JPS5931427A - Filling method of silicone resin in sensor part - Google Patents
Filling method of silicone resin in sensor partInfo
- Publication number
- JPS5931427A JPS5931427A JP14127682A JP14127682A JPS5931427A JP S5931427 A JPS5931427 A JP S5931427A JP 14127682 A JP14127682 A JP 14127682A JP 14127682 A JP14127682 A JP 14127682A JP S5931427 A JPS5931427 A JP S5931427A
- Authority
- JP
- Japan
- Prior art keywords
- silicone resin
- resin
- filling
- thermistor
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Abstract
Description
【発明の詳細な説明】
本発明は湯部感知や湯度感知に使用さｈるセンサ一部の
シリコ−Ｊ樹脂の充填方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for filling a part of a sensor used for sensing a hot water portion or a hot water temperature with Silico-J resin.
従来よりｍ源感知や湯度感知に使用されているサーミス
タはその回りをシリコシ樹脂で禎餉して使用の際にサー
ミスタが湿気や水分等からＲＩＣ影瞥金堂けないように
保設するこＬが行なわれている。そこで、サーミスタを
シリコン樹脂りで被照するにあたっては、従来では第１
図に示すように、金属ケース、樹脂チューづ、樹脂ケー
ス等から成る収納ケース（４）内にリード線＋１１の先
部に収付けられ次す−三スタ（２）を配設し、その状態
で収納ケース（４）内にシリコシ樹脂（６）を充填して
硬化させる方法が一般にとられている。しかし乍ら、こ
の方法にあってはシリコン樹脂（６）を収納ケース（４
）内に充填する際に、リード線ｆｌ＋の扱稼層と銅線（
７）との間に存在している空気がシリコシ樹脂（６）に
押し出されて樹脂（６）中に気泡（８）として残るとい
う問題があり、シリコシ樹脂（６）の内部に気泡（８）
が残ると、温度を測定する際に気泡（８）が膨張、収縮
を繰り返して樹脂（６）層が剥離したり、しいては湿気
を、吸ってサーミスタ（２）の信頼性を低下させるとい
う欠点があった。Thermistors conventionally used for source detection and hot water temperature detection should be protected by coating their surroundings with silicone resin to prevent the thermistors from becoming exposed to humidity or moisture during use. is being carried out. Therefore, when covering a thermistor with silicone resin, conventionally the first step was to cover it with silicone resin.
As shown in the figure, a -3 star (2) which is housed at the tip of the lead wire +11 is arranged in a storage case (4) consisting of a metal case, resin tube, resin case, etc. Generally, a method is used in which the storage case (4) is filled with silicone resin (6) and cured. However, with this method, the silicone resin (6) cannot be placed in the storage case (4).
) When filling the lead wire fl+ handling layer and copper wire (
There is a problem that the air existing between the silicone resin (6) and the silicone resin (6) is pushed out and remains as air bubbles (8) in the resin (6).
If this remains, the bubbles (8) will expand and contract repeatedly during temperature measurement, causing the resin (6) layer to peel off or absorb moisture, reducing the reliability of the thermistor (2). There were drawbacks.
本発明は上記の点に鉱ｉみて成されたものであって、気
泡を含むことなくシリコン樹脂を充填することができる
センサ一部のシリコン樹脂の′ｆ填方法を提供するどと
を目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a method for filling a part of a sensor with silicone resin, which can be filled with silicone resin without containing air bubbles. It is something to do.
すなわち、本発明はり一ド＃ｉｌ ＋１１の先部に取付
けられたサーミスタ（２）を被覆用のシリコン樹脂（３
）で被覆してこのシリコン樹脂（３）を硬化させた後、
サーミスタ（２）を収納ケース（４）内に挿入配設し次
状態で収納ケース（４）内に充填用のシリコン樹脂（５
）を充填硬化せしめることを特徴とするセンサ一部のシ
リコン樹脂の充填方法により上記目的を達成したもので
ある。That is, the thermistor (2) attached to the tip of the beam #il +11 of the present invention is coated with a silicone resin (3).
) and cure this silicone resin (3),
Insert the thermistor (2) into the storage case (4), and then insert the silicone resin (5) for filling into the storage case (4).
) The above object has been achieved by a method of filling silicone resin in a part of the sensor, which is characterized by filling and curing silicone resin.
以下本発明を実施例により詳述する。リード線＋１１の
先部に収付けられたり−三スタ（２）を捷ず初めに被搭
用のシリコニア樹脂（３）で扱拐する。この扱抹用のシ
リコン樹脂に（）は低粘度なものの方が好捷しく、シリ
コン樹脂（３）をリード線（１）の扱１１層と銅線（７
）きの間に毛細個ｉ現象等で央深く浸透させ、またリー
ド線（１）及びサーミスタ（２）の表面に良好に湿潤さ
せることができてそれらの間に存在している空気をおい
出すことができるものである。Ｍ Ｊ％ｉ用のシリコン
（耐脂（３）をサーミスタ（２）の回１３に被〜するに
あたっては、サーミスタ（２）をシリコ−Ｊ樹脂ｆ３１
の液中に浸亀するようにしたり、あるいはへヶ等でシリ
コン樹脂（３）をサーミスタ（２）の回りに塗布するよ
うにしたりする等各種方法で行なうことができる。次に
被援用のシリコン樹脂（３）を硬化させた後、シリコ−
）４Ｍ脂（３）で被掬され次サーミスタ（２）を金属ケ
ース、樹脂チューブ、樹脂ケース等の収納ケース（ｌｌ
’Ｊに挿入配置し、この状態で次に、収納ケースＩ４）
内に充填用のシリコニア樹脂（６）を充填して硬化させ
る。充填用のシリコン樹脂（５）は収納ケース（４）か
ら流れ出ないように高粘度のものを使用するのが好まし
い。The present invention will be explained in detail below with reference to Examples. The -3 star (2), which is housed at the tip of the lead wire +11, is not removed, but is first handled with silicone resin (3). It is better to use a low viscosity silicone resin () for handling this, and the silicone resin (3) is used for handling the lead wire (1) with 11 layers and the copper wire (7
) Penetrates deeply into the center by capillary phenomenon etc. between the gaps, and can moisten the surfaces of the lead wire (1) and thermistor (2) well, expelling the air existing between them. It is something that can be done. When covering the thermistor (2) with silicone (grease resistant (3)) for M
This can be done in various ways, such as by immersing it in a liquid, or by applying silicone resin (3) around the thermistor (2) using a spatula or the like. Next, after curing the silicone resin (3) for support,
) The thermistor (2) is scooped with 4M fat (3) and placed in a storage case (ll) such as a metal case, resin tube, or resin case.
'J, and in this state, next, storage case I4)
A silicone resin (6) for filling is filled inside and hardened. It is preferable to use a high-viscosity silicone resin (5) for filling so that it does not flow out of the storage case (4).
しかして、このように初めに被覆用のシリコシ樹脂（３
）でリード線＋１＋の先部に取付けられたサーミスタ（
２）をｍｓすることにより、シリコン樹脂（３）がリー
ｌ−線（１１の被和層と銅線（７）との間やリード線（
ｔｌとサーミスタ（２）との間等に入り込んで、それら
の間に存在する空気を追い出すことができるものであり
、殊に低粘度のシリコン樹脂（３）を使用すれば、毛細
管現象等で奥深くまでシリコン樹脂（３）が浸透してリ
ード線＋ｌ）の被覆層と銅線（７）との間に存在する微
細な空気をも追い出すことができるものである。被援用
のシリコン樹脂（３）で検器されたサーミスタ（２）の
外形は第２図に示すように空気を含むような微細な小孔
もなく、従って次に第３図に示すように収納ケース（４
）内にこのサーミスタ（２）を配設置７て充填用のシリ
コン樹脂（６）を充填することにより、充填用のシリコ
シ樹脂（５）で空気が残ることなく扱咎用シリコン横用
）（３）の回りを〜つて収納ケース（４）内を充填する
こＬができるものである。However, in this way, silicone resin for coating (3
) attached to the tip of the lead wire +1+.
2), the silicone resin (3) is formed between the lead wire (11) and the copper wire (7) and the lead wire (
It can get into between the tl and thermistor (2) and expel the air that exists between them. Especially if low viscosity silicone resin (3) is used, it can penetrate deep due to capillary action etc. The silicone resin (3) penetrates up to the point where it can expel even the minute air present between the coating layer of the lead wire +l) and the copper wire (7). As shown in Figure 2, the thermistor (2) tested with silicone resin (3) has no small holes that may contain air, so it is then stored as shown in Figure 3. Case (4
) by arranging this thermistor (2) in 7 and filling it with silicone resin (6), the silicone resin (5) can be used horizontally for handling without leaving any air in the silicone resin (5) for filling. ) can be used to fill the inside of the storage case (4).
上記のように零介用は、リード＋ｐの先部ｒ（取付けら
れたサーミスタを被懐用のシリコン樹脂で被ルしてこの
シリ］）ｌ枝（掛ｒを硬化させｆ７Ｌ後、サーミスタを
１４７紀ケース内に挿入配設した状態で収納ケース内に
充勾ｌ用のシリコン樹脂を充填硬化せしめたので、級す
用のシリ］、７伺脂をリード料Ｉの被覆ｈ′４と（回部
’、ｌ！：の間の小孔にｔ毛透させ１ζす、サーミスタ
や鉛ｌ糾の回りを桧釉することによりこれらの間に存在
する空気を完全におい出すことができ、またそのため収
納ケース内に充填用シリコン樹脂を充填する１端にも内
部に気泡が残るとさかないものであり、従って内部に気
泡が残ることなくサーミスタの回りにシリコ′ＪｌｆＨ
脂を充填することができて、気泡の存在によって起こる
膨張、成豚・を防止して樹脂の剥１１［ｆを防ぐと共に
樹脂層の防水性を上げてサーミスタの信頼性を゛向上す
ることができ、また温度サイクルを受ける高湿度雰囲気
中でも支障なく使用することができるものである。As mentioned above, for Reisuke, the tip r of the lead +p (cover the attached thermistor with the silicone resin to be used) and the l branch (after hardening the hook r and f7L, attach the thermistor to 147 Since the storage case was filled with silicone resin for filling and hardening while the silicone resin was inserted into the storage case, the silicone resin for grading] and 7 resin were applied to the coating h'4 of lead material I and (resin). By letting the hair pass through the small holes between parts' and l!, and applying cypress glaze around the thermistor and lead l!, the air existing between them can be completely expelled, and therefore the storage If air bubbles remain inside the case at one end where the filling silicone resin is filled, it will not survive.
It can be filled with fat, prevent expansion and maturation caused by the presence of air bubbles, prevent peeling of the resin, and improve the reliability of the thermistor by increasing the waterproofness of the resin layer. It can also be used without any problem even in a high humidity atmosphere that is subjected to temperature cycles.
第１図は従来例の要部１ｔ／ｉ面図、第２図は本発明一
実施例の要部側面図、第３図は同上の要部断面図である
。
ｉｌｌはリード辞Ｉ、＋２１はり一三スタ、（３）は抜
上愛用のシリコン樹脂、（４）は収納ケース１．（５１
ｉ寸充填用のシリコン樹脂である。
代理人 弁理士 石 ［Ｈ長 七FIG. 1 is a 1t/i side view of the main part of a conventional example, FIG. 2 is a side view of the main part of an embodiment of the present invention, and FIG. 3 is a sectional view of the main part of the same. ill is lead letter I, +21 beam is three stars, (3) is Nukijo's favorite silicone resin, (4) is storage case 1. (51
This is a silicone resin for i-size filling. Agent Patent Attorney Ishi [H-cho 7]
Claims (1)
スタを扱稜用のシリコシ樹脂で被株してこのシリコシ樹
脂を硬化させた後、サーミスタを収納ケース内に配設し
た状態で収納ケース内に充填用のシリコン樹脂を充填硬
化せしめることを特徴とするセンサ一部のシリコ、／４
射脂の充填力法。(After covering the thermistor with the tip of the lead wire K A part of silicone sensor characterized by filling and hardening silicone resin for filling, /4
Filling force method for emery resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127682A JPS5931427A (en) | 1982-08-14 | 1982-08-14 | Filling method of silicone resin in sensor part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14127682A JPS5931427A (en) | 1982-08-14 | 1982-08-14 | Filling method of silicone resin in sensor part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5931427A true JPS5931427A (en) | 1984-02-20 |
Family
ID=15288121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14127682A Pending JPS5931427A (en) | 1982-08-14 | 1982-08-14 | Filling method of silicone resin in sensor part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931427A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0221348A2 (en) * | 1985-10-02 | 1987-05-13 | Omron Tateisi Electronics Co. | A thermometer probe |
| JPH01233334A (en) * | 1988-03-15 | 1989-09-19 | Matsushita Electric Ind Co Ltd | Temperature sensor |
| JPH0365937U (en) * | 1989-10-31 | 1991-06-26 | ||
| JPH0552669A (en) * | 1991-08-26 | 1993-03-02 | Technol Seven Co Ltd | Temperature sensor |
| JP2016152263A (en) * | 2015-02-16 | 2016-08-22 | 三菱マテリアル株式会社 | Resin sealing type electronic component |
| JP2022544658A (en) * | 2020-06-17 | 2022-10-20 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト | sensor |
-
1982
- 1982-08-14 JP JP14127682A patent/JPS5931427A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0221348A2 (en) * | 1985-10-02 | 1987-05-13 | Omron Tateisi Electronics Co. | A thermometer probe |
| JPH01233334A (en) * | 1988-03-15 | 1989-09-19 | Matsushita Electric Ind Co Ltd | Temperature sensor |
| JPH0365937U (en) * | 1989-10-31 | 1991-06-26 | ||
| JPH0552669A (en) * | 1991-08-26 | 1993-03-02 | Technol Seven Co Ltd | Temperature sensor |
| JP2016152263A (en) * | 2015-02-16 | 2016-08-22 | 三菱マテリアル株式会社 | Resin sealing type electronic component |
| JP2022544658A (en) * | 2020-06-17 | 2022-10-20 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト | sensor |
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