JPS5929064U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5929064U JPS5929064U JP12279982U JP12279982U JPS5929064U JP S5929064 U JPS5929064 U JP S5929064U JP 12279982 U JP12279982 U JP 12279982U JP 12279982 U JP12279982 U JP 12279982U JP S5929064 U JPS5929064 U JP S5929064U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- substrate
- circuit element
- display layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の印刷配線基板１の平面図、
第２図は第１図に示された印刷配線基板１の一部を拡大
して示すとともに回路素子４を示す斜視図、第３図は第
１図の切断面線■−■から見た断面図、第４図は本考案
の他の実施例の断面図、第５図は本考案のさらに他の実
施例の印刷配線基板の一部の拡大斜視図、第６図は本考
案の他の実施例の斜視図である。
１・・・印刷配線基板、２・・・基板、３．３ａ、 ３
ｂ・・・配線パターン、４・・・回路素子、５．７・・
・表示層、６・・・接着剤。FIG. 1 is a plan view of a printed wiring board 1 according to an embodiment of the present invention.
2 is an enlarged perspective view of a part of the printed wiring board 1 shown in FIG. 1 and also shows the circuit element 4, and FIG. 3 is a cross section taken along the cutting plane line ■-■ in FIG. 4 is a sectional view of another embodiment of the present invention, FIG. 5 is an enlarged perspective view of a part of a printed wiring board of still another embodiment of the present invention, and FIG. 6 is a sectional view of another embodiment of the present invention. It is a perspective view of an example. 1...Printed wiring board, 2...Substrate, 3.3a, 3
b... Wiring pattern, 4... Circuit element, 5.7...
-Display layer, 6...adhesive.
Claims (1)
が設けられる位置に、その基板表面の色とは異なる色を
有しかつ回路素子の基板表面上への投影形状とほぼ同一
の形状を有する表示層を形成し、この表示層上にほぼ透
明である接着剤を付着したことを特徴とする印刷配線基
板。A chip-shaped circuit element is provided at a position on one surface of a substrate on which printed wiring is provided, and has a color different from that of the surface of the substrate and a shape that is approximately the same as the projected shape of the circuit element on the surface of the substrate. 1. A printed wiring board, comprising: a display layer formed thereon; and a substantially transparent adhesive adhered onto the display layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12279982U JPS5929064U (en) | 1982-08-12 | 1982-08-12 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12279982U JPS5929064U (en) | 1982-08-12 | 1982-08-12 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5929064U true JPS5929064U (en) | 1984-02-23 |
Family
ID=30280548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12279982U Pending JPS5929064U (en) | 1982-08-12 | 1982-08-12 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929064U (en) |
-
1982
- 1982-08-12 JP JP12279982U patent/JPS5929064U/en active Pending
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