JPS5974739U - integrated circuit mounting structure - Google Patents
integrated circuit mounting structureInfo
- Publication number
- JPS5974739U JPS5974739U JP1982170527U JP17052782U JPS5974739U JP S5974739 U JPS5974739 U JP S5974739U JP 1982170527 U JP1982170527 U JP 1982170527U JP 17052782 U JP17052782 U JP 17052782U JP S5974739 U JPS5974739 U JP S5974739U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- mounting structure
- circuit mounting
- contact
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は集積回路の斜視図、第2図は従来のソケットの
斜視図、第3図は第2図におけるA−A′線断面の一部
を示す図、第4図は従来例の断面図、第5図は本考案の
一実施例を示す斜視図、第6図、第7図及び第8図は本
実施例の断面図、第9図は本考案の他の実施例を構成す
るコンタクトの斜視図、第10図は第9図における中心
断面図、第11図及び第12図は本考案の他の実施例を
説明するための断面図である。
12・・・リード、51.90・・・コンタクト、52
・・・中空部、62・・・栓。Fig. 1 is a perspective view of an integrated circuit, Fig. 2 is a perspective view of a conventional socket, Fig. 3 is a partial cross section taken along line A-A' in Fig. 2, and Fig. 4 is a cross section of the conventional example. 5 is a perspective view showing one embodiment of the present invention, FIGS. 6, 7, and 8 are sectional views of this embodiment, and FIG. 9 constitutes another embodiment of the present invention. FIG. 10 is a perspective view of the contact, FIG. 10 is a central sectional view of FIG. 9, and FIGS. 11 and 12 are sectional views for explaining other embodiments of the present invention. 12...Lead, 51.90...Contact, 52
...Hollow part, 62...Plug.
Claims (1)
一端が固定され他端が前記集積回路のリードに接触しこ
の集積回路のリードと前記印刷配線板とを電気的に接続
するコンタクトとで成る集積回路実装構造において、前
記コンタクトに前記集積回路が接触している位置まで半
田が流入されている中空部が形成されていることを特徴
とする集積回路実装構造。A lead of an integrated circuit, a printed wiring board, and a contact having one end fixed to the printed wiring board and the other end contacting the lead of the integrated circuit to electrically connect the lead of the integrated circuit and the printed wiring board. An integrated circuit mounting structure comprising: a hollow portion into which solder flows up to a position where the integrated circuit is in contact with the contact;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982170527U JPS5974739U (en) | 1982-11-12 | 1982-11-12 | integrated circuit mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982170527U JPS5974739U (en) | 1982-11-12 | 1982-11-12 | integrated circuit mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5974739U true JPS5974739U (en) | 1984-05-21 |
Family
ID=30372248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982170527U Pending JPS5974739U (en) | 1982-11-12 | 1982-11-12 | integrated circuit mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5974739U (en) |
-
1982
- 1982-11-12 JP JP1982170527U patent/JPS5974739U/en active Pending
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