JPS60130886A - 回路基板の組立方法 - Google Patents

回路基板の組立方法

Info

Publication number
JPS60130886A
JPS60130886A JP58239216A JP23921683A JPS60130886A JP S60130886 A JPS60130886 A JP S60130886A JP 58239216 A JP58239216 A JP 58239216A JP 23921683 A JP23921683 A JP 23921683A JP S60130886 A JPS60130886 A JP S60130886A
Authority
JP
Japan
Prior art keywords
circuit board
conductor
marking
range
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58239216A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144040B2 (en, 2012
Inventor
中村　治司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58239216A priority Critical patent/JPS60130886A/ja
Publication of JPS60130886A publication Critical patent/JPS60130886A/ja
Publication of JPH0144040B2 publication Critical patent/JPH0144040B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP58239216A 1983-12-19 1983-12-19 回路基板の組立方法 Granted JPS60130886A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58239216A JPS60130886A (ja) 1983-12-19 1983-12-19 回路基板の組立方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58239216A JPS60130886A (ja) 1983-12-19 1983-12-19 回路基板の組立方法

Publications (2)

Publication Number Publication Date
JPS60130886A true JPS60130886A (ja) 1985-07-12
JPH0144040B2 JPH0144040B2 (en, 2012) 1989-09-25

Family

ID=17041467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239216A Granted JPS60130886A (ja) 1983-12-19 1983-12-19 回路基板の組立方法

Country Status (1)

Country Link
JP (1) JPS60130886A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126950A (ja) * 2019-02-06 2020-08-20 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340457U (en, 2012) * 1976-09-13 1978-04-07
JPS5448077A (en) * 1977-09-22 1979-04-16 Tokyo Shibaura Electric Co Method of soldering parts to be added later

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340457U (en, 2012) * 1976-09-13 1978-04-07
JPS5448077A (en) * 1977-09-22 1979-04-16 Tokyo Shibaura Electric Co Method of soldering parts to be added later

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126950A (ja) * 2019-02-06 2020-08-20 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法

Also Published As

Publication number Publication date
JPH0144040B2 (en, 2012) 1989-09-25

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