JPS60117856U

JPS60117856U - sputtering equipment

Info

Publication number: JPS60117856U
Application number: JP565484U
Authority: JP
Inventors: 今岡　英一郎; 上間　恒明
Original assignee: 株式会社富士通ゼネラル
Priority date: 1984-01-19
Filing date: 1984-01-19
Publication date: 1985-08-09

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は従来のスパッタリング装置の構成図、第２図は
第１図のチェンバ内部を示すもので一部を切欠いた斜視
図、第３図は本考案によるスパッタリング装置の一実施
例を示す構成図、第４図は第３図のチェンバ内部を示す
もので一部を切欠いた斜視図、第５図は第４図のアノー
ドの他の実施例を示す斜視図、第６図は第４図のアノー
ドのさらに他の実施例を示す斜視図である。図中、１，１１はチェンバ（減圧容器）、２゜２０はシ
ャッタ、３は窓、４．．１６はターゲットホルダ（カソ
ード）、５．．１〜５ａ４　ｇ　　５ｂ１〜５ｂ４９１
５８１〜１５ａ４〜１５．、　、　１５ｂ、〜１５．。は基板、６，１２は基板ホルダ、７，２７は高圧直流電
源（スパッタ電源）、１３は回転軸、４２．１７はター
ゲ゛ット、１８は網目、１９はアノード、２１は中心穴
、２２は管軸、２３は円板、２４１〜２４．は格子、２
５□〜２５ｏ−１は隙間、２６は円孔、２８は直流電源
（バイアス電源）、２９は穴、３０は平板。Fig. 1 is a configuration diagram of a conventional sputtering apparatus, Fig. 2 is a partially cutaway perspective view showing the inside of the chamber in Fig. 1, and Fig. 3 is a configuration showing an embodiment of the sputtering apparatus according to the present invention. 4 is a partially cutaway perspective view showing the inside of the chamber shown in FIG. 3, FIG. 5 is a perspective view showing another embodiment of the anode shown in FIG. 4, and FIG. 6 is a perspective view showing the inside of the chamber shown in FIG. 4. FIG. 6 is a perspective view showing still another embodiment of the anode of FIG. In the figure, 1 and 11 are chambers (decompression containers), 2.20 is a shutter, 3 is a window, and 4. ．． 16 is a target holder (cathode); 5. ．． 1~5a4 g 5b1~5b491
581-15a4-15. , , 15b, ~15. . is a substrate, 6 and 12 are substrate holders, 7 and 27 are high-voltage DC power supplies (sputter power supplies), 13 is a rotating shaft, 42.17 is a target, 18 is a mesh, 19 is an anode, 21 is a center hole, 22 is a tube axis, 23 is a disk, 241-24. is a grid, 2
5□ to 25o-1 are gaps, 26 is a circular hole, 28 is a DC power source (bias power source), 29 is a hole, and 30 is a flat plate.

Claims

[Scope of utility model registration request]

(1) In a sputtering device that causes sputtered particles sputtered from a cathode in a reduced pressure container to adhere to the surface of a substrate on a substrate holder, the substrate holder is formed of a rotatable columnar body, and the sputtered particles are attached to the outer peripheral surface of the substrate holder. A rotatable cylindrical shutter having the same rotation center axis as the substrate holder is provided between the outer peripheral surface of the substrate holder and the cathode, and spatter is removed between the cylindrical shutter and the cathode. A sputtering power source is provided between the anode and the cathode, and a negative bias is applied to the substrate holder between the anode and the substrate holder. A sputtering device characterized in that it is connected to a bias power source.

(2) Utility Model Registration The sputtering apparatus according to claim 1, wherein the anode is formed of a net, and the mesh of the net serves as a passage hole for sputtered particles.

(3) Utility Model Registration Scope of Claim 1. The sputtering device according to claim 1, wherein the anode is formed of a large number of lattices, and the gaps between these lattices serve as passage holes for sputtered particles.

(4) Utility Model Registration Scope of Claim 1. The sputtering device according to claim 1, wherein the anode is formed of a plate having a large number of circular holes, and these circular holes serve as passage holes for sputtered particles.