JPS60103590U - Laser processing equipment - Google Patents

Laser processing equipment

Info

Publication number
JPS60103590U
JPS60103590U JP1983197440U JP19744083U JPS60103590U JP S60103590 U JPS60103590 U JP S60103590U JP 1983197440 U JP1983197440 U JP 1983197440U JP 19744083 U JP19744083 U JP 19744083U JP S60103590 U JPS60103590 U JP S60103590U
Authority
JP
Japan
Prior art keywords
assist gas
laser processing
hole
processing equipment
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983197440U
Other languages
Japanese (ja)
Inventor
憲治 池滝
大桃 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1983197440U priority Critical patent/JPS60103590U/en
Publication of JPS60103590U publication Critical patent/JPS60103590U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のレーザ加工装置の要部を示す正面図、第
2図及び第3図は本考案に係るレーザ加工装置の実施例
を示すもので、第2図はレーザ加工装置の要部正面図、
第3図はアシストガス流路の他の形成要領図である。 図中、11はノズル、12はカバーガラス、13.13
’は押え板、14は穴、15.15’はアシストガス流
路である二
FIG. 1 is a front view showing the main parts of a conventional laser processing device, FIGS. 2 and 3 show an embodiment of the laser processing device according to the present invention, and FIG. 2 is a front view showing the main parts of the laser processing device. Front view,
FIG. 3 is a diagram showing another method for forming the assist gas flow path. In the figure, 11 is a nozzle, 12 is a cover glass, 13.13
' is the holding plate, 14 is the hole, and 15.15' is the assist gas flow path.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被加工部品に対向する押え板の穴から該部品にレーザを
照射するとともに、前記穴にアシストガスを吹き付けて
加工を行うレーザ加工装置において、前記押え板の部品
との対向部に、アシストガス供給源と接続され該供給源
より供給されるアシストガスを通過させて加工部付近に
負圧を生じさせるアシストガス流路を、前記穴を横切っ
て設けたことを特徴とするレーザ加工装置。
In a laser processing device that performs processing by irradiating a laser beam onto a part through a hole in a holding plate facing the workpiece and blowing assist gas into the hole, assist gas is supplied to a part of the holding plate facing the part. A laser processing apparatus characterized in that an assist gas flow path is provided across the hole, and is connected to a source and allows an assist gas supplied from the supply source to pass therethrough to generate a negative pressure in the vicinity of the processing section.
JP1983197440U 1983-12-22 1983-12-22 Laser processing equipment Pending JPS60103590U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983197440U JPS60103590U (en) 1983-12-22 1983-12-22 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983197440U JPS60103590U (en) 1983-12-22 1983-12-22 Laser processing equipment

Publications (1)

Publication Number Publication Date
JPS60103590U true JPS60103590U (en) 1985-07-15

Family

ID=30422807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983197440U Pending JPS60103590U (en) 1983-12-22 1983-12-22 Laser processing equipment

Country Status (1)

Country Link
JP (1) JPS60103590U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197034A (en) * 2012-03-22 2013-09-30 Toyota Motor Corp Welding equipment for secondary battery and method of manufacturing secondary battery
JP2015231629A (en) * 2014-06-09 2015-12-24 株式会社Ihi Laser weld device and laser weld method
JP2017051978A (en) * 2015-09-09 2017-03-16 新日鐵住金株式会社 Laser cutting product manufacturing method and manufacturing apparatus
JP2017073236A (en) * 2015-10-05 2017-04-13 トヨタ自動車株式会社 Battery manufacturing method
WO2023090035A1 (en) * 2021-11-19 2023-05-25 Jswアクティナシステム株式会社 Laser cutting apparatus, laser cutting method, and display production method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197034A (en) * 2012-03-22 2013-09-30 Toyota Motor Corp Welding equipment for secondary battery and method of manufacturing secondary battery
JP2015231629A (en) * 2014-06-09 2015-12-24 株式会社Ihi Laser weld device and laser weld method
JP2017051978A (en) * 2015-09-09 2017-03-16 新日鐵住金株式会社 Laser cutting product manufacturing method and manufacturing apparatus
JP2017073236A (en) * 2015-10-05 2017-04-13 トヨタ自動車株式会社 Battery manufacturing method
WO2023090035A1 (en) * 2021-11-19 2023-05-25 Jswアクティナシステム株式会社 Laser cutting apparatus, laser cutting method, and display production method
JP2023075382A (en) * 2021-11-19 2023-05-31 Jswアクティナシステム株式会社 Laser cutting device, laser cutting method, and display manufacturing method

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