JPS60107851A - Lead frame for plastic package - Google Patents

Lead frame for plastic package

Info

Publication number
JPS60107851A
JPS60107851A JP58216713A JP21671383A JPS60107851A JP S60107851 A JPS60107851 A JP S60107851A JP 58216713 A JP58216713 A JP 58216713A JP 21671383 A JP21671383 A JP 21671383A JP S60107851 A JPS60107851 A JP S60107851A
Authority
JP
Japan
Prior art keywords
leads
bed
width spreading
sections
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58216713A
Other languages
Japanese (ja)
Inventor
Takahide Kawano
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58216713A priority Critical patent/JPS60107851A/en
Publication of JPS60107851A publication Critical patent/JPS60107851A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Abstract

PURPOSE:To collect pads to the short side sections of a semiconductor chip, and to miniaturize the chip by a method wherein a width spreading section is formed to a connecting section of an inner lead with an outer lead, a hole is formed at the central section of the width spreading section while a slip-off preventive piece is extended in parallel with the long sides of a bed section and in the direction of the short sides of the bed sections from the width spreading section and a bonding section is formed at the nose section of the slip-off preventive piece in the inner lead fitted opposed to the long side sections of the bed section. CONSTITUTION:A plurality of inner leads 141-146 are formed around a bed section 12 for a lead frame 11 on which a semiconductor chip 13 for a memory is fixed, and these inner leads are connected to outer leads 161-164 while using the side surface sections B of a resin 15 as boundaries. Each pad 171-175 for the chip 13 is severally connected to the leads 141-146 through bonding wires 18, and a width spreading section 19 is formed to a connecting section between leads such as leads 143 and 163 and a square hole 20 is bored to the width spreading section as shown in another figure. A slip-off preventive piece 21 extending in parallel with the long sides of the bed section 12 is formed at one end section of the width spreading section 19, and a bonding section 23 is shaped at the nose of the piece 21.
JP58216713A 1983-11-17 1983-11-17 Lead frame for plastic package Pending JPS60107851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58216713A JPS60107851A (en) 1983-11-17 1983-11-17 Lead frame for plastic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58216713A JPS60107851A (en) 1983-11-17 1983-11-17 Lead frame for plastic package

Publications (1)

Publication Number Publication Date
JPS60107851A true JPS60107851A (en) 1985-06-13

Family

ID=16692751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58216713A Pending JPS60107851A (en) 1983-11-17 1983-11-17 Lead frame for plastic package

Country Status (1)

Country Link
JP (1) JPS60107851A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0242962A1 (en) * 1986-04-25 1987-10-28 Inmos Corporation Offset pad semiconductor lead frame
JPS6480054A (en) * 1987-09-19 1989-03-24 Hitachi Ltd Resin sealed semiconductor device
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0242962A1 (en) * 1986-04-25 1987-10-28 Inmos Corporation Offset pad semiconductor lead frame
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
JPS6480054A (en) * 1987-09-19 1989-03-24 Hitachi Ltd Resin sealed semiconductor device

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