JPS5988333A - Method for working glass with laser - Google Patents

Abstract

PURPOSE:To cut accurately a liq. crystal display element from the front side to the rear side in a short time by repeatedly irradiating CO2 laser light twice on the element at prescribed beam spot diameter, pulse width, pulse rate and average output. CONSTITUTION:CO2 laser light 2 is regulated to 0.1mm. beam spot diameter on the surface of glass to be cut, 0.4ms pulse width, 20Hz pulse rate and 15W average output. The light 2 is repeatedly irradiated twice on the parts of a liq. crystal element 4 to be cut. The element 4 is formed by seal-bonding two opposite sheets of glass together. The element 4 is accurately cut from the front side to the rear side in a short time.

Description

Detailed Description of the Invention [Field of Application of the Invention] The present invention provides a through-cutting process in a desired shape to the sealed portion of a liquid crystal display element that has already been sealed by placing two sheets of glass facing each other. Regarding the precision method, there are cases where you want to make a small diameter round hole (of course, any shape is fine if necessary) near the center of the display area of a liquid crystal display element that has already been sealed. Traditionally, when machining a through hole that requires a certain number of holes, each piece, for example, was positioned on a processing table and then ground using a horn-type ultrasonic processing machine. must be supplied;
The machining time is long and automatic control is difficult.We decided to use laser machining to form a high-precision through hole in the desired shape in a short time in the receiving part (however, the area around the machined part is sealed in advance). Using a carbon dioxide laser that can easily achieve a high target output, the beam spot diameter on the workpiece glass FjiiK was set to 1 m 111°, pulse width 0.4 ms, pulse rate 20 Hz, and average output 15 W, and the workpiece was
The irradiation was repeated several times. This is because if you try to cut only once, but if you increase the laser power, micro-cracks and molten glass droplets (so-called splash) will re-deposit along the edge of the cut part, but if you repeat the irradiation twice, , there are no microcracks or splash adhesion. Because the laser irradiates the same spot twice,
The cutting width (where the glass is melted by the laser beam) is somewhat wide. Figure 1 shows the laser beam 1i12, which serves as a processing tool in the present invention-embodiment, being applied to a lens supported by the lens holder 3. From IK, the beam spot diameter is set to 0.1 on the glass plate surface of the liquid crystal display element 4 to be processed.
AV shows the state of being narrowed down to a seagull. 5 is the sacrificial allowance that occurs when a round hole is drilled. As is well known, laser processing is non-contact processing, and since the processing width is extremely narrowly limited and a very high-density energy flow is irradiated, even if the temperature of the irradiated part is raised to a high enough temperature that it melts, the required Since the time is too short, the temperature of the surrounding areas hardly rises. In other words, in laser processing, the laser light source, which is a processing tool, can be moved freely and fairly quickly with a small amount of force. Therefore, many of the recent laser processing methods are microprocessor controlled and are suitable for process automation. For example, machining a round hole for the rotating shaft of a watch hand (with a diameter of about 2 mm) can more easily be traced than by transmitting the circular motion of the XY ball screw to the lens holder 3. In conventional ultrasonic processing.

It used to take 25 seconds to process one hole, but even if the laser beam is traced twice according to the present invention, it will only take about 3 seconds at most to process a round hole of about 2111L'.

Fig. 3 1al shows the high dimensional accuracy of nine flat + fil\J processed according to the present invention, (bl is a side sectional view, 6 is a high precision and smooth cut surface obtained by the processing method of the present invention, code 4 ．．
5 is the same as in FIG. Figure 3 shows laser beam 1
The figure shows the case of machining a round hole with multiple irradiations.

+al is a plan view, and (b) is a side sectional view, in which microcracks 7 can be seen around the holes and tin lashes 8 can be reattached to the cut surfaces. As mentioned above, when the glass is irradiated twice with a laser beam, the width of the glass melting part, that is, the cutting width becomes somewhat wider, but it is sufficient to correct the NC control program in advance. In conventional ultrasonic machining, the drilling dimensional accuracy was ±0.15 times, but according to the present invention, it improved to ±Q,05 times. However, the present invention has made it possible to do this, and the process can be easily revised to 6 times.

[Brief explanation of drawings]

Figure 1 is an embodiment of the present invention, Figure 3 1al is a plan view of nine high-precision machines processed using the non-inventive trap, (b) is a side sectional view, and Figure 3 1al is processed with one laser beam irradiation. A plan view of the round hole, and (b) a side sectional view. 2...Laser light #, 3...Shi/zu holder, 4...
Liquid crystal display element, 5... Disposal allowance, 6... High precision and smooth cutting surface according to the present invention, 7... Microcratsuku, 8... Tin lash. -21 (Figure 1 Figure 2)

Claims (1)

[Claims] In laser penetration cutting of a liquid crystal display element sealing part of two sheets of thin glass facing each other and sealed, a carbon dioxide laser is used to cut the beam spot diameter +IO, 1s + m, pulse width 0.4ms, and pulse width on the glass surface to be applied. A/
A glass processing method using a laser, characterized in that 5 cut sections are repeatedly irradiated twice at a frequency of 20 Hz and an average output of 15 W.