JPS60173900A - Ceramic circuit board - Google Patents
Ceramic circuit boardInfo
- Publication number
- JPS60173900A JPS60173900A JP3003184A JP3003184A JPS60173900A JP S60173900 A JPS60173900 A JP S60173900A JP 3003184 A JP3003184 A JP 3003184A JP 3003184 A JP3003184 A JP 3003184A JP S60173900 A JPS60173900 A JP S60173900A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- copper
- ceramic
- board
- copper circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
し発明の技術分野」
本発明はセラミックス基板上に銅回路板を接合させてな
るセラミックス回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a ceramic circuit board formed by bonding a copper circuit board onto a ceramic substrate.
［発明の技術的背領］
最近、パワー１ヘランジスタ−しシコール用基板やスイ
ッチング電源モジトル用基板新の回路基板 □としＣ，
レラミッソス基（長上に６１１１根等の金属板を接合さ
けたしのか用いられ−Ｃいる。[Technical betrayal of the invention] Recently, new circuit boards such as power 1 transistor circuit boards and switching power module boards have been developed.
A metal plate such as a 6111 root is bonded to the top of the Reramissos base (-C).
従来から、このＪ、うなレラミックス回路ｊＪ板を製造
するに（ま、レラミックス基板の表面に七す−ノデンペ
ースト１を塗イＩＪ、焼結しＣメタライズし、その上に
金属様をろう付けにより接合さけるプｊ法が行４ｆわれ
でいたが、近年所定形状に１］ら抜Ｄ１れた銅回路（ｋ
をセラミックス基（長上に接触前１凸゛さＵ（加熱し、
１接、セラミックス）、Ｌ板と６１１１回路（及とを加
熱接合ざＵる方法が採られるＪ、う【こなつＣきＣいる
。Traditionally, in order to manufacture this JJ board, the surface of the Reramix board is coated with 7-noden paste 1, then sintered and C metallized, and a metal layer is applied on top of it. The copper circuit method, which avoids joining by brazing, has been used for a long time, but in recent years copper circuits (k
1 convexity U (heated,
1 contact (ceramics), L plate and 6111 circuit (and 6111 circuit) are heated and bonded.
［背鰭技術の問題貞］
しかし４Ｔがら、このようにして製造されるしイレミッ
クス回路基板においては、銅回路板とセラミックス基板
どの密着性が必ずしもｌｃ分℃゛なく１υ部的に接合さ
れず、銅回路板が凸状になることがある。このような銅
回路板上にはシリコンベレツ１〜智の電子部品を搭載す
ることが困薦〔Ｃ゛あったり、搭載ＣきＣし部品か傾斜
したり、特性を１員うというような問題かあった。[Problems with dorsal fin technology] However, in 4T, which is manufactured in this way, the adhesion between the copper circuit board and the ceramic board is not necessarily 1υ, and the adhesion between the copper circuit board and the ceramic board is not necessarily 1υ. Copper circuit boards may become convex. It is not recommended to mount electronic components of silicon level 1 to 1 on such a copper circuit board. there were.
［発明の目的１
本発明者らはこのような問題を解決ヅベく研究を進めた
結果、接合された銅回路板の少なくとも部品（ｉ桟部に
＋５りる凸面の高さが５０〜８０μｍど大きいことが原
因の１つであり、凸面の高さを３０μｍ１以下とした場
合には密着性や部品搭載作業性が大幅に改良されること
を見い出した。[Objective of the Invention 1] As a result of thorough research by the present inventors to solve such problems, we found that at least the parts of the bonded copper circuit board (the height of the convex surface of One of the reasons is that the height of the convex surface is 30 μm or less, and it has been found that adhesion and component mounting workability are significantly improved when the height of the convex surface is set to 30 μm or less.
本発明はこのような知見に基づいてなされたもので・、
銅回路板のセラミックス基板への密着性を向上させ、ま
た部品１ハ載を畜希に＜行なうことのｉＪ能な耐電圧特
性や熱り文数性の改良されたセラミックス回路基板を提
供することを目的と゛りる。The present invention was made based on such knowledge.
To provide a ceramic circuit board which improves the adhesion of a copper circuit board to a ceramic board, and has improved withstand voltage characteristics and thermal resistance, which enables the mounting of parts on a single board with ease. The purpose is to
［発明の（１λ要１
すなわら本発明のセラミックス回路基板は、レラミック
ス基椴上に、所定形状の銅回路板を接触配置し加熱接合
ざｔＩＣなるセラミックス回路基板であって、この銅回
路板の少なくども部品搭載部に＋３ける凸面の高さが３
０ ａ ｍ以下であることを１、’＋ ｉ賀とづる。[Invention (1λ Essential 1) In other words, the ceramic circuit board of the present invention is a ceramic circuit board in which a copper circuit board of a predetermined shape is placed in contact with a Reramix substrate and heat-bonded. The height of the convex surface of the board at least in the parts mounting area is +3
0 am or less is written as 1,'+i ga.
本発明に使用りるレラミックス阜檄としくは、アルミ犬
、酸化クイ系省の酸化物系のけラミックス、１１３Ｊ、
ひ窒素アルミニウム、窒化クイ素、゛塾生ヂタン、灰化
ケイ素等の非酸化物系のセラミックス等からなる板状体
が挙げられる。非酸化物系のセラミックス基板を使用す
る場合には、予め表面を酸化処理してから使用すること
が望ましい。The Reramix Fuyoshi used in the present invention includes aluminum dogs, oxide Kui-based oxide-based Nokeramix, 113J,
Examples include plate-shaped bodies made of non-oxide ceramics such as aluminum dinitrogen, silicon nitride, ditanium nitride, and silicon ash. When using a non-oxide ceramic substrate, it is desirable to oxidize the surface beforehand.
なお、本発明においＣ凸面の高さとは基板を水平面に配
置したどきの銅回路板表面両側縁を結ぶ線から最高位置
までの高さをいう。In the present invention, the height of the C convex surface refers to the height from the line connecting both sides of the surface of the copper circuit board to the highest position when the board is placed on a horizontal surface.
本発明に使用づる銅回路板を成形づるための銅手反とし
−Ｃ（ま、タフピッチ銅のようなｒ山男；を１００−３
０００ ｐｐｍの割合Ｃ′含有リする銅を汁延しでなる
ものが適しＣｄ５つ、必要に応じ゛Ｃ通常の無ＩＭ２
Ｘ／。The copper material used for forming the copper circuit board used in the present invention is 100-3.
000 ppm of copper containing C' is suitable.
X/.
銅板に予め酸化処理を施したしのを用いることし′ｃ′
きる。Use a copper plate that has been oxidized in advance.
Wear.
なお、この銅回路板の厚さは０．０３〜１．０陥、好ま
しくは０．１〜０．５鉗であることが好ましい。この範
囲のものは、セラミックスへの接合後、凹凸面を牛ザる
ことか少ない。The thickness of this copper circuit board is preferably 0.03 to 1.0 mm, preferably 0.1 to 0.5 mm. Products in this range rarely rub against uneven surfaces after bonding to ceramics.
この１１（（回路板はヒラミックス阜４ル上にＩＭ触配
置された状態Ｃ，鋼の）、ｊｌ！点（１０８３°Ｃ）以
下で銅−醸化１１１の共晶２：ｕ！反（１０６５°Ｃ）
以上の温度に加熱され−（接合８れる。な＋３、ｉ’Ｆ
ｄ回路板のセラミックス基板への１８合而面（ま９５％
以上どりることが好ましい。９５％以」−の場合に、充
分な熱放散性が１Ｆ１られる。This 11 ((Circuit board is placed IM on the Hiramix steel), below the jl! point (1083°C), the eutectic 2:u! anti( 1065°C)
It is heated to a temperature above - (joint 8 is formed. +3, i'F
d circuit board to ceramic substrate 18 joint surface (95%
The above is preferable. 95% or more, sufficient heat dissipation is achieved.
な＋５、本発明に、１３いＣはセラミックス基板の下面
に銅板から１−］抜加工されたセラミックス基板と（ン
１．ば等しい大きざの銅板が加熱接合された４ｔう造に
りることが望ましい。このように（１へ成した場合には
、下面に接合された銅板により反りの小さい放熱性の良
好なセラミックス回路基板が賀られる。5. In the present invention, 13C is a 4t ridged structure in which a copper plate of the same size is heat-bonded to the bottom surface of a ceramic substrate. In this way (1), a ceramic circuit board with good heat dissipation with little warpage due to the copper plate bonded to the lower surface can be obtained.
また加熱接合の際の雰囲気は酸素を含有Ｊ−る銅回路板
を接合りる場合には窒素雰囲気等の非酸化竹零囲気どり
る。酸素を含まない銅回路（及を使用する場合には１ｉ
１１２索ωを適正にコントロールした酸化性雰囲気どす
る。The atmosphere during heat bonding is a non-oxidizing bamboo atmosphere such as a nitrogen atmosphere when bonding oxygen-containing copper circuit boards. Oxygen-free copper circuit (1i if using
An oxidizing atmosphere in which the 112 strands ω is appropriately controlled.
以上のにうにして得られるセラミックス回路基（ル（，
１２，１１・４回路板のロフミックス厚くｊノｌ＼の花
ｉ （＋７ ＋′ｌか］、、！＜、人曲凹凸の少ないも
のと４ｆり熱放散ｉｌｌ ｉｌｙ Ｊ、び耐電圧ｆｉ１
’Ｊ−等の電気的Ｑ！ｊ竹にＩＱれ（いる。ｄ、た、電
子部品の＋７−ｘ載も密層Ｊ、く行なうことか川面とイ
「る。The ceramic circuit board obtained as described above (
12, 11, 4 circuit board Rof mix thick j nol \ flower i (+7 +'l?),,!
'J- etc. electrical Q! There is an IQ in bamboo. d, It is said that the +7-x mounting of electronic components is also carried out in a very dense manner.
］発明の実施例］ 次に本発明の実施例についで記載する。]Examples of the invention] Next, examples of the present invention will be described.
実施例
クフビッヂ゛ｒＦｉ解銅かｊうなる１１ノさく、） 、
３０ ＋１ｍの汁延銅板を川怠し、この銅板から所定
形状の銅回路（ルを」」抜いた。Example Kufubidji rFi copper melting 11 nozzles),
A 30+1 m hot-rolled copper plate was drained, and a copper circuit of a predetermined shape was extracted from this copper plate.
これを、アルミナを主成分（９６％他に４％の焼結助剤
を含む）とする厚さ０．７ＩｌｌｌＮのセラミックス基
板の上面に接触配置させ、窒素雰囲気中−（１０７５℃
の温度に３０分間加熱しＣ接合さＵた。This was placed in contact with the upper surface of a ceramic substrate with a thickness of 0.7 IllN whose main component was alumina (96% and 4% of sintering aid) in a nitrogen atmosphere at - (1075°C).
It was heated to a temperature of 30 minutes to form a C-joint.
こうして１；ｌられだしラミックス回路基板は、４１１
１回路板の表面が局部的に凸面を生じＣいるものも＋５
つたか、この高さが３０ ａ ｍ以下の−６のは、ビラ
ミックス基板と銅回路板との密着性に優れて＋５す、熱
放散性や耐電圧特性も良好であった。また、銅回路板へ
のシリ−１ンベツトの搭載状態は良好な密層性を右しか
つ、搭載作業し能率よく行なうことが Ｃさ ｌこ 。In this way, the 1;l lamic circuit board is 411
1 If the surface of the circuit board has a locally convex surface, +5
In fact, when the height was 30 am or less, the -6 was excellent in adhesion between the Viramix board and the copper circuit board, which was +5, and the heat dissipation and withstand voltage characteristics were also good. In addition, the mounting condition of the Series 1 board on the copper circuit board requires good layer density and efficient mounting work.
［発明の効果１
以上Ｍ２明したように本発明のレラミックス回路阜板は
、密層性や熱放散性、電気特性に優れ、また部品Ｊハ載
も（…斜なく良好に行なうことが可能である。[Effect of the invention 1 As explained above, the Relamix circuit board of the present invention has excellent layer density, heat dissipation properties, and electrical properties, and can also be mounted on parts J well (... without slanting). It is.
代理人弁理十 須 山 佐 −Attorney 10 Su Yamasa -
Claims (2)
接触配置し加熱接合させてなるセラミックス回路基板で
あっＣ１この接合された銅回路板の少なくとも部品搭載
部にお（ブる凸面の高さが３０ ｕ０１以下であること
を特徴とづるロラミックス回路基板。(1) A ceramic circuit board made by placing a copper circuit board of a predetermined shape in contact with a ceramic board and heat-bonding it. A Lolamix circuit board characterized by a height of 30 u01 or less.
％以上Ｃ′ある特ｈ′［：１１′Ｉ求の範囲第１項記載
のセラミックス回路基板。 く３）銅回路板（よ即さか０．０３〜１．０浦１）１で
ある特許請求の範囲第１項または第２項記載のしラミッ
クス回路阜板。(2) The bonding area of the copper circuit board and the ceramic substrate is 95
The ceramic circuit board according to item 1, wherein the desired range is % or more C'. 3) The ceramic circuit board according to claim 1 or 2, which is a copper circuit board (width: 0.03 to 1.0 mm).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3003184A JPS60173900A (en) | 1984-02-20 | 1984-02-20 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3003184A JPS60173900A (en) | 1984-02-20 | 1984-02-20 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60173900A true JPS60173900A (en) | 1985-09-07 |
Family
ID=12292446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3003184A Pending JPS60173900A (en) | 1984-02-20 | 1984-02-20 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60173900A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271295A (en) * | 1985-09-24 | 1987-04-01 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6271294A (en) * | 1985-09-24 | 1987-04-01 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6273796A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6273800A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6273797A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6273798A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276597A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276591A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276590A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276589A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276596A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276595A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6284595A (en) * | 1985-10-08 | 1987-04-18 | 日本電気株式会社 | Multilayer ceramic wiring substrate |
| JPH01241193A (en) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | Ceramic substrate |
| JPH01272183A (en) * | 1988-04-25 | 1989-10-31 | Toshiba Corp | Ceramics circuit board |
| JPH01304797A (en) * | 1988-06-01 | 1989-12-08 | Nec Corp | Aluminum nitride multilayer interconnection substrate and manufacture of it |
| JP2002252433A (en) * | 2001-02-23 | 2002-09-06 | Dowa Mining Co Ltd | Ceramic circuit board and its manufacturing method |
-
1984
- 1984-02-20 JP JP3003184A patent/JPS60173900A/en active Pending
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0413879B2 (en) * | 1985-09-24 | 1992-03-11 | Nippon Electric Co | |
| JPS6271294A (en) * | 1985-09-24 | 1987-04-01 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6271295A (en) * | 1985-09-24 | 1987-04-01 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPH0415638B2 (en) * | 1985-09-27 | 1992-03-18 | Nippon Electric Co | |
| JPH0415640B2 (en) * | 1985-09-27 | 1992-03-18 | Nippon Electric Co | |
| JPS6273798A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276597A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276591A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276590A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276589A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276596A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6276595A (en) * | 1985-09-27 | 1987-04-08 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPH0443439B2 (en) * | 1985-09-27 | 1992-07-16 | Nippon Electric Co | |
| JPH0443440B2 (en) * | 1985-09-27 | 1992-07-16 | Nippon Electric Co | |
| JPH0415637B2 (en) * | 1985-09-27 | 1992-03-18 | Nippon Electric Co | |
| JPS6273797A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6273800A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPH0415639B2 (en) * | 1985-09-27 | 1992-03-18 | Nippon Electric Co | |
| JPS6273796A (en) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | Multilayer ceramic circuit substrate |
| JPS6284595A (en) * | 1985-10-08 | 1987-04-18 | 日本電気株式会社 | Multilayer ceramic wiring substrate |
| JPH0445997B2 (en) * | 1985-10-08 | 1992-07-28 | Nippon Electric Co | |
| JPH01241193A (en) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | Ceramic substrate |
| JPH01272183A (en) * | 1988-04-25 | 1989-10-31 | Toshiba Corp | Ceramics circuit board |
| JPH01304797A (en) * | 1988-06-01 | 1989-12-08 | Nec Corp | Aluminum nitride multilayer interconnection substrate and manufacture of it |
| JP2002252433A (en) * | 2001-02-23 | 2002-09-06 | Dowa Mining Co Ltd | Ceramic circuit board and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60173900A (en) | Ceramic circuit board | |
| KR0147881B1 (en) | Ceramic circuit board | |
| JPS644668B2 (en) | ||
| JPS6272576A (en) | Ceramic-metal bonded body | |
| JP2911644B2 (en) | Circuit board | |
| JPH05347469A (en) | Ceramic circuit board | |
| JPS59121890A (en) | Ceramic and metal bond | |
| JPS6126231A (en) | Metal-ceramic composite element and method of producing same | |
| JPH0568877B2 (en) | ||
| JPH0570954B2 (en) | ||
| JPH0328825B2 (en) | ||
| JP2503778B2 (en) | Substrate for semiconductor device | |
| JP3056852B2 (en) | Ceramic substrate with copper circuit | |
| JP2506270B2 (en) | High thermal conductivity circuit board and high thermal conductivity envelope | |
| JPS60117792A (en) | Ceramic circuit board | |
| JPS61121489A (en) | Cu wiring sheet for manufacture of substrate | |
| JPS61227035A (en) | Ceramics circuit substrate | |
| JP2503779B2 (en) | Substrate for semiconductor device | |
| JPS60107845A (en) | Circuit substrate for semiconductor | |
| JPH0294649A (en) | Substrate for semiconductor device | |
| JPH02240995A (en) | Ceramic substrate for electronic component mounting | |
| JPS6272575A (en) | Manufacture of ceramic-metal bonded body | |
| JPS61296788A (en) | Circuit board | |
| JPH0337310B2 (en) | ||
| JPH0770798B2 (en) | High thermal conductivity circuit board |