JPS60202947A - Mounting method of semiconductor element - Google Patents

Mounting method of semiconductor element

Info

Publication number
JPS60202947A
JPS60202947A JP6040484A JP6040484A JPS60202947A JP S60202947 A JPS60202947 A JP S60202947A JP 6040484 A JP6040484 A JP 6040484A JP 6040484 A JP6040484 A JP 6040484A JP S60202947 A JPS60202947 A JP S60202947A
Authority
JP
Japan
Prior art keywords
groove
mounting
substrate
spacer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6040484A
Other languages
English (en)
Inventor
Yuichi Suzuki
Hiroshi Kano
Eiji Horikoshi
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6040484A priority Critical patent/JPS60202947A/ja
Publication of JPS60202947A publication Critical patent/JPS60202947A/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
JP6040484A 1984-03-28 1984-03-28 Mounting method of semiconductor element Granted JPS60202947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6040484A JPS60202947A (en) 1984-03-28 1984-03-28 Mounting method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6040484A JPS60202947A (en) 1984-03-28 1984-03-28 Mounting method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS60202947A true JPS60202947A (en) 1985-10-14

Family

ID=13141198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6040484A Granted JPS60202947A (en) 1984-03-28 1984-03-28 Mounting method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS60202947A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854520A2 (en) * 1997-01-20 1998-07-22 Oki Electric Industry Co., Ltd. Method for mounting optical semiconductor device on supporting substrate
CN105304537A (zh) * 2015-11-06 2016-02-03 成都聚合科技有限公司 一种聚光光伏电池芯片固化加载台

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854520A2 (en) * 1997-01-20 1998-07-22 Oki Electric Industry Co., Ltd. Method for mounting optical semiconductor device on supporting substrate
EP0854520A3 (en) * 1997-01-20 1999-06-16 Oki Electric Industry Co., Ltd. Method for mounting optical semiconductor device on supporting substrate
US6087194A (en) * 1997-01-20 2000-07-11 Oki Electric Industry Co., Ltd. Composite unit of optical semiconductor device and supporting substrate and method for mounting optical semiconductor device on supporting substrate
CN105304537A (zh) * 2015-11-06 2016-02-03 成都聚合科技有限公司 一种聚光光伏电池芯片固化加载台

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