JPS60181609A - メツキ厚測定方法 - Google Patents

メツキ厚測定方法

Info

Publication number
JPS60181609A
JPS60181609A JP3786084A JP3786084A JPS60181609A JP S60181609 A JPS60181609 A JP S60181609A JP 3786084 A JP3786084 A JP 3786084A JP 3786084 A JP3786084 A JP 3786084A JP S60181609 A JPS60181609 A JP S60181609A
Authority
JP
Japan
Prior art keywords
plate
plating thickness
press
plating
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3786084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035524B2 (cs
Inventor
Tadashi Hoshino
忠 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3786084A priority Critical patent/JPS60181609A/ja
Publication of JPS60181609A publication Critical patent/JPS60181609A/ja
Publication of JPH035524B2 publication Critical patent/JPH035524B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Coating With Molten Metal (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP3786084A 1984-02-29 1984-02-29 メツキ厚測定方法 Granted JPS60181609A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3786084A JPS60181609A (ja) 1984-02-29 1984-02-29 メツキ厚測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3786084A JPS60181609A (ja) 1984-02-29 1984-02-29 メツキ厚測定方法

Publications (2)

Publication Number Publication Date
JPS60181609A true JPS60181609A (ja) 1985-09-17
JPH035524B2 JPH035524B2 (cs) 1991-01-25

Family

ID=12509298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3786084A Granted JPS60181609A (ja) 1984-02-29 1984-02-29 メツキ厚測定方法

Country Status (1)

Country Link
JP (1) JPS60181609A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108050972A (zh) * 2017-12-30 2018-05-18 苏州宇邦新型材料股份有限公司 一种圆丝焊带涂层厚度测量装置及测量方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108050972A (zh) * 2017-12-30 2018-05-18 苏州宇邦新型材料股份有限公司 一种圆丝焊带涂层厚度测量装置及测量方法
CN108050972B (zh) * 2017-12-30 2024-02-27 苏州宇邦新型材料股份有限公司 一种圆丝焊带涂层厚度测量装置及测量方法

Also Published As

Publication number Publication date
JPH035524B2 (cs) 1991-01-25

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