JPS60193964U - マグネトロンスパツタ装置のタ−ゲツト - Google Patents

マグネトロンスパツタ装置のタ−ゲツト

Info

Publication number
JPS60193964U
JPS60193964U JP7957784U JP7957784U JPS60193964U JP S60193964 U JPS60193964 U JP S60193964U JP 7957784 U JP7957784 U JP 7957784U JP 7957784 U JP7957784 U JP 7957784U JP S60193964 U JPS60193964 U JP S60193964U
Authority
JP
Japan
Prior art keywords
target
magnetron sputtering
area
sputtering device
magnetic force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7957784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH027870Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
坂本　充則
Original Assignee
ホ−ヤ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホ−ヤ株式会社 filed Critical ホ−ヤ株式会社
Priority to JP7957784U priority Critical patent/JPS60193964U/ja
Publication of JPS60193964U publication Critical patent/JPS60193964U/ja
Application granted granted Critical
Publication of JPH027870Y2 publication Critical patent/JPH027870Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP7957784U 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト Granted JPS60193964U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7957784U JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7957784U JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Publications (2)

Publication Number Publication Date
JPS60193964U true JPS60193964U (ja) 1985-12-24
JPH027870Y2 JPH027870Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-02-26

Family

ID=30624624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7957784U Granted JPS60193964U (ja) 1984-05-31 1984-05-31 マグネトロンスパツタ装置のタ−ゲツト

Country Status (1)

Country Link
JP (1) JPS60193964U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194696A1 (ja) * 2015-05-29 2016-12-08 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194696A1 (ja) * 2015-05-29 2016-12-08 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法
JP2016222975A (ja) * 2015-05-29 2016-12-28 住友金属鉱山株式会社 スパッタリングターゲット及びこれを用いたスパッタリング成膜方法

Also Published As

Publication number Publication date
JPH027870Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-02-26

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