JPS5949940B2 - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS5949940B2
JPS5949940B2 JP52027865A JP2786577A JPS5949940B2 JP S5949940 B2 JPS5949940 B2 JP S5949940B2 JP 52027865 A JP52027865 A JP 52027865A JP 2786577 A JP2786577 A JP 2786577A JP S5949940 B2 JPS5949940 B2 JP S5949940B2
Authority
JP
Japan
Prior art keywords
polyamide resin
weight
parts
phosphite
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52027865A
Other languages
Japanese (ja)
Other versions
JPS53112953A (en
Inventor
實 鴨崎
茂 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP52027865A priority Critical patent/JPS5949940B2/en
Publication of JPS53112953A publication Critical patent/JPS53112953A/en
Publication of JPS5949940B2 publication Critical patent/JPS5949940B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は塩化ビニル系樹脂と接触した状態でのポリアミ
ド樹脂の耐熱性を向上せしめたポリアミド樹脂組成物を
用いた塩化ビニル系樹脂との複合構造物に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite structure with a vinyl chloride resin using a polyamide resin composition that improves the heat resistance of the polyamide resin when in contact with the vinyl chloride resin.

ポリアミド樹脂に耐熱性を付与せしめるため耐熱安定剤
を配合することは公知である。例えばヨウ化銅、ヨウ化
カリ、臭化カリ等のハロゲン化物や炭酸銅、硫酸銅等の
銅塩、オクタデシル3−(3’、5’ジーターシヤリブ
チル4’ヒドロキシフェニル)プロピオネート、テトラ
キスー〔メチレン−(3、5ジーターシヤリブチル4ヒ
ドロキシハイドロシンナメート)〕メタン、N、N’−
ヘキサメチレンビス(3、5−ジーターシヤリブチルー
4−ヒドロキシハイ ドロシンナマミド)等のフェノー
ル基含有機化合物が耐熱安定剤として使用される。そし
てこれらの耐熱安定剤が添加されたポリアミド樹脂は空
気中に於ては種類によつて差はあるが明らかに耐熱性は
増加する。しかしながら本発明者等は前記の如き耐熱安
定剤が添加されたポリアミド樹脂が塩化ビニル系樹脂と
接触した状態に於ては耐熱安定剤が添加されているにも
かかわらず耐熱性は全くないことを見出した。そこで本
発明者らはポリアミド樹脂が塩化ビニル系樹脂と接触し
た状態に於てもポリアミド樹脂に耐熱性を付与せしめる
方法を鋭意検討した結果、フェノール系耐熱安定剤とリ
ン含有化合物をポリアミド樹脂に添加する事によつて著
しくポリアミド樹脂の耐熱性を増加させることを見出し
本発明に到つたものである。本発明においてポリアミド
樹脂とは脂肪族ポリアミド樹脂と芳香族ポリアミド樹脂
の両者を意味し、脂肪族ポリアミド樹脂としては例えば
ナイロン6、ナイロン6・6、ナイロン6・10、ナイ
ロン11、ナイロン12、ナイロン6・12、ナイロン
6/6・6共重合物、ナイロン6/12共重合物、ナイ
ロン6/6・6/12共重合物等があげられ、又芳香族
ポリアミド樹脂としては例えばキシレンジアミンとジカ
ルボン酸の重合物(商品名SHOAMIDE◆500,
+600,+1800等)があげられる。
It is known to add a heat stabilizer to polyamide resins in order to impart heat resistance to them. For example, halides such as copper iodide, potassium iodide, and potassium bromide; copper salts such as copper carbonate and copper sulfate; -(3,5 teriyabutyl 4-hydroxyhydrocinnamate)]methane, N, N'-
Phenolic group-containing organic compounds such as hexamethylenebis(3,5-di-tarsiabutyl-4-hydroxyhydrocinnamamide) are used as heat stabilizers. The heat resistance of polyamide resins to which these heat stabilizers have been added clearly increases in air, although this varies depending on the type. However, the present inventors have discovered that when polyamide resin to which a heat-resistant stabilizer has been added as described above comes into contact with a vinyl chloride resin, it has no heat resistance at all despite the addition of the heat-resistant stabilizer. I found it. Therefore, the inventors of the present invention have intensively investigated a method of imparting heat resistance to polyamide resin even when the polyamide resin is in contact with vinyl chloride resin. As a result, the inventors have added a phenolic heat resistance stabilizer and a phosphorus-containing compound to polyamide resin. The inventors have discovered that the heat resistance of polyamide resins can be significantly increased by doing so, leading to the present invention. In the present invention, polyamide resin means both aliphatic polyamide resin and aromatic polyamide resin, and examples of aliphatic polyamide resin include nylon 6, nylon 6.6, nylon 6.10, nylon 11, nylon 12, and nylon 6.・12, nylon 6/6/6 copolymer, nylon 6/12 copolymer, nylon 6/6/6/12 copolymer, etc., and aromatic polyamide resins include, for example, xylene diamine and dicarboxylic acid. Polymer of (trade name: SHOAMIDE◆500,
+600, +1800, etc.).

一般にポリアミド樹脂とはモノマー成分がラクタム、ア
ミノ酸、或はジカルボン酸とジアミンから成り、これら
モノマーの1種から構成されるホモポリマーあるいはそ
れらの2種或は3種から構成される共重合体であるが、
本発明ではそれらの何れでもよい。本発明において使用
し得るフエノール系耐熱安定剤としてはオクタデシル3
−(3′,5′ジーターシヤリブチル4′ヒドロキシフ
エニル)プロピオネート、テトラキズ一〔メチレン一(
3,5ジターシヤリブチル4ヒドロキシハイドロシンナ
メート)〕メタン、N,N′−ヘキサメチレンビス(3
,5−ジターシヤリブチル4ヒドロキシハイドロシンナ
マミド)、ジターシヤリブチル一P−クレゾール、2,
6−ジターシヤリブチル4アルキルフエノール等の一般
にポリアミド樹脂の耐熱安定剤として使用されている化
合物があげられる。
In general, polyamide resin is a monomer component consisting of lactam, amino acid, dicarboxylic acid, and diamine, and is a homopolymer composed of one type of these monomers or a copolymer composed of two or three of these monomers. but,
In the present invention, any of them may be used. As the phenolic heat stabilizer that can be used in the present invention, octadecyl 3
-(3',5' teriyabutyl 4' hydroxyphenyl)propionate, tetra-scratch [methylene-(
3,5 ditertyabutyl 4 hydroxyhydrocinnamate)] methane, N,N'-hexamethylene bis(3
, 5-ditertyabutyl 4-hydroxyhydrocinnamamide), ditertyabutyl-P-cresol, 2,
Examples include compounds commonly used as heat stabilizers for polyamide resins, such as 6-ditertyabutyl 4-alkylphenol.

又リン含有化合物としてはリン酸、トリラウリルホスフ
アイト、フエニルジイソデシルホスフアイト、トリス(
ノニルフエニル)ホスフアイト、ジフエニルイソデシル
ホスフアイト、トリフエニルホスフアイト等があげられ
る。本発明によればポリアミド樹脂100重量部に対し
て上記の如きフエノール系耐熱安定剤0.1〜2.0重
量部及びリン含有化合物0.05〜2.0重量部を配合
せしめる事によつて塩化ビニル系樹脂と接触したポリア
ミド樹脂の耐熱性を著しく向上さ.せることが出来る。
In addition, phosphorus-containing compounds include phosphoric acid, trilauryl phosphite, phenyl diisodecyl phosphite, and tris(
Nonylphenyl) phosphite, diphenylisodecyl phosphite, triphenyl phosphite, and the like. According to the present invention, by blending 0.1 to 2.0 parts by weight of the above-described phenolic heat stabilizer and 0.05 to 2.0 parts by weight of the phosphorus-containing compound to 100 parts by weight of the polyamide resin. Significantly improves the heat resistance of polyamide resin in contact with vinyl chloride resin. It is possible to

すなわち。本発明は密接な関係にある塩化ビニル系樹脂
とポリアミド樹脂とからなる複合構造物において、前記
ポリアミド樹脂として、ポリアミド樹脂100重量部に
フエノール系耐熱安定剤0.1〜2.0重量部とリン含
有化合・物0.05〜2.0重量部を配合せしめてなる
ものを用いることを特徴とする複合構造物である。この
様な塩化ビニル樹脂とポリアミド樹脂とが接触する構造
物としては例えば、電気毛布、電気カーペツト、電気敷
布等の発熱体に用いられている被覆竜熱線や熱感応性素
子が挙げられる。被覆電熱線としてはヒーター線をポリ
アミド樹脂で被覆し、更に塩化ビニル樹脂で被覆したも
のである。
Namely. The present invention provides a composite structure consisting of a vinyl chloride resin and a polyamide resin, which are closely related to each other. This is a composite structure characterized by using a compound containing 0.05 to 2.0 parts by weight of a compound/substance. Examples of structures in which the vinyl chloride resin and the polyamide resin are in contact include coated dragon heat wires and heat-sensitive elements used in heating elements such as electric blankets, electric carpets, and electric sheets. The coated heating wire is a heater wire coated with polyamide resin and further coated with vinyl chloride resin.

又熱感応性素子としては、例えば第1図に示すようなも
ので、芯線1、ヒーター2、感熱体3、信号導体4及び
外被5から構成されているものであつて、外被5として
塩化ビニル系樹脂を用いた場合、感熱体3としては、本
発明のポリアミド樹脂組成物が好適に用いられる。これ
らの構造物においては塩化ビニル樹脂とポリアミド樹脂
とが直接接触するため、塩化ビニル樹脂からの直接の影
響によりポリアミド樹脂の劣化が促進されるものと考え
られるが、本発明の耐熱安定剤の組合せにより、ポリア
ミド樹脂に充分な耐熱安定件が賦興されるので、本発明
のポリアミド樹脂組成物を使用することにより、耐熱注
のすぐれた構造物を得ることが出来る。実施例 1 ナイロン12100重量部に対してテトラキズ一〔メチ
レンビス(3,5ジターシヤリブチル4ヒドロキシハイ
ドロシンナメート)〕メタン(商品名RganOxlO
lO)1重量部及びトリラウリルホスフアイト0.5重
量部をミキサーにより十分混合した後、二軸押出機によ
り溶融混合した。
The heat-sensitive element is, for example, as shown in FIG. 1, and is composed of a core wire 1, a heater 2, a heat sensitive element 3, a signal conductor 4, and a jacket 5. When a vinyl chloride resin is used, the polyamide resin composition of the present invention is suitably used as the heat sensitive member 3. In these structures, the vinyl chloride resin and the polyamide resin are in direct contact with each other, so it is thought that the direct influence of the vinyl chloride resin accelerates the deterioration of the polyamide resin. As a result, sufficient heat resistance stability is imparted to the polyamide resin, and therefore, by using the polyamide resin composition of the present invention, a structure with excellent heat resistance can be obtained. Example 1 To 12,100 parts by weight of nylon, tetra-scratch [methylenebis(3,5 ditertiarybutyl 4-hydroxyhydrocinnamate)]methane (trade name RganOxlO) was added.
1 part by weight of lO) and 0.5 part by weight of trilauryl phosphite were thoroughly mixed in a mixer and then melt-mixed in a twin-screw extruder.

この混合物を射出成形機にてJISl号タンペル片に成
形し、このタンペル片を厚さ1詣の塩化ビニル樹脂(プ
ラステタ社製商品名ポリピン2628)でサンドイツチ
状に両面をつつみ、120℃のギヤーオーブン中で加熱
試験を行つた。試験方法としては試験片を恒温恒湿(2
0℃6570RH)中で1日間放置した后、テレシロン
UTM−1を用いて50正/分の引張り速度で強度及び
伸度を測定した。各時間加熱后のポリアミド樹脂の引張
り破断点強伸度を測定したが、1000時間経過后強度
、伸度の両者共殆んど変化しなかつた。比較例 1 実施例1と同様な混合手法によりIrganOxlOl
Oのみをナイロン12100重量部に対して1重量部添
加した組成物をつくり、実施例1と同様に試験片を作成
し、実施例1と同様な方法で加熱劣化試験を行つた所、
700時間までは殆んど変化がなかつたが、1000時
間経過后、強度、伸度共急激に低下し、強度は40%程
度、又伸度は10%程度になつた。
This mixture was molded into a JIS No. tampel piece using an injection molding machine, and the tampel piece was wrapped on both sides in a sandwich-like pattern with a polyvinyl chloride resin (product name: Polypin 2628, manufactured by Plasteta) with a thickness of 1 inch, and then heated in a gear oven at 120°C. A heating test was conducted inside. The test method is to keep the test piece at constant temperature and humidity (2
After standing for one day at 0° C., 6570 RH), strength and elongation were measured using Telesilon UTM-1 at a tensile rate of 50 mm/min. The tensile strength and elongation at break of the polyamide resin after heating for each time were measured, and both the strength and elongation hardly changed after 1000 hours. Comparative Example 1 IrganOxlOl was mixed using the same mixing method as in Example 1.
A composition was prepared in which only 1 part by weight of O was added to 12,100 parts by weight of nylon, test pieces were prepared in the same manner as in Example 1, and a heat deterioration test was conducted in the same manner as in Example 1.
There was almost no change up to 700 hours, but after 1000 hours, both the strength and elongation decreased rapidly, and the strength was about 40% and the elongation was about 10%.

このことより接触する場合に於ては、フエノール基含有
耐熱安定剤のみの場合とフエノール基含有耐熱安定剤と
リン化合物との混合安定剤を用いる場合とでは著しい差
があり、本発明による後者の場合の方が著しく効果があ
ることが明らかである。実施例 2 ナイロン11100重量部に対してN,N′−ヘキサメ
チレンビス(3,5−ジーターシヤリブチル一 4 −
ヒドロキシハイ ドロシンナマミド)(商品名Irga
nOxlO98)0.5重量部及びリン酸0.5重量部
を実施例1と同様な手段で混合し、更に同様な方法によ
り加熱劣化試験を行つた所、実施例1の組成物と同様に
塩化ビニル樹脂と接触下での耐熱性は優れていた。
Therefore, in the case of contact, there is a significant difference between the case of using only a phenol group-containing heat-resistant stabilizer and the case of using a mixed stabilizer of a phenol-containing heat-resistant stabilizer and a phosphorus compound. It is clear that this case is significantly more effective. Example 2 N,N'-hexamethylene bis(3,5-di-tarsiabutyl-4-
Hydroxyhydrocinnamamide) (trade name: Irga)
When 0.5 parts by weight of nOxlO98) and 0.5 parts by weight of phosphoric acid were mixed in the same manner as in Example 1 and a heat deterioration test was conducted in the same manner, chloride was observed in the same manner as in the composition of Example 1. The heat resistance in contact with vinyl resin was excellent.

実施例 3 芳香族ポリアミド樹脂(商品名SHOAMIDE゛50
0)100重量部にIrganOxlO98O.5重量
部及びフエニルジイソデシルホスフアイト0.5重量部
を実施例1と同様な方法により混合し、得られた組成物
について同様な方法で加熱劣化試験を行つた所、実施例
1と同様な優れた結果が得られた。
Example 3 Aromatic polyamide resin (trade name SHOAMIDE゛50
0) 100 parts by weight of IrganOxlO98O. 5 parts by weight and 0.5 parts by weight of phenyl diisodecyl phosphite were mixed in the same manner as in Example 1, and the resulting composition was subjected to a heat deterioration test in the same manner as in Example 1. Excellent results were obtained.

実施例 4 実施例1又は比較例1のポリアミド樹脂組成物を用い、
第1図の熱感応性素子を作つた。
Example 4 Using the polyamide resin composition of Example 1 or Comparative Example 1,
The heat-sensitive element shown in Figure 1 was made.

熱感応性素子は、芯線をポリエステル繊維で、ヒーター
及び信号線を銅で、外被を塩化ビニル樹脂で構成した。
The heat-sensitive element had a core wire made of polyester fiber, a heater and signal wire made of copper, and an outer jacket made of vinyl chloride resin.

この熱感応性素子について150℃で加熱劣化試験を行
ない、1回の屈曲での折れ時間を測定した。その結果比
較例1で作成したものは145時間であつたのに対して
、本発明の場合(実施例1)は170時間であり優れて
いた。
A heating deterioration test was conducted on this heat-sensitive element at 150° C., and the bending time for one bending was measured. As a result, the time required for the one prepared in Comparative Example 1 was 145 hours, whereas the time required for the present invention (Example 1) was 170 hours, which was excellent.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は塩化ビニル樹脂とポリアミド樹脂とが接触する
構造物の例としでの感応性素子を例示する一部切欠側面
図である。 3・・・・・・感熱体、5 ・・・・・・外被。
FIG. 1 is a partially cutaway side view illustrating a sensitive element as an example of a structure in which a vinyl chloride resin and a polyamide resin are in contact with each other. 3...Thermosensitive body, 5...Outer cover.

Claims (1)

【特許請求の範囲】 1 密接な関係にある塩化ビニル系樹脂とポリアミド樹
脂とからなる複合構造物において、前記ポリアミド樹脂
として、ポリアミド樹脂100重量部にオクタデシル3
−(3′,5′ジ−ターシヤリブチル4′ヒドロキシフ
ェニル)プロピオネート、テトラキス−〔メチレン−(
3′5ジターシヤリブチル4ヒドロキシハイドロシンナ
メート)〕メタン、N,N′−ヘキサメチレンビス(3
,5−ジターシヤリブチル4ヒドロキシハイドロシンナ
マミド)、ジターシヤリブチル−P−クレゾール及び2
,6−ジターシヤリブチル4アルキルフェノールからな
る群から選ばれたフェノール系耐熱安定剤0.1〜2.
0重量部とリン酸、トリラウリルホスファイト、フェニ
ルジイソデシルホスファイト、トリス(ノニルフェニル
)ホスファイト、ジフェニルイソデシルホスファイト及
びトリフェニルホスファイトからなる群から選ばれたリ
ン含有化合物0.05〜2.0重量部を配合せしめてな
るものを用いることを特徴とする複合構造物。
[Scope of Claims] 1. In a composite structure consisting of a vinyl chloride resin and a polyamide resin, which are closely related to each other, as the polyamide resin, octadecyl 3 is added to 100 parts by weight of the polyamide resin.
-(3',5' di-tertiary butyl 4' hydroxyphenyl) propionate, tetrakis-[methylene-(
3'5 ditertyabutyl 4 hydroxyhydrocinnamate)] methane, N,N'-hexamethylene bis(3
, 5-diterthyabutyl-4-hydroxyhydrocinnamamide), ditertiarybutyl-P-cresol and 2
, 6-ditertyabutyl 4-alkylphenol 0.1-2.
0 parts by weight and 0.05 to 2 parts by weight of a phosphorus-containing compound selected from the group consisting of phosphoric acid, trilauryl phosphite, phenyl diisodecyl phosphite, tris(nonylphenyl) phosphite, diphenylisodecyl phosphite and triphenyl phosphite. A composite structure characterized by using a compound containing .0 parts by weight.
JP52027865A 1977-03-14 1977-03-14 Polyamide resin composition Expired JPS5949940B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52027865A JPS5949940B2 (en) 1977-03-14 1977-03-14 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52027865A JPS5949940B2 (en) 1977-03-14 1977-03-14 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS53112953A JPS53112953A (en) 1978-10-02
JPS5949940B2 true JPS5949940B2 (en) 1984-12-05

Family

ID=12232786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52027865A Expired JPS5949940B2 (en) 1977-03-14 1977-03-14 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS5949940B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4540727A (en) * 1982-10-29 1985-09-10 Raychem Corporation Polyamide compositions
JPH0218807A (en) * 1988-07-05 1990-01-23 Hitachi Cable Ltd Insulated wire

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929339A (en) * 1972-07-18 1974-03-15
JPS50110452A (en) * 1974-02-13 1975-08-30
JPS51127151A (en) * 1975-04-30 1976-11-05 Toray Ind Inc Thermostable polyamide composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929339A (en) * 1972-07-18 1974-03-15
JPS50110452A (en) * 1974-02-13 1975-08-30
JPS51127151A (en) * 1975-04-30 1976-11-05 Toray Ind Inc Thermostable polyamide composition

Also Published As

Publication number Publication date
JPS53112953A (en) 1978-10-02

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