JPS5976867A - Method for carrying out electroless copper plating - Google Patents

Method for carrying out electroless copper plating

Info

Publication number
JPS5976867A
JPS5976867A JP18835682A JP18835682A JPS5976867A JP S5976867 A JPS5976867 A JP S5976867A JP 18835682 A JP18835682 A JP 18835682A JP 18835682 A JP18835682 A JP 18835682A JP S5976867 A JPS5976867 A JP S5976867A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
soln
plating
method
electroless copper
carrying out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18835682A
Inventor
Takeshi Enokido
Takashi Hayashi
Koji Kamiyama
Kunio Kawaguchi
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Abstract

PURPOSE:To prevent the decomposition of a plating soln. and the deposition of copper particles on a part not to be plated by flowing air into the plating soln. from a porous pipe placed on the botton of a vessel contg. the soln. CONSTITUTION:A product to be plated is immersed in an electroless copper plating soln. in a vessel provided with a pipe made of porous synthetic resin on the bottom, and air is blown into the soln. from the pipe. By this method the decomposition of the plating soln. and th deposition of copper particles on an unplated part are prevented, and treatment after plating is simplified.
JP18835682A 1982-10-27 1982-10-27 Method for carrying out electroless copper plating Pending JPS5976867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18835682A JPS5976867A (en) 1982-10-27 1982-10-27 Method for carrying out electroless copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18835682A JPS5976867A (en) 1982-10-27 1982-10-27 Method for carrying out electroless copper plating

Publications (1)

Publication Number Publication Date
JPS5976867A true true JPS5976867A (en) 1984-05-02

Family

ID=16222187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18835682A Pending JPS5976867A (en) 1982-10-27 1982-10-27 Method for carrying out electroless copper plating

Country Status (1)

Country Link
JP (1) JPS5976867A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230883A (en) * 1985-07-31 1987-02-09 Hitachi Condenser Co Ltd Device for raising temperature of solution
JPS63312983A (en) * 1987-06-16 1988-12-21 Hitachi Ltd Electroless copper plating method and equipment therefor
JPH0673042U (en) * 1993-03-16 1994-10-11 田中紙管株式会社 Yarn winding grasping tool with a paper tube

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230883A (en) * 1985-07-31 1987-02-09 Hitachi Condenser Co Ltd Device for raising temperature of solution
JPS63312983A (en) * 1987-06-16 1988-12-21 Hitachi Ltd Electroless copper plating method and equipment therefor
JPH0576550B2 (en) * 1987-06-16 1993-10-22 Hitachi Ltd
JPH0673042U (en) * 1993-03-16 1994-10-11 田中紙管株式会社 Yarn winding grasping tool with a paper tube

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