JPS60121243U - Sealing mold temperature switch - Google Patents

Sealing mold temperature switch

Info

Publication number
JPS60121243U
JPS60121243U JP713484U JP713484U JPS60121243U JP S60121243 U JPS60121243 U JP S60121243U JP 713484 U JP713484 U JP 713484U JP 713484 U JP713484 U JP 713484U JP S60121243 U JPS60121243 U JP S60121243U
Authority
JP
Japan
Prior art keywords
switch
temperature
temperature switch
sealing mold
mold temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP713484U
Other languages
Japanese (ja)
Inventor
柿崎　敏
伊藤　好昭
Original Assignee
東北金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東北金属工業株式会社 filed Critical 東北金属工業株式会社
Priority to JP713484U priority Critical patent/JPS60121243U/en
Publication of JPS60121243U publication Critical patent/JPS60121243U/en
Pending legal-status Critical Current

Links

Landscapes

  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Manufacture Of Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、ｂ：従来例を示す斜視図、第２図ａ：本考案
の一実施例の部品構成を示す斜視図、第２図す２同上外
観を示す斜視図、第３図ａ：本考案の他の実施例の部品
構成を示す斜視図、第３図す２同上外観を示す斜視図、
第４Ｎ：本考案の　−他の実施例を示す斜視図、第５図
ａ、　ｂ　：本考案の他の実施例を示す斜視図。 図において、１：リードスイッチ、２：感温磁性体、３
：永久磁石、４：リードフレーム、４ａ、４ｂ：外部へ
導き出されたリード、５：封止成形材料、６ａ：樹脂に
よ不取り付はフィン、６　　　　゛ｂ：金属を封止成形
した取り付はフィン。Figures 1a and b: A perspective view showing a conventional example; Figure 2a: a perspective view showing the component structure of an embodiment of the present invention; Figure 2; a perspective view showing the external appearance of the same as above; Figure 3a: A perspective view showing the component structure of another embodiment of the present invention, a perspective view showing the external appearance of Figure 3,
4N: A perspective view showing another embodiment of the present invention, FIGS. 5a and 5b: A perspective view showing another embodiment of the present invention. In the figure, 1: reed switch, 2: temperature-sensitive magnetic material, 3
: Permanent magnet, 4: Lead frame, 4a, 4b: Leads led to the outside, 5: Sealing molding material, 6a: Fin if not attached to resin, 6 ゛b: Mounting by sealing molded metal is fin.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）リードスイッチの外管中央部に環状の感温磁性体
を、またその両側に環状の永久磁石を取りまいてなる温
度スイッチの引き出しリード線にリードフレームを溶着
し、その両端部を残して全体を前記温度スイッチを構成
する部材の熱膨張係数に近い熱膨張係数を有する熱硬化
性又は熱可塑性樹脂にて封止成形してなる封止成形型温
度スイッチ。(1) A lead frame is welded to the lead wire of a temperature switch, which has a ring-shaped temperature-sensitive magnetic material in the center of the outer tube of the reed switch and ring-shaped permanent magnets surrounding it on both sides, leaving both ends intact. A sealed molded temperature switch which is entirely molded with a thermosetting or thermoplastic resin having a coefficient of thermal expansion close to that of the members constituting the temperature switch. （２）樹脂の熱膨張係数が５　ｘｌｏ−５／６　Ｃ乃至
０．９Ｘ　１０−５／’、、　Ｃ（７）範囲にある実用
新案登録請求の範囲第１項記載の封止成形型温度スイッ
チ。(2) Temperature of the sealing mold according to claim 1 of the utility model registration claim, in which the coefficient of thermal expansion of the resin is in the range of 5 x lo-5/6 C to 0.9 x 10-5/', C (7) switch.
JP713484U 1984-01-24 1984-01-24 Sealing mold temperature switch Pending JPS60121243U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP713484U JPS60121243U (en) 1984-01-24 1984-01-24 Sealing mold temperature switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP713484U JPS60121243U (en) 1984-01-24 1984-01-24 Sealing mold temperature switch

Publications (1)

Publication Number Publication Date
JPS60121243U true JPS60121243U (en) 1985-08-15

Family

ID=30485208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP713484U Pending JPS60121243U (en) 1984-01-24 1984-01-24 Sealing mold temperature switch

Country Status (1)

Country Link
JP (1) JPS60121243U (en)

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