive force generating pair part of the thermocouple is installed near the heat generating part of the heater chip to be measured or the assembly working end of the semiconductor device, and the thermocouple end is directly connected to the heater chip body. Therefore, the thermal resistance at the junction becomes extremely small.
以上説明したように本発明は熱電対の起電力発生対部が
、計測すべきヒーターチップの発熱部又は半導体装置の
組立作用端に近いところに設置でき、又ヒーターチップ
本体に直接熱電対端が接合されているので、該接合部で
の熱抵抗は極めて小さくなシ、ヒーターチップの温度制
御を従来より格段に向上できる。更に、熱電対のヒータ
ーチップとの接触不良や、熱電対はずれによるヒーター
チップ温度の暴走が無いため、ヒーターチップの寿命の
延長や、半導体装置組立条件安定化による歩留を向上で
きる。As explained above, the present invention allows the electromotive force generating pair part of the thermocouple to be installed near the heat generating part of the heater chip to be measured or the assembly active end of the semiconductor device, and also allows the thermocouple end to be placed directly on the heater chip body. Since the heater chips are bonded together, the thermal resistance at the bonded portion is extremely small, and the temperature control of the heater chip can be significantly improved compared to conventional heater chips. Furthermore, since there is no runaway in the temperature of the heater chip due to poor contact between the thermocouple and the heater chip or the thermocouple is dislocated, the life of the heater chip can be extended and the yield can be improved by stabilizing the semiconductor device assembly conditions.
したがって、本発明により半導体装置のような温度に対
して敏感な装置を組立るボングーのヒーターチップとし
て極めて安定した温度制御の可能なヒーターチップの提
供をできる。本発明はヒーターチップの構造がパルスヒ
ート方式だけでなく、常時加熱方式にも適用可能であり
、熱電対固着部はヒーターチップ発熱部のみならず、温
度制御が可能な部分であれば近傍の部分で良いことは明
らかである。Therefore, according to the present invention, a heater chip capable of extremely stable temperature control can be provided as a heater chip for a bongo used in assembling temperature-sensitive devices such as semiconductor devices. The structure of the heater chip of the present invention is applicable not only to the pulse heating method but also to the constant heating method, and the thermocouple fixing part is not only applied to the heat generating part of the heater chip, but also to nearby parts as long as the temperature can be controlled. It is clear that this is a good thing.
第１図〜第３図は本発明の一実施例を示すヒーターチッ
プの平面図、第４図は温度制御比較図、第５図〜第８図
はヒーターチップの熱電対取付部の断面図である。
ｌ・・・ヒーターチップ、２・・熱電対、３・・ヒータ
ーチップの加熱作用端、４．５・・・熱電対先端、６，
７゜８・・・溶融接続部。
特許出願人 日本・電気株式会社
代理人 弁理士 菅 野 中
第３図
児４図
時 間 （秒）
毘５図Figures 1 to 3 are plan views of a heater chip showing one embodiment of the present invention, Figure 4 is a temperature control comparison diagram, and Figures 5 to 8 are cross-sectional views of the thermocouple attachment part of the heater chip. be. l... Heater chip, 2... Thermocouple, 3... Heating action end of heater chip, 4.5... Thermocouple tip, 6,
7゜8...Fused joint. Patent applicant Naka Denki Co., Ltd. Agent Patent attorney Naka Kanno Figure 3 Figure 4 Time (seconds) Figure 5
Claims (1)
とのいずれか又は両方の一部を溶融せしめて熱電対を取
シつけ、該溶融部を冷却固化して前記熱電対をヒーター
チップの温度計測部に支持したことを特徴とするヒータ
ーチップ。(1) Attach the thermocouple by melting a portion of either or both of the heater chip constituent material and the tip member of the thermocouple pair, cool and solidify the melted portion, and attach the thermocouple to the heater chip. A heater chip characterized by being supported on a temperature measuring section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59084421A JPS60227487A (en) | 1984-04-26 | 1984-04-26 | Heater chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59084421A JPS60227487A (en) | 1984-04-26 | 1984-04-26 | Heater chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60227487A true JPS60227487A (en) | 1985-11-12 |
Family
ID=13830116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59084421A Pending JPS60227487A (en) | 1984-04-26 | 1984-04-26 | Heater chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60227487A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237740A (en) * | 1986-04-08 | 1987-10-17 | Agency Of Ind Science & Technol | Method for measuring surface temperature of semiconductor wafer |
| CN112189129A (en) * | 2018-03-28 | 2021-01-05 | 舒尔传感器有限公司 | Integrated temperature control within a diagnostic test sensor |
| CN113369626A (en) * | 2021-06-25 | 2021-09-10 | 中国电子科技集团公司第五十四研究所 | Low-contact thermal resistance mounting method for high-power amplifier chip |
-
1984
- 1984-04-26 JP JP59084421A patent/JPS60227487A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237740A (en) * | 1986-04-08 | 1987-10-17 | Agency Of Ind Science & Technol | Method for measuring surface temperature of semiconductor wafer |
| CN112189129A (en) * | 2018-03-28 | 2021-01-05 | 舒尔传感器有限公司 | Integrated temperature control within a diagnostic test sensor |
| CN112189129B (en) * | 2018-03-28 | 2024-03-08 | 舒尔传感器有限公司 | Integral temperature control within diagnostic test sensor |
| CN113369626A (en) * | 2021-06-25 | 2021-09-10 | 中国电子科技集团公司第五十四研究所 | Low-contact thermal resistance mounting method for high-power amplifier chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3156606B2 (en) | Inspection method and inspection device for electrode bonding strength | |
| JP3504448B2 (en) | Semiconductor device | |
| JPH0637154A (en) | Method and apparatus for bonding | |
| JPH0646169B2 (en) | Thermocouple device | |
| JPS60227487A (en) | Heater chip | |
| JP2904638B2 (en) | Brazing method and brazed joint | |
| JPH01145537A (en) | Thermocouple for measuring temperature | |
| JPH11104819A (en) | Use of silver/copper/palladium brazing filler metal and manufacture of complex forming device | |
| JP5493205B2 (en) | Thermocouple and thermometer using it | |
| JPH0726877B2 (en) | How to install the thermocouple | |
| JP5451158B2 (en) | Heater chip, thermocompression bonding apparatus, and thermocompression bonding method | |
| JPS6115380A (en) | Thermocouple | |
| JPH02241672A (en) | Heater chip and bonding method using this chip | |
| SU1278619A1 (en) | Method for manufacturing hot joint of thermocouple | |
| Nicolics et al. | Laser soldering of thin film sensors | |
| JPH0933360A (en) | Connecting structure of thermocouple | |
| JP2004165085A (en) | Heating device and its manufacturing method | |
| JPH11281498A (en) | Fitting method for sheath thermocouple for measuring temperature of metal body | |
| JPH0531570A (en) | Method for producing casting solidified under control | |
| JP2948341B2 (en) | How to attach the transducer | |
| JP4246449B2 (en) | Bonding strip and bonding method using the strip | |
| US3231707A (en) | Method of manufacturing a thermoelement | |
| JPH057650B2 (en) | ||
| JP2002270074A (en) | Method of measuring fusing temperature of thermal fuse | |
| JPS6239925B2 (en) |