JPS60154546A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS60154546A JPS60154546A JP1169584A JP1169584A JPS60154546A JP S60154546 A JPS60154546 A JP S60154546A JP 1169584 A JP1169584 A JP 1169584A JP 1169584 A JP1169584 A JP 1169584A JP S60154546 A JPS60154546 A JP S60154546A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- leads
- outer frame
- sides
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
太ｇ、■は牢道伏防置田リードフレームの構造に関する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] TAIG and ■ relate to the structure of a lead frame.
半導体装置、特に半導体集積回路装置（以下工０と称す
る）をパッケージする場合、経済的面および製造上の面
からレジンモールド法が極めて多く採用されている。第
１図はかかるレジンモールド法を採用するＩＯのパッケ
ージに用いられるリード７−レームの一般的構造を示し
たものである０しかるに、このようなリードフレームを
用いた場合）レジンモールド後に行なわれる不要なフレ
ーム部分（外枠５およびダム４）の切断の際、タブリー
ド２に引張応力が加わり、タブリード２と樹脂との境界
面で滑りが生ずるＯこのため気密性が劣化することによ
り耐湿性に問題をきたす。When packaging semiconductor devices, particularly semiconductor integrated circuit devices (hereinafter referred to as process 0), a resin molding method is very often adopted from an economical and manufacturing standpoint. Figure 1 shows the general structure of a lead frame used in an IO package that employs such a resin molding method. When cutting the frame parts (outer frame 5 and dam 4), tensile stress is applied to the tab lead 2, causing slippage at the interface between the tab lead 2 and the resin. This deteriorates airtightness and causes moisture resistance problems. cause
本発明はかかる問題点を解決するもので、その目的とす
るところは、気密性の高いパッケージの製造を可能とす
る構造の新規リードフレームを提供することにある０
〔概 要〕
本発明の半導体装置用リードフレームは、タブ１と前記
タブ１の両側から引出されたタブリード２と、前記タブ
１を囲むように設けられた複数の外部引出しり一ド６と
、前記外部引出しり一ド６の長さ方向とほぼ直角方向に
前記外部引出しり−ド３を互いに連結するように設けた
ダム４と、前記タブリード２およびダム４の両側に連結
された外枠５とからなり、前記タブリード２の樹脂封入
領域Ａには突起部７が形成されている事を特徴とする◇
〔実施例〕
以下、本発明について実施例に基づき詳細に説明する・
第２図は、本発明が適用される半導体装置用リードフレ
ームの形状を示すもので、１は半導体ペレットを取付け
るためのタブ、２はタブ１の両側から引出されたタブリ
ード、６はタブ１を囲むように設けられた複数の外部引
出しリードであり、４は外部引出しり一ド６を互いに連
結すると共に、レジンモールド時のレジン流れを防止す
る役割も果すものでダムと称される。５はタブリード２
とダム４を支持する外枠で、部分的に位置決めのための
ガイド穴６が設けられている。破線の内部は樹脂封入領
域にあたり、これを記号Ａで示すが、タブリード２の樹
脂封入領域Ａには突起部７が形成されている・
レジンモールド終了後、外枠５およびダム４は不必要な
部分として切断されるが、特に外枠５の切断に際してタ
ブリード２には長さ方向に引張応力が働き、タブリード
と樹脂の境界面で滑りが生じようとする。The present invention is intended to solve these problems, and its purpose is to provide a novel lead frame having a structure that enables the manufacture of highly airtight packages. [Summary] Semiconductor of the present invention The device lead frame includes a tab 1, tab leads 2 pulled out from both sides of the tab 1, a plurality of external drawer doors 6 provided so as to surround the tab 1, and a plurality of external drawer doors 6. It consists of a dam 4 provided to connect the external drawer doors 3 to each other in a direction substantially perpendicular to the length direction, and an outer frame 5 connected to both sides of the tab lead 2 and the dam 4. The resin-sealed region A is characterized by a protrusion 7 formed therein. ◇ [Example] The present invention will be explained in detail based on an example below. Figure 2 shows a semiconductor to which the present invention is applied. This figure shows the shape of the lead frame for the device. 1 is a tab for attaching a semiconductor pellet, 2 is a tab lead drawn out from both sides of the tab 1, and 6 is a plurality of external lead leads provided to surround the tab 1. 4, which connects the external drawer doors 6 to each other and also serves to prevent resin from flowing during resin molding, is called a dam. 5 is tab lead 2
An outer frame supporting the dam 4 is partially provided with guide holes 6 for positioning. The area inside the broken line corresponds to the resin-filled area, which is indicated by symbol A, and a protrusion 7 is formed in the resin-filled area A of the tab lead 2. After the resin molding is completed, the outer frame 5 and dam 4 are unnecessary. Particularly when cutting the outer frame 5, tensile stress acts on the tab lead 2 in the length direction, and slippage tends to occur at the interface between the tab lead and the resin.
この場合、突起部７においてタブリードの引張方向と直
角の面のうち外枠５側の部分には抵抗力を生ずるため、
突起部７からタブ１にかけてのタブリード２部分に生じ
ようとする上記滑りは緩和される。このため気密性が高
くなり、耐湿性が向上する。In this case, a resistance force is generated on the outer frame 5 side of the surface of the protrusion 7 perpendicular to the pulling direction of the tab lead.
The above-mentioned slippage that tends to occur in the tab lead 2 portion from the protrusion 7 to the tab 1 is alleviated. This increases airtightness and improves moisture resistance.
突起部７については、タブリード２の引張方向と直角な
面の面積を剛性を失わない範囲で太きく取る事が有効で
あり、この観点から第３図、第４図の７′、７″に示さ
れる如く多数の工夫が可能である。Regarding the protrusion 7, it is effective to make the area of the surface perpendicular to the tensile direction of the tab lead 2 as large as possible without losing rigidity. As shown, many modifications are possible.
また・このような突起部７．７’、７’等はリードフレ
ーム製造時のプレス、フォトエツチング作業の際、同時
に、かつ容易に形成することができる。Further, such protrusions 7, 7', 7', etc. can be formed simultaneously and easily during the pressing and photoetching operations during lead frame manufacturing.
以上のように、本半導体装置用リードフレームは・タブ
リードの樹脂封止領域に突起部を形成したことにより、
外枠の切断に際してタブリードと樹脂との境界面で生じ
ようとする滑りを緩和する事が可能なため、気密性を高
める効果を生ずる。As described above, the present lead frame for semiconductor devices has the following features: By forming the protrusion in the resin-sealed area of the tab lead,
Since it is possible to alleviate the slippage that occurs at the interface between the tab lead and the resin when cutting the outer frame, it has the effect of improving airtightness.
これによって、パッケージの耐湿性が向上する。This improves the moisture resistance of the package.
第１図は従来の一般的なリードフレームを示す平面図、
第２図は本発明の一実施例を示す平面図、第３図および
第４図は本発明の他の実施例の作用効果を生ずる部分を
示す平面図である０１・・・・・タブ ９・・・・・・
々プ＋＋ −１＋３・・・・・・外部引出しリード
４・・・・・・ダム ５・・・・・・外枠６・・・・・
・ガイド穴
７ 、７’ 、 ７’・・・・・・突起部Ａ・・・・・
・樹脂封入領域
以 上
出願人 株式会社諏訪精工舎
代理人 弁理士 最 上 務Figure 1 is a plan view showing a conventional general lead frame.
FIG. 2 is a plan view showing one embodiment of the present invention, and FIGS. 3 and 4 are plan views showing parts that produce the effects of other embodiments of the present invention.01...Tab 9・・・・・・
+ + -1 + 3...External drawer lead 4...Dam 5...Outer frame 6...
・Guide holes 7, 7', 7'... Protrusion A...
・Resin encapsulation area and above Applicant Suwa Seikosha Co., Ltd. Agent Patent Attorney Mogami
Claims (1)
と、前記タブ１を囲むように設けられた複数の外部引出
しリード３と、前記外部引出しり一ド３の長さ方向とほ
ぼ直角方向に前記外部引出しリード３を互いに連結する
ように設けたダム４と、前記タブリード２およびダム４
の両側に連結された外枠５とからなる半導体装置用リー
ドフレームにおいて、前記タブリード２の樹脂封入領域
Ａには突起部７が形成されている事を特徴とする半導体
装置用リードフレーム。Tab 1 and tab leads 2 pulled out from both sides of the tab 1
a plurality of external drawer leads 3 provided so as to surround the tab 1; and a dam provided to connect the external drawer leads 3 to each other in a direction substantially perpendicular to the length direction of the external drawer door 3. 4, the tab lead 2 and the dam 4
1. A lead frame for a semiconductor device comprising an outer frame 5 connected to both sides of the lead frame, wherein a protrusion 7 is formed in a resin-sealed region A of the tab lead 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169584A JPS60154546A (en) | 1984-01-24 | 1984-01-24 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169584A JPS60154546A (en) | 1984-01-24 | 1984-01-24 | Lead frame for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60154546A true JPS60154546A (en) | 1985-08-14 |
Family
ID=11785166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1169584A Pending JPS60154546A (en) | 1984-01-24 | 1984-01-24 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60154546A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5371044A (en) * | 1991-05-27 | 1994-12-06 | Hitachi, Ltd. | Method of uniformly encapsulating a semiconductor device in resin |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726360U (en) * | 1980-07-21 | 1982-02-10 |
-
1984
- 1984-01-24 JP JP1169584A patent/JPS60154546A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726360U (en) * | 1980-07-21 | 1982-02-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5371044A (en) * | 1991-05-27 | 1994-12-06 | Hitachi, Ltd. | Method of uniformly encapsulating a semiconductor device in resin |
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