JPS60180147A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60180147A
JPS60180147A JP59035826A JP3582684A JPS60180147A JP S60180147 A JPS60180147 A JP S60180147A JP 59035826 A JP59035826 A JP 59035826A JP 3582684 A JP3582684 A JP 3582684A JP S60180147 A JPS60180147 A JP S60180147A
Authority
JP
Japan
Prior art keywords
layer
bump
insulating
wiring layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59035826A
Inventor
Toshio Sonobe
Masakazu Terada
Original Assignee
Nippon Denso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denso Co Ltd filed Critical Nippon Denso Co Ltd
Priority to JP59035826A priority Critical patent/JPS60180147A/en
Publication of JPS60180147A publication Critical patent/JPS60180147A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/11Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys

Abstract

PURPOSE:To prevent a permeation to a wiring layer of moisture from cracks, pin holes, etc. generated in a first insulating layer, and to lengthen the life of an element and improve reliability by forming a second insulating layer between a bump and the first insulating layer protecting the wiring layer. CONSTITUTION:An aluminum wiring layer 2 is shaped on an silicon substrate 1, and first and second insulating layers 3, 4 with opening sections 10 at predetermined positions where a bump is formed are shaped on the upper surface of the layer 2 and on the substrate 1. A contact metallic layer 5 is formed on the surface of the substrate, copper is shaped selectively through an electroplating method to obtain the bump 6, and a solder layer 7 is formed so as to coat the bump 6. Since the surface of the first insulating layer 3 is coated completely with the second insulating layer 4 or the contact metallic layer 5, the wiring layer 2 is not exposed even when pin holes and cracks are generated in the first insulating film 3, and the corrosion of the wiring layer 2 can be prevented.
JP59035826A 1984-02-27 1984-02-27 Semiconductor device Pending JPS60180147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59035826A JPS60180147A (en) 1984-02-27 1984-02-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59035826A JPS60180147A (en) 1984-02-27 1984-02-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60180147A true JPS60180147A (en) 1985-09-13

Family

ID=12452755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59035826A Pending JPS60180147A (en) 1984-02-27 1984-02-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS60180147A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312646A (en) * 1987-06-16 1988-12-21 Nippon Denso Co Ltd Semiconductor device
US4950623A (en) * 1988-08-02 1990-08-21 Microelectronics Center Of North Carolina Method of building solder bumps
US5053851A (en) * 1991-01-14 1991-10-01 International Business Machines Corp. Metal bump for a thermal compression bond and method for making same
US5059553A (en) * 1991-01-14 1991-10-22 Ibm Corporation Metal bump for a thermal compression bond and method for making same
US5227812A (en) * 1990-02-26 1993-07-13 Canon Kabushiki Kaisha Liquid jet recording head with bump connector wiring
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312646A (en) * 1987-06-16 1988-12-21 Nippon Denso Co Ltd Semiconductor device
US4950623A (en) * 1988-08-02 1990-08-21 Microelectronics Center Of North Carolina Method of building solder bumps
US5576748A (en) * 1990-02-26 1996-11-19 Canon Kabushiki Kaisha Recording head with through-hole wiring connection which is disposed within the liquid chamber
US5227812A (en) * 1990-02-26 1993-07-13 Canon Kabushiki Kaisha Liquid jet recording head with bump connector wiring
US5059553A (en) * 1991-01-14 1991-10-22 Ibm Corporation Metal bump for a thermal compression bond and method for making same
US5053851A (en) * 1991-01-14 1991-10-01 International Business Machines Corp. Metal bump for a thermal compression bond and method for making same
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5374893A (en) * 1992-03-04 1994-12-20 Mcnc Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon
US5381946A (en) * 1992-03-04 1995-01-17 Mcnc Method of forming differing volume solder bumps

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