JPS601220A - Epoxy resin composition for semiconductor sealing - Google Patents

Epoxy resin composition for semiconductor sealing

Info

Publication number
JPS601220A
JPS601220A JP10789483A JP10789483A JPS601220A JP S601220 A JPS601220 A JP S601220A JP 10789483 A JP10789483 A JP 10789483A JP 10789483 A JP10789483 A JP 10789483A JP S601220 A JPS601220 A JP S601220A
Authority
JP
Japan
Prior art keywords
block copolymer
epoxy resin
polyepoxy compound
content
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10789483A
Other languages
Japanese (ja)
Other versions
JPH0319856B2 (en
Inventor
Shinichiro Asai
Hiroshi Nishikawa
Takaki Saruta
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Priority to JP10789483A priority Critical patent/JPH0319856B2/ja
Priority claimed from US06/544,242 external-priority patent/US4529755A/en
Publication of JPS601220A publication Critical patent/JPS601220A/en
Publication of JPH0319856B2 publication Critical patent/JPH0319856B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition of low stress, high heat shock resistance and excellent high-temperature properties, comprising a polyepoxy compound, a styrene block copolymer, a liquid rubber, a curing agent, and an inorganic filler.
CONSTITUTION: 60W80wt% inorganic filler (e.g., alumina) is added to a composition comprising 100pts.wt. polyepoxy compound (e.g., bisphenol A-derived epoxy resin) having a Cl ion content ≤10ppm and a hydrolyzable chlorine content ≤0.1wt%, 2W20pts.wt. styrene block copolymer (e.g., styrene/butadiene block copolymer), 2W30pts.wt. liquid rubber (e.g., low-MW 1,2-polybutadiene), and a curing agent for the polyepoxy compound (e.g., novolak phenol resin having a content of components soluble in water at normal temperature of 3wt% or below).
COPYRIGHT: (C)1985,JPO&Japio
JP10789483A 1983-06-17 1983-06-17 Expired - Lifetime JPH0319856B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10789483A JPH0319856B2 (en) 1983-06-17 1983-06-17

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10789483A JPH0319856B2 (en) 1983-06-17 1983-06-17
US06/544,242 US4529755A (en) 1982-10-23 1983-10-21 Epoxy resin composition for encapsulating semiconductor

Publications (2)

Publication Number Publication Date
JPS601220A true JPS601220A (en) 1985-01-07
JPH0319856B2 JPH0319856B2 (en) 1991-03-18

Family

ID=14470762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10789483A Expired - Lifetime JPH0319856B2 (en) 1983-06-17 1983-06-17

Country Status (1)

Country Link
JP (1) JPH0319856B2 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285215A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPS61285244A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPS61285243A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPS6222825A (en) * 1985-07-23 1987-01-31 Toshiba Chem Corp Sealing resin composition
JPS62292824A (en) * 1986-06-13 1987-12-19 Toshiba Chem Corp Sealing resin composition
JPS6361017A (en) * 1986-08-29 1988-03-17 Sumitomo Chem Co Ltd Liquid epoxy sealant
JPS63207816A (en) * 1987-02-23 1988-08-29 Ube Ind Ltd Epoxy resin composition for sealing semiconductor
JPS63248820A (en) * 1987-04-06 1988-10-17 Toray Ind Inc Soldering heat-resistant epoxy resin composition
JPS6481847A (en) * 1987-09-24 1989-03-28 Asahi Chemical Ind Resin composition for semiconductor sealing use
JPH01236226A (en) * 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JPH01275620A (en) * 1988-04-28 1989-11-06 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JPH0299513A (en) * 1988-10-06 1990-04-11 Toray Ind Inc Epoxy based composition
JPH04226123A (en) * 1990-06-18 1992-08-14 Toray Ind Inc Epoxy resin composition for sealing semiconductor
JPH08208804A (en) * 1995-11-27 1996-08-13 Toray Ind Inc Semiconductor device
US5946554A (en) * 1996-05-28 1999-08-31 Denso Corporation Method of producing resin-sealed electronic device
JP2006282765A (en) * 2005-03-31 2006-10-19 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285244A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPS61285243A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPS61285215A (en) * 1985-06-13 1986-12-16 Matsushita Electric Ind Co Ltd Molding material for electronic parts
JPH0528242B2 (en) * 1985-06-13 1993-04-23 Matsushita Denko Kk
JPH0513185B2 (en) * 1985-07-23 1993-02-19 Toshiba Chem Prod
JPS6222825A (en) * 1985-07-23 1987-01-31 Toshiba Chem Corp Sealing resin composition
JPS62292824A (en) * 1986-06-13 1987-12-19 Toshiba Chem Corp Sealing resin composition
JPS6361017A (en) * 1986-08-29 1988-03-17 Sumitomo Chem Co Ltd Liquid epoxy sealant
JPS63207816A (en) * 1987-02-23 1988-08-29 Ube Ind Ltd Epoxy resin composition for sealing semiconductor
JPS63248820A (en) * 1987-04-06 1988-10-17 Toray Ind Inc Soldering heat-resistant epoxy resin composition
JPS6481847A (en) * 1987-09-24 1989-03-28 Asahi Chemical Ind Resin composition for semiconductor sealing use
JPH01236226A (en) * 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JPH01275620A (en) * 1988-04-28 1989-11-06 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
JPH0299513A (en) * 1988-10-06 1990-04-11 Toray Ind Inc Epoxy based composition
JPH04226123A (en) * 1990-06-18 1992-08-14 Toray Ind Inc Epoxy resin composition for sealing semiconductor
JPH08208804A (en) * 1995-11-27 1996-08-13 Toray Ind Inc Semiconductor device
US5946554A (en) * 1996-05-28 1999-08-31 Denso Corporation Method of producing resin-sealed electronic device
JP2006282765A (en) * 2005-03-31 2006-10-19 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP4581793B2 (en) * 2005-03-31 2010-11-17 住友ベークライト株式会社 Epoxy resin composition and semiconductor device

Also Published As

Publication number Publication date
JPH0319856B2 (en) 1991-03-18

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